APE Rework PrinciplesAPE Rework Principles

Advanced Programming in Advanced Programming in Vision ReworkVision Rework

Features of APE TechnologyFeatures of APE Technology Convection Hot AirConvection Hot Air Flexible Segment ProfilingFlexible Segment Profiling Open Oven Nozzle DesignOpen Oven Nozzle Design Component Inspection after Placement and prior Component Inspection after Placement and prior

to Reflowto Reflow ““Real Time” Profile DevelopmentReal Time” Profile Development Optimum Power PerformanceOptimum Power Performance Optimum Low Velocity – High Volume Air FlowOptimum Low Velocity – High Volume Air Flow Thermocouple Profile DevelopmentThermocouple Profile Development Superior Vision and Component ViewingSuperior Vision and Component Viewing Robust DesignRobust Design

Advantages of APE Hot Air Advantages of APE Hot Air TechnologyTechnology

Hot Air Convection replicates the original Oven Manufacturing Profile and Hot Air Convection replicates the original Oven Manufacturing Profile and environment (Up to 16 Zones/Segments).environment (Up to 16 Zones/Segments).

Safe Lower Temperatures due to Heater and delivery design resulting in Safe Lower Temperatures due to Heater and delivery design resulting in improved Power, Low velocity and High Volume Air Flow.improved Power, Low velocity and High Volume Air Flow.

Extended Heater life.Extended Heater life.

Placement and Reflow is separated allowing installation of larger Heaters Placement and Reflow is separated allowing installation of larger Heaters with greater Air Volume.with greater Air Volume.

Separating the Placement and Reflow stations enables inspection of the Separating the Placement and Reflow stations enables inspection of the component after Placement and prior to Reflow.component after Placement and prior to Reflow.

An open Nozzle design provides an improved Temperature Delta across An open Nozzle design provides an improved Temperature Delta across component and PCB and can rework components in tight proximity.component and PCB and can rework components in tight proximity.

PID Step Profile Development allows greater flexibility in ramp-soak profile PID Step Profile Development allows greater flexibility in ramp-soak profile design as opposed to Zone Profiling.design as opposed to Zone Profiling.

Convection Under Board Heating can be operated simultaneously with Top Convection Under Board Heating can be operated simultaneously with Top Reflow Heater from the First Segment.Reflow Heater from the First Segment.

Extremely Robust and Long Life Technology with Low Running CostsExtremely Robust and Long Life Technology with Low Running Costs

Single Station Versus Dual Station Single Station Versus Dual Station MachinesMachines

Placement and Reflow:Placement and Reflow:

A number of Rework machines Place and Reflow in the same location – at first glance A number of Rework machines Place and Reflow in the same location – at first glance this appears to be an advantage but it has the disadvantage of forcing a smaller this appears to be an advantage but it has the disadvantage of forcing a smaller Heater design resulting in Lower Air Volume and a Higher Air Velocity, which creates Heater design resulting in Lower Air Volume and a Higher Air Velocity, which creates greater turbulence to and around the component.greater turbulence to and around the component.

Recently APE’s (patented) higher Power methodology has been generally adopted in Recently APE’s (patented) higher Power methodology has been generally adopted in the industry to address Lead-Free demands. Heaters are commonly running at the industry to address Lead-Free demands. Heaters are commonly running at greater than a 1000 Watts in a confined chamber with the result that they burn out at greater than a 1000 Watts in a confined chamber with the result that they burn out at a rapid rate – often at a frequency of one Heater per month. This single station a rapid rate – often at a frequency of one Heater per month. This single station concept is contrary to an APE Dual Station principle that not only allows a Heater concept is contrary to an APE Dual Station principle that not only allows a Heater design with a design with a High Power ElementHigh Power Element but also provides for a Heater with an “ but also provides for a Heater with an “HIGHER HIGHER VOLUME”VOLUME” and and “LOWER VELOCITY”“LOWER VELOCITY” Air Flow. This is only possible when a Air Flow. This is only possible when a Placement and Reflow Station is separated. It is unusual for an APE Heater to burn Placement and Reflow Station is separated. It is unusual for an APE Heater to burn out within 12 months of continuous use.out within 12 months of continuous use.

