Aries Engineering Design Team 06/06/2008 Aries Engineering Design Team Matt Baker Pete Levno Zach...
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Transcript of Aries Engineering Design Team 06/06/2008 Aries Engineering Design Team Matt Baker Pete Levno Zach...
Aries Engineering Design Team
06/06/2008
Aries Engineering Design Team
Matt BakerPete LevnoZach PerrymanJessica Pierry
Industry Advisor:Ken Millard, P.E.Faculty Advisor:David Sailor, Ph.D.
Final ReportFinal Report
Project Overview
Design a system to efficiently and safely remove floor tiles from heated floor systems in luxury motor coaches without damaging the heating elements
Product Design Specifications• Original customer request was for a “heated
scraper”– Still required use of open flame for initial heating
• Final design request was for tile removal system– Heat tile to break down adhesive– Remove tile– Remove adhesive
Old process in action…
Product Design Specifications• Critical to Quality
– Safety• Eliminate open flame• Control heat sources and surfaces
– Cost• Entire tool kit must cost less than $400
– Resulting Process Time• Trained operator must be able to remove tile and adhesive in
less than 30 min
– Electricity Usage• Must run at less than 10 amps
External Search & Concept EvaluationTile Preparation
•Heat tile using flame•Dangerous
•Heat tile using infrared•Time consuming•Hot exposed surfaces
•Super chill tile using dry ice•Wouldn’t work
•Heat tile using heat pad•Plausible
Heated Pad Chosen
External Search & Concept EvaluationTile Removal
•Hammer & crowbar•Can be dangerous
•Suction device •Expensive and complicated
•Scoring device (glass cutter)•Will help make hammer and crowbar less dangerous
Combination of prying device and scoring device chosen
External Search & Concept EvaluationAdhesive Removal
•Heat adhesive with flame & scrape with unheated scraper
•Dangerous•Adhesive cools while scraping
•Heat scraper using infrared•Impractical
•Resistance Heated Scraper•Plausible
Resistance heated scraper chosen
Material Testing• Strength of Adhesive Bond
– Measure strength of adhesive bond at various temperatures
– Establish temperature that adhesive breaks down
1.Samples heated to several temperatures2.Sample pulled apart in tensile tester3.Data collected4.Results plotted for target temperature
selection
Material Testing
y = 0.0119x2 - 3.2724x + 248.48
R2 = 0.7252
0
20
40
60
80
100
120
55 75 95 115 135 155 175
Temperature (F)
Ten
sile
Str
ess
(PS
I)
At 150°F The adhesive material
became un-testable using this method
By targeting 200°F, the tile removal
should be easiest
Material Testing
• Heat Transfer Properties– Need to relate heat applied at surface to
temperature under tile
thermocouples buried underneath tile on “test board”
Data collected using Labview
Heat applied in W/m^2 with a heat
pad
Material Testing
Adhesive directly under pad reaches
200°F At approximately 10 minutes after heat pad is turned on
Pad temperature is offset from adhesive
temperature by 100°F
Final Design
• Heat pad– Support Frame & Handle– Heating elements– Temperature Controller
• Selected temperature controller to maintain pad temperature at 100°F above adhesive target temperature
– Insulating layer• Protects operator (safety)
Tile Preparation
Final Design
• Tile Removal– Scoring Device
• Handheld tile cutter
– Breaking Device• Heavy steel hammer • Simple yet effective
– Removal Facilitator…• 1” wide pry bar
Tile Removal
Final Design
• Adhesive Removal– The heated scraper…
• Scraping blade – Embedded 150 Watt heating element for quick heat up
• Ergonomic handle • Temperature controller
– Bimetal disc thermostat– Set at 300°F to cut through adhesive as fast as possible
Adhesive Removal
Results
• Time for tile and adhesive removal:– 25 minutes
• Cost:– >$300
• Electricity usage:– 7.25 amps