ARM in competition with x86 on COM solutions
Transcript of ARM in competition with x86 on COM solutions
ARM in competition with x86 on COM solutions
ICC Media, July 2014Gerhard SzczukaPortfoliomanager COM, SBC, Motherboards, PC104
The pulse of innovation- 2
On the way to a complete solution
Carrier BoardB-plus SMARCpico-Carrier
FPGA, ASICs,…
BIOS, Firmware,…
Operating System
GUI, Application
Drivers
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Computer-on-ModuleKontron SMARC-sAMX6i
ServicesSoftwarePlatforms
Silicon
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Parallel TFT display bus MIPI display interface
Camera interfacesMultiple SPI links
Multiple SDIO interfacesNo bulky therma solution
Many USB (8 lanes)Lots of PCI Express (6 lanes)PCI Express graphics (16 lanes)LPC (an x86 only bus)…..and more
Key Feature Differences
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AR
M +
X86
+
Designed for mobility» Mobile / portable application requirements
» Housing constraints» Feature set» Thermal limits» Power / battery life
» ARM processor based & optimized for low-power mobile apps
ARM COM Designs requires fewer pins and lower cost power circuitry
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» Powerfull SoC with comparable feature sets
» Second and third source for a previous proprietary industry
» ARM SOC offers largely unknown features than x86
» ARM processor based & optimized for low-power mobile apps
» COM Express® pin-out is optimized for x86 features» Q7 is originally developed for x86» nanoRisc represent a ARM module concept» SMARC is developed specialy for ARM purposes
Why ARM on standardized COM?
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The pulse of innovation
Standardized COM for X86 and ARM Designs
Module Pins Size Area Vin
nanoRISC 230 pins 70 mm x 50 mm 3500 mm2 5V
SMARC™ (short) 314 (285) pin 82 mm x 50 mm 4100 mm2 3.0 – 5.25V
COM Express Mini 220 pin 84 mm x 55 mm 4620 mm2 4.75 – 18V
Q7 230 pin 70 mm x 70 mm 4900 mm2 5V
MXM 2 (GPU card) 230 pin 82 mm x 70 mm 5740 mm2 6 - 20V
MXM 3 (GPU card) 314 pin 82 mm x 70 mm 5740 mm2 7 – 20V
SMARC™ (full size) 314 (285) pin 82 mm x 80 mm 6560 mm2 3.0 – 5.25V
MXM 3 (Big GPU card) 314 pin 82 mm x 100 mm 8200 mm2 7 – 20V
COM Express Compact 440 pin 95 mm x 95 mm 9025 mm2 12V
COM Express Basic 440 pin 125mm x 96 mm 11875 mm2 12V
+ a huge number of other standardized and proprietary Formfactor and designs
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The pulse of innovation
Feature overview
COM Express® Type 6
COM Express® Type 10
Q7 min/max
SMARC min/max
Connector 440 pin 220 pin 230 pin 314 pinParalell LCD 0/1LVDS 0/1 0/1 0/2 0/1eDP see LVDS see LVDS see LVDSDDI 0/3 0/1HDMI see DDI see DDI 1 0/1DP see DDI see DDI 0/1 optionalVGA 0/1CAM 0/2Par.CAM Support 0/1Ethernet 1 1 0/1 0/1PCI Express 1/8 1/4 0/4 0/3PCI Express Grafic 0/1USB 2.0 4/8 4/8 3/8 2/3USB 3.0 0/4 0/2 0/2 0/2SATA 1/4 1/2 0/2 0/3Audio 0/1 0/1 0/1 0/1I2S 0/1 1/3SPI 1/2 1/2 0/1 2SPDIF 0/1I2C 1 1 1 4LPC 1 1 0/1Serial 0/2 0/2 0/1 2/4CAN 0/1 0/1 0/1 0/2GPIO 8 8 0/12+4SDIO 0/1 0/1 0/1 1SDMMC/eMMC 0/1AFB 0/20 (USB3.0)
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COM Express® compact
COM Express® mini
Q7SMARCSmall size
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ARM Single Core
ARM Dual Core
ARM Quad Core
X86 multi Core
Intel® Atom™Next Gen
Intel® Atom™ Bay TRail
i.MX6
Cortex A9 800MHz
Cortex A9 800MHz
Cortex A9800MHz
Tegra 3
Cortex A9 1.2GHz
AM3874
Cortex A8 800MHz/1GHz
Technology Overview: SMARC®
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01234567
Graphics
0
2
4
6
TDP
Processor Positioning
Lower is better
Higher is better
01234567
CPU Performance
0123456
Price
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Board Level Products based on Intel® Atom™ Bay Trail
COM Express® compact
COM Express® miniPico-ITX
Mini-ITX
Q7
SMARCSmall size
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SMARCFull size
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» Find out for what reasons exactly you want to have a COM or a Motherboard design
» Find out what your complete ecosystem currently looks like, i. e. Operating System, Application Developer
» Find out the volume, you are talking about
» Find out about power dissipation and mobility issues
» Find out what our end customers pays for
Key Decision Criteria
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Scenario 1:
» Your company currently uses COM Express® modules in high volume
» Your company uses Linux from the scratch.
» Software Application Developers are real “open source gurus”.
Future Way:
» Your company could select ARM modules for power dissipation, price or mobility reasons
» Due to broad Linux support, most of source code might be re-used
Common Scenario 1
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Scenario 2:
» Your company currently uses COM Express® modules in high volume
» Your company uses Windows Embedded Standard 7, WinXP Embedded.
» Software development and even drivers are done in house.
Think about:
» If you select ARM for any reason a switch in your Software Development is the consequence. Two software image branches (ARM and existing x86 solutions) must be maintained
» Operating System need to be switch, i. e. WEC7
Common Scenario 2
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Scenario 3:
» Your company currently use for special mobile applications ETX®
modules
» Standard-Software is installed by partner or 3rd party externally
Future way:
» Platform switch is recommended: COM Express® or ARM COM
» ARM is very interesting for mobility due to low power-consumption
» Check with your partners if they can handle ARM structure Alternatively: Ask your COM manufacturer for their Ecosystem for ARM modules.
Common Scenario 3
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Scenario 4:
» Your company build Industrial Standard PC or HMI based on COM Express®
» Operating System and Applications are installed mostly by customers
» Customers sometimes add additional customized hardware
Think about:
» x86 is an established system with many interfaces for extensions
» Customized Windows drivers (x86) may not be re-used on ARM
» Software Applications need to be recompile, customer needs to handle different images
» Windows Embedded Standard is NOT available for ARM
Common Scenario 4
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» ARM processors are powerful enough to drive a graphical user interface at very low power consumption, (Smartphone, Tablet)
» ARM delivers exceptional performance/watt ratio
» SOC performance with dual/quad core is comparable with ATOM range
» Extreme low power consumption at operation (<2W)
ARM Positioning
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ARM better serves Ultra Low-Power market requirements
» Extended temperature selections available
» Longevity up to 15 years
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Thank you for your attention
Gerhard Szczuka
Portfoliomanager