Single Station Rework versus Dual Station Rework:Single Station Rework versus Dual Station Rework:

With a single station system the board remains stationary – this is again seen as an With a single station system the board remains stationary – this is again seen as an advantage but in practice the restricted Heater design coupled with the inability to advantage but in practice the restricted Heater design coupled with the inability to view the component after Placement is a far greater disadvantage than the smooth view the component after Placement is a far greater disadvantage than the smooth transition from Placement to Reflow with an APE system.transition from Placement to Reflow with an APE system.

Comparison of APE Hot Air Comparison of APE Hot Air Technology with CompetitionTechnology with Competition

Open Oven Nozzle RAMP-SOAK Profile Development versus Closed Nozzle Zone Open Oven Nozzle RAMP-SOAK Profile Development versus Closed Nozzle Zone Ramping :Ramping :

There are three target Temperature Zones of importance when creating a Temperature There are three target Temperature Zones of importance when creating a Temperature Pattern or Profile:Pattern or Profile:

Example - Eutectic Reflow Temperature 183C (Time above 30 – 90 seconds)Example - Eutectic Reflow Temperature 183C (Time above 30 – 90 seconds)

Board Expansion (90C)Board Expansion (90C) Flux Activation (150 - 160C)Flux Activation (150 - 160C) Peak Solder Temperature (221C+/- 10%Peak Solder Temperature (221C+/- 10%

A number of Closed Nozzle systems divide these targets into three zones, triggering the A number of Closed Nozzle systems divide these targets into three zones, triggering the profile progress through each zone. In most cases the first zone is a Pre-Heat stage (90C) profile progress through each zone. In most cases the first zone is a Pre-Heat stage (90C) which triggers the second zone for flux activation and so on to the last Reflow zone. There is which triggers the second zone for flux activation and so on to the last Reflow zone. There is no soaking in this method and prevents the Under Board Heater being used in conjunction no soaking in this method and prevents the Under Board Heater being used in conjunction with the Top Heater. Running both Heaters from the start of the Heat Cycle is a far better with the Top Heater. Running both Heaters from the start of the Heat Cycle is a far better way of reducing the Delta T.way of reducing the Delta T.

The method also prevents the flexibility that is seen in a Multiple Zone Convection Reflow The method also prevents the flexibility that is seen in a Multiple Zone Convection Reflow Oven and an APE Rework machine, both of which allow for Oven and an APE Rework machine, both of which allow for RAMP SOAKRAMP SOAK profiling not just profiling not just Temperature Ramping in three zones. A typical APE profile is 7-8 zones or segments to Temperature Ramping in three zones. A typical APE profile is 7-8 zones or segments to accomplish a Pattern or Profile.accomplish a Pattern or Profile.

Creating a Temperature ProfileCreating a Temperature Profile

Profiling “Real Time” or “On The Fly:”Profiling “Real Time” or “On The Fly:”

This coined phrase is interesting as Zone Profiling has difficulty in achieving it. When This coined phrase is interesting as Zone Profiling has difficulty in achieving it. When dragging a Temperature Bar to enable solder temperature to reach the air zone dragging a Temperature Bar to enable solder temperature to reach the air zone temperature, it is characteristic of the software that only the target temperature bar temperature, it is characteristic of the software that only the target temperature bar is lengthened – it does not enable the programmer to track the temperature way-is lengthened – it does not enable the programmer to track the temperature way-points prior to the change. Thus it is not an accurate “On The Fly” method. With APE points prior to the change. Thus it is not an accurate “On The Fly” method. With APE software and Multiple Segment Programming, tracking the temperature way-points is software and Multiple Segment Programming, tracking the temperature way-points is possible and an accurate Profile can be created in Real Time.possible and an accurate Profile can be created in Real Time.

Note: Having the ability to profile “On the Fly” is no substitute for an Note: Having the ability to profile “On the Fly” is no substitute for an analytical study of a profile behavior and introducing that study to a new analytical study of a profile behavior and introducing that study to a new Profile-Pattern starting from an ambient temperature.Profile-Pattern starting from an ambient temperature.

When selecting the APE “Real Time” feature in the graphical view, the segment of When selecting the APE “Real Time” feature in the graphical view, the segment of Time and Soak is simply put on “HOLD,” until the solder temperature achieves the Time and Soak is simply put on “HOLD,” until the solder temperature achieves the target. The segment is then released and the “HOLD” process repeated through the target. The segment is then released and the “HOLD” process repeated through the segments until the Peak Solder Temperature is achieved. The Programmer then segments until the Peak Solder Temperature is achieved. The Programmer then simply retraces the Time and Temperature segments selected in the Real Time simply retraces the Time and Temperature segments selected in the Real Time profile noting the changed intervals and adjusting the original pattern segments and profile noting the changed intervals and adjusting the original pattern segments and uploading these values to create the new recipe on the Sniper On-Board-Computer.uploading these values to create the new recipe on the Sniper On-Board-Computer.

