Application of pulsed dc to suppress bubble incorporation & control deposit morphology during...
-
Upload
manuscriptedit-docs -
Category
Documents
-
view
72 -
download
2
description
Transcript of Application of pulsed dc to suppress bubble incorporation & control deposit morphology during...
![Page 1: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 2](https://reader035.fdocuments.net/reader035/viewer/2022062513/556b23afd8b42adb338b5090/html5/thumbnails/1.jpg)
APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT BUBBLE INCORPORATION & CONTROL DEPOSIT
MORPHOLOGY DURING AQUEOUS MORPHOLOGY DURING AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) ELECTROPHORETIC DEPOSITION (EPD)
www.manuscriptedit.com
Part - 2Part - 2
![Page 2: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 2](https://reader035.fdocuments.net/reader035/viewer/2022062513/556b23afd8b42adb338b5090/html5/thumbnails/2.jpg)
![Page 3: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 2](https://reader035.fdocuments.net/reader035/viewer/2022062513/556b23afd8b42adb338b5090/html5/thumbnails/3.jpg)
Objectives
Develop a generic aqueous EPD process applicable to all types of suspension and substrates by use of pulsed DC.
Control the extent of gas bubble incorporation and the morphology of the deposit.
Study and optimize the process parameters to obtain smooth, homogeneous and bubble-free deposits.
Develop understanding on the involved mechanism.
![Page 4: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 2](https://reader035.fdocuments.net/reader035/viewer/2022062513/556b23afd8b42adb338b5090/html5/thumbnails/4.jpg)
Experimental
![Page 5: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 2](https://reader035.fdocuments.net/reader035/viewer/2022062513/556b23afd8b42adb338b5090/html5/thumbnails/5.jpg)
Zeta potentialZeta potential
![Page 6: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 2](https://reader035.fdocuments.net/reader035/viewer/2022062513/556b23afd8b42adb338b5090/html5/thumbnails/6.jpg)
Constant voltage Continuous Constant voltage Continuous DC EPDDC EPD
![Page 7: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 2](https://reader035.fdocuments.net/reader035/viewer/2022062513/556b23afd8b42adb338b5090/html5/thumbnails/7.jpg)
Constant voltage Pulsed DC EPD
![Page 8: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 2](https://reader035.fdocuments.net/reader035/viewer/2022062513/556b23afd8b42adb338b5090/html5/thumbnails/8.jpg)
Conventional EPD process
![Page 9: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 2](https://reader035.fdocuments.net/reader035/viewer/2022062513/556b23afd8b42adb338b5090/html5/thumbnails/9.jpg)
Constant voltage Pulsed DC EPD
![Page 10: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 2](https://reader035.fdocuments.net/reader035/viewer/2022062513/556b23afd8b42adb338b5090/html5/thumbnails/10.jpg)
Constant voltage Pulsed DC EPD
![Page 11: Application of pulsed dc to suppress bubble incorporation & control deposit morphology during aqueous electrophoretic deposition (epd) - Part - 2](https://reader035.fdocuments.net/reader035/viewer/2022062513/556b23afd8b42adb338b5090/html5/thumbnails/11.jpg)
APPLICATION OF APPLICATION OF PULSED DCPULSED DC TO SUPPRESS BUBBLE TO SUPPRESS BUBBLE INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING INCORPORATION & CONTROL DEPOSIT MORPHOLOGY DURING
AQUEOUS ELECTROPHORETIC DEPOSITION (EPD)AQUEOUS ELECTROPHORETIC DEPOSITION (EPD) PART – 3 PART – 3 (Coming Soon) (Coming Soon)
THANK YOU
www.manuscriptedit.comwww.manuscriptedit.com
VISITVISIT