ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M....

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References: M. Smith, Application Specific Integrated Circuits, Chap. 16 Cadence Virtuoso User Manual ASIC Physical Design Top-Level Chip Layout

Transcript of ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M....

Page 1: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

References: • M. Smith, Application Specific Integrated

Circuits, Chap. 16• Cadence Virtuoso User Manual

ASIC Physical DesignTop-Level Chip Layout

Page 2: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Top-level IC design process Typically done before individual circuit block layouts Top-level netlists usually created before any layout

Create top-level schematic “Components” are functional blocks and I/O pads Blocks include IP and user-created modules

Create a chip “floor plan” from the schematic Place functional blocks and I/O pads Connections shown as overflows

Route top-level connections (automatic or interactive) Eliminate overflows, DRC errors, shorts Create layouts of user-designed modules

Page 3: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Chip floorplan I/O pads

Page 4: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Modulo-7 counter in pad frame

Page 5: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Floorplanning (Smith text chap. 15, 16) Floorplanning: arrange major blocks prior to detailed layout

to optimize chip area input is a netlist of circuit blocks (hierarchical) after system “partitioning” into multiple ICs

estimate layout areas, shapes, etc. Flexible blocks – shape can be changed Fixed block – shape/size fixed

do initial placement of blocks (keep highly-connected blocks close)

decide location of I/O pads, power, clock

Page 6: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Floorplan a cell-based IC (Fig. 16.6)- may have to fit into “die cavity” in a package

Initialrandomfloorplan

Heavycongestionbelow B

Blocks moved to improvefloorplan

Reducedcongestionafterchanges

Page 7: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Congestion analysis (Fig. 16.7)

Change A & C to reduce congestion

Congestion map

Trial floorplans

Channeldensity

Initial 2:1.5die aspectratio

Altered to 1:1 aspectratio

A & B resized to reduce congestion

Page 8: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Routing a T junction

Preferred Constraining

Page 9: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Define channel routing order

•Make “cuts” (slice in two) to separate blocks•Slicing tree, corresponding to sequence of cuts,determines routing order for channels

- route in inverse order of cuts

Page 10: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Non-slicing structure

Cyclic constraintprevents channelrouting

Cannot find slicing floorplanwithout increasingchip area

Slicing floorplanpossible, but inefficient in useof chip area

Page 11: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Power distribution

Option a:m1 for VSSm2 for VDD---------Potentialproblems inrouting channel

Uses special power pads, wires, routingOption b:m1 parallel tolongest side---------------Easier routingbut more vias

Many layerchanges/viasif VDD/VSSon different layers

Array of viacontacts forVDD/VSSBuses.

Page 12: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Clock distribution (minimize skew)

Often use“clock tree”structure

Page 13: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

MOSIS SCMOS Pad Library Includes 6 pad types: Input & output pads with buffers VDD & GND pads with ESD Analog IO pad with ESD Analog reference pad with ESD

Assemble into a “frame” in which pads butt against each other Allows VDD & GND wires to form a continuous ring Special “spacer” and “corner” pads complete the ring

ADK tools will generate a pad frame from a schematic

Page 14: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

MOSISTSMC 0.35umHi-ESD Pad Frame

(l) lambda=0.30um

543214039383736

Tiny ChipPin #’s

26 27 28 29 30 31 32 33 34 35

16171819202122232425

15 14 13 12 11 10 9 8 7 6

Page 15: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

MOSISTSMC 0.35umHi-ESD Pad Frame

Physical layout

Corner pad(passes VDD/GND)

VDD/GNDwires form continuousring throughthe pad frame

Spacer padif no signal

Page 16: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

MOSIS I/O Pad Schematic

Bonding Pad

Inputs to logic ckts

Outputsfrom logic ckts

Outputenable

Page 17: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Simplified pad circuit

Page 18: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

MOSIS 1.6 um bidirectional pad

Source:Weste,“CMOSVLSIDesign”

To Core

Page 19: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

ASIC frame + core in Virtuoso

Process:

1. Create “core” block

2. Create pad frame

3. Connect them

Page 20: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Top-level bottom-up design process Generate block layouts and for each block: Import the GDSII (or DEF) stream into a Virtuoso library Import the Verilog netlist into the library Perform DRC and LVS on each block until “clean” Create a schematic symbol from the netlist in the library

Create a block diagram/schematic in Virtuoso “Composer” Create a library for the top-level circuit block and create a

schematic view Instantiate schematic symbols from the library Interconnect with nets and add pins Check and save

Create a layout from the schematic diagram

Page 21: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Top-level block schematic in “Composer”

Page 22: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Before module and I/O placement

Blocks initiallyoutsideboundary

Page 23: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

After placing modules and pins

Page 24: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Power routing between blocks

Connectpowerrings

Page 25: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Nets shown as “overflows”

Page 26: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Routed circuit block

Page 27: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Block symbol (to connect to I/O pads)

Page 28: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Pad frame with signal wires

Page 29: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Zoomed view of pad frame

Page 30: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Schematic: block + pad frame

Page 31: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Placement of frame and core

Page 32: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Power/ground routed manually

Page 33: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

Before signal routing

Page 34: ASIC Physical Design Top-Level Chip Layoutnelson/courses/elec5250_6250/slides...References: • M. Smith, Application Specific Integrated Circuits, Chap. 16 • Cadence Virtuoso User

After routing – final layout