The method is the same for Eutectic or Lead-Free Temperatures Profiles.The method is the same for Eutectic or Lead-Free Temperatures Profiles.

Typical Eutectic ProfileTypical Eutectic Profile

Typical Reflow Profile

0

50

100

150

200

250

300

Time

Te

mp

era

ture

Air Temperature

Solder Temperature

SN63/37 Solder Melt Point 361F

Air Temperature 26 90 90 90 150 175 175 250 250 250 150 90

Solder Temperature 26 45 67 89 95 135 151 183 205 215 180 120 75

SN63/37 Solder Melt Point 361F 183 183 183 183 183 183 183 183 183 183 183 183 183

0:00 :30 1:00 :31 2:00 :32 3:00 :33 4:00 :34 5:00 :35 6:00

Open Versus Closed NozzleOpen Versus Closed Nozzle Convection Rework machines either use a Closed Nozzle or an Open Nozzle principle, Convection Rework machines either use a Closed Nozzle or an Open Nozzle principle,

which APE refers to as an “Open Oven Nozzle.”which APE refers to as an “Open Oven Nozzle.” The Closed Nozzle design evolved from the early introduction of SMD QFP components The Closed Nozzle design evolved from the early introduction of SMD QFP components

where focused heat was mistakenly thought to be the key element in rework, reflowing where focused heat was mistakenly thought to be the key element in rework, reflowing the leads only to avoid heating the component body and die. With the advent of BGA’s the leads only to avoid heating the component body and die. With the advent of BGA’s this was not possible and the nozzles were modified to heat the entire component not this was not possible and the nozzles were modified to heat the entire component not just the leads, but the Closed Nozzle concept remained.just the leads, but the Closed Nozzle concept remained.

This was acceptable as long as components were large and there was sufficient room This was acceptable as long as components were large and there was sufficient room around each component to accept a nozzle that would completely enclose and seal the around each component to accept a nozzle that would completely enclose and seal the component being reworked. Because these Closed Nozzle systems Place and Reflow in component being reworked. Because these Closed Nozzle systems Place and Reflow in one position the heaters were mounted in a confined space consequentially reducing one position the heaters were mounted in a confined space consequentially reducing the air volume and necessitating an adjustable higher air velocity. the air volume and necessitating an adjustable higher air velocity.

Twenty years have passed and three important factors now make this design Twenty years have passed and three important factors now make this design impractical and redundant: 1. Heater Power increased from a typical 800 Watts to impractical and redundant: 1. Heater Power increased from a typical 800 Watts to >1200 watts to cope with Lead Free solder. 2. Components reduced in size and 3. >1200 watts to cope with Lead Free solder. 2. Components reduced in size and 3. Components became tightly packed around each other.Components became tightly packed around each other.

The Closed Nozzles higher velocity can disturb the subject. With tightly packed The Closed Nozzles higher velocity can disturb the subject. With tightly packed components the nozzle can no longer seal the component. The air temperature is components the nozzle can no longer seal the component. The air temperature is hotter and can scorch, it also increases the Delta T in the PCB so that Under Board hotter and can scorch, it also increases the Delta T in the PCB so that Under Board heating is critical.heating is critical.

With an APE Open Oven Nozzle design all these disadvantages are eliminated – AND – With an APE Open Oven Nozzle design all these disadvantages are eliminated – AND – in conclusion Closed Nozzles are now sometimes used in a similar way to Open in conclusion Closed Nozzles are now sometimes used in a similar way to Open Nozzles BUT the Higher Velocity and Lower Air Volume of the design make it an Nozzles BUT the Higher Velocity and Lower Air Volume of the design make it an ineffectual medium that can also disturb adjacent components.ineffectual medium that can also disturb adjacent components.

APE Hot Air Convection versus IRAPE Hot Air Convection versus IR

Today there are few Today there are few installations of IR Reflow installations of IR Reflow

Ovens used in the Ovens used in the assembly of PCB’s within assembly of PCB’s within the Electronics Industry !the Electronics Industry !

Convection versus IRConvection versus IR The previous statement should prompt the question as to why?The previous statement should prompt the question as to why?

The answer to this question is pertinent as to whether IR is also a suitable method for The answer to this question is pertinent as to whether IR is also a suitable method for Reworking, having agreed that a Reworking, having agreed that a RAMP SOAKRAMP SOAK method of convection reflow is method of convection reflow is preferred by an OEM in manufacture.preferred by an OEM in manufacture.

An IR BEAM is not a LASER!An IR BEAM is not a LASER!

An obvious statement? Not so – many engineers are confused by the two light An obvious statement? Not so – many engineers are confused by the two light technologies and confuse IR with a laser.technologies and confuse IR with a laser.

Lasers are straight line beams. IR is like a torch light – the further the distance off – Lasers are straight line beams. IR is like a torch light – the further the distance off – the wider the beam – therefore the distance from Target is so critical that it’s rarely the wider the beam – therefore the distance from Target is so critical that it’s rarely repeatable.repeatable.

IR targets the component or the leads – not the surrounding air – the Temperature IR targets the component or the leads – not the surrounding air – the Temperature Delta must therefore be much wider than a Hot Air Convection Method.Delta must therefore be much wider than a Hot Air Convection Method.

The IR sensor is not in the centre of the beam – where is it? – It’s difficult to calculate The IR sensor is not in the centre of the beam – where is it? – It’s difficult to calculate and will change with distance off.and will change with distance off.

IR is sensitive to component coloring – this statement is as true now as it has always IR is sensitive to component coloring – this statement is as true now as it has always been.been.

The sensor can only visually target the outside lead of a BGA and it must be focused. The sensor can only visually target the outside lead of a BGA and it must be focused. Camera and Sensor on the lead – with a CSP this is difficult and of course it’s Camera and Sensor on the lead – with a CSP this is difficult and of course it’s impossible to focus on a centre sphere.impossible to focus on a centre sphere.

Lead-Free ReworkLead-Free Rework All APE Rework machines having an APE bottom heater are suitable for Lead-Free All APE Rework machines having an APE bottom heater are suitable for Lead-Free

rework tasks and are therefore Lead-Free compliant. But – only a Vision-Rework rework tasks and are therefore Lead-Free compliant. But – only a Vision-Rework machine is suitable for BGA and CSP components due to limited surface tension machine is suitable for BGA and CSP components due to limited surface tension characteristics with Lead-Free materials.characteristics with Lead-Free materials.

Detailed below is a typical Lead-Free material:Detailed below is a typical Lead-Free material:

Reflow Temperature 221C Time above Reflow Temperature 60 – 120 secondsReflow Temperature 221C Time above Reflow Temperature 60 – 120 seconds

Board Expansion (90C) Unchanged.Board Expansion (90C) Unchanged. Flux Activation (150 - 160C) Unchanged.Flux Activation (150 - 160C) Unchanged. Peak Solder Temperature (242 - 245C)Peak Solder Temperature (242 - 245C)

The air temperature must obviously be run hotter to reflow, however by raising the The air temperature must obviously be run hotter to reflow, however by raising the bottom heater and having an APE open nozzle design the top reflow temperature can bottom heater and having an APE open nozzle design the top reflow temperature can be kept below that which might otherwise be harmful by a variance in Delta T and be kept below that which might otherwise be harmful by a variance in Delta T and degradation or catastrophic damage to adjacent components.degradation or catastrophic damage to adjacent components.

Notice also that the time above Reflow Temperature is significantly longer than Notice also that the time above Reflow Temperature is significantly longer than eutectic.eutectic.

Typical APE Rework Lead Free Process Typical APE Rework Lead Free Process This is an example of a lead free reflow process in use at a Cellular OEMThis is an example of a lead free reflow process in use at a Cellular OEM

Typical APE Rework Lead-Free ProcessTypical APE Rework Lead-Free Process

Parameters:Parameters: Solder characteristics:Solder characteristics: (formulation confidential) (formulation confidential) Solder melt: 430F (221C)Solder melt: 430F (221C) Peak solder temp requirement: 468F to 473F (242C to 245C)Peak solder temp requirement: 468F to 473F (242C to 245C) Time above 430F: 60 seconds minimum.Time above 430F: 60 seconds minimum. ***Notice: Considerably higher reflow temperature +69F (21C) ***Notice: Considerably higher reflow temperature +69F (21C)

deg over SN63/37deg over SN63/37 Time requirement above reflow temperature is longer than typical.Time requirement above reflow temperature is longer than typical. Typically 45-90 seconds, now 60 – 120 secondsTypically 45-90 seconds, now 60 – 120 seconds Component Characteristics:Component Characteristics: 14mm uBGA, 282 count, 18mil pitch14mm uBGA, 282 count, 18mil pitch Max Temperature 482F (250C)Max Temperature 482F (250C) Max Ramp Rate 4.5F/ sec (2.5C/sec)Max Ramp Rate 4.5F/ sec (2.5C/sec) ***Notice: Even smaller pitch for this part <.5mm***Notice: Even smaller pitch for this part <.5mm Component mass is such that solder temperature can be Component mass is such that solder temperature can be

considered as an accurate scale of component core temperature.considered as an accurate scale of component core temperature.

Typical APE Rework Lead-Free ProcessTypical APE Rework Lead-Free Process

PCB Description: PCB Description: Small high-density test board with multiple BGA and CSP devices and high count plastic Small high-density test board with multiple BGA and CSP devices and high count plastic

connectors.connectors. 5” x 5” area, 3mm Thickness, 7 Layers with one full ground plane and 108 grams in weight 5” x 5” area, 3mm Thickness, 7 Layers with one full ground plane and 108 grams in weight

as an assembly.as an assembly. Machine used: Machine used: A.P.E. South - Sniper I with R0028A ControllersA.P.E. South - Sniper I with R0028A Controllers Reflow Controller Reflow Controller Profile: SV=560F (293C)Profile: SV=560F (293C) Ramp: 1:30 (Time)Ramp: 1:30 (Time) Adder function OFFAdder function OFF Total run time: 2:45Total run time: 2:45 Preheat ControllerPreheat Controller Profile: SV=410F (210C)Profile: SV=410F (210C) Ramp: 1:30Ramp: 1:30 ***Notice:***Notice: Higher set points for both bottom and topside heaters than we are typically used Higher set points for both bottom and topside heaters than we are typically used

to, such as top 450F (232C), bottom 325F (163C), now 560F (293C) and 410F (210C) to, such as top 450F (232C), bottom 325F (163C), now 560F (293C) and 410F (210C) respectively in this example..respectively in this example..

Results:Results: See graph. See graph. Peak Solder Temp 472F (244C)Peak Solder Temp 472F (244C) Time above 430F (221C) 1:21Time above 430F (221C) 1:21 Ramp rate at solder/component body 3.9F/sec (2.2C/sec)Ramp rate at solder/component body 3.9F/sec (2.2C/sec)

Section Through Lead-Free Section Through Lead-Free ProcessProcess

Sample APE Clients include:Sample APE Clients include: Memory Manufacturers:Memory Manufacturers: Communications: Communications:

Security/Defense:Security/Defense:

Kingston TechnologyKingston Technology MotorolaMotorola US Naval WeaponsUS Naval Weapons Corsair MemoryCorsair Memory SamsungSamsung US Home Land SecurityUS Home Land Security SimpleTechSimpleTech KyoceraKyocera US ArmyUS Army ATP SystemsATP Systems QualcomQualcom NSANSA PNY TechnologiesPNY Technologies NokiaNokia FBIFBI PDP SystemsPDP Systems SiemensSiemens LockheedLockheed PC PartnerPC Partner NortelNortel HarrisHarris

Contractors:Contractors: Computers & ComponentsComputers & Components

SolectronSolectron IntelIntel CelesticaCelestica IBMIBM Jabal CircuitsJabal Circuits NvideaNvidea

APE New Vision SeriesAPE New Vision Series

Sniper IIISniper III

Intruder LightningIntruder Lightning

Liberty Sharpshooter 220VLiberty Sharpshooter 220V

Sniper Wide BodySniper Wide Body

www.ape.comwww.ape.comAPE manufacturing situated at:APE manufacturing situated at:

APE HouseAPE HouseNorth Blackwater LaneNorth Blackwater LaneKey LargoKey LargoFlorida, USA 33037Florida, USA 33037

Tel: 305-451-4722Tel: 305-451-4722Fax: 305-451-3374Fax: 305-451-3374Email: Email: sales@ape.comsales@ape.com

Web Site Web Site www.ape.comwww.ape.com