“INTEL CORE”Intel Core is a line of mid- to high-end consumer, workstation, and enthusiast central processing units (CPU) marketed by Intel Corporation. 

CORE I3 “A family of dual core, 64-bit, x86 CPUs from Intel intended for entry-level desktop and laptop computers”

It is one of three types of processors in the "i" series (also called the Intel Core family of processors).

CHARACTERISTICS:The Core i3 processor is available in multiple speeds, ranging from 1.30 GHz up to 3.50 GHz, and features either 3 MB or 4 MB of cache. It utilizes either the LGA 1150 or LGA 1155 socket on a motherboard. Core i3 processors are most often found as dual-core, having two cores. However, a select few high-end Core i3 processors are quad-core, featuring four cores.

The most common type of RAM used with a Core i3 processor is DDR3 1333 or DDR3 1600.

POWER USAGE AND SPEED:Power usage varies for the Core i3 processors:

Slower speeds (1.30 GHz to 1.80 GHz) use 11.5 W, 15 W or 25 W of power Medium speeds (2.00 GHz to 2.50 GHz) use 28 W, 35 W or 37 W of power Faster speeds (2.90 GHz to 3.50 GHz) use 35 W, 37 W or 54 W of power

ADVANTAGES:

Core i3 processors are often used in laptop computers, due to their

lower heat generation and Conservative battery usage. Some laptops can be used for up to five or six hours on a single battery charge when

running a Core i3 processor.

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1st generation (westmere architecture)

Westmere (WSM) was the microarchitecture for Intel's 32 nm process for desktops and servers. Westmere was introduced in 2010 as a process shrink of Nehalem which introduced a number enhancement.

For desktop and mobile, Westmere was branded as 1st Generation Intel Core processors

Arrandale Core

The Arrandale-based i3 processors are dual-core processors. These processors had the FSB replaced with Direct Media Interface 1.0. These processors use Socket-G1. They all have the following features:

Chipset Interconnect: DMI 1.0 (2.5 GT/s) TDP: 18 W, 35 W ISA: Everything up

to SSE4.2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, and SSE4.2). Tech: SpeedStep (EIST), VT-x/EPT, Hyper-threading, FMA, Flex Memory

2nd GENERATION (SANDY BRIDGE MICROARCHITECTURE)

"Sandy Bridge" (32 nm)”

Sandy Bridge (SNB) Client Configuration, formerly Gesher, is Intel's successor to Westmere, a 32 nm process micro architecture for mainstream workstations, desktops, and mobile devices. Sandy Bridge is the "Tock" phase as part of Intel's Tick-Tock model which added a significant number of enhancements and features.Mobile

2nd Generation mobile Core i3 processors were based on Sandy Bridge, an entirely new microarchitecture that provided higher performance at higher power efficiency along with many other improvements and changes. Those new models also integrate a higher performance GPU onto the same die as the microprocessor as well as introduced a new SIMD AVXinstruction

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set extension as well as a number of new technologies. It's also worth pointing out that the ulta-low voltage models are now 1 watt of TDP less than previous generation while having higher clock speed. All Core i3 has the following features in common:

Chipset Interconnect: DMI 2.0 (5 GT/s) TDP: 17 W, 35 W ISA: Everything up

to AVX (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, and AVX).

Tech: SpeedStep (EIST), VT-x/EPT, Hyper-threading, FMA, Flex Memory, Identity Protection, and My WiFi

Wireless: 4G WiMAX 3rd GENERATION (IVY BRIDGE MICROARCHITECTURE) "Ivy Bridge" (22 nm)

Ivy Bridge (IVB) was Intel's micro architecture based on the 22 nm process for desktops and servers. Ivy Bridge was introduced in 2011 as a process shrink of Sandy Bridge which introduced a number of enhancements. Ivy Bridge became Intel's first micro architecture to use tri-gate transistors for their commercial products.

For desktop and mobile, Ivy Bridge is branded as 3rd Generation Intel Core processors. For server class processors, Intel branded it as Xeon E3 v2, Xeon E5 v2, and Xeon E7 v2.

Ivy Bridge is designed to be manufactured using 22 nm Tri-gate FinFET transistors. This is Intel's first generation of FinFET. This correlates to 8 nm Fin width and a 42 nm Fin pitch (shown below). SRAM cell is at 0.1080 µm² and 0.092 µm² for high performance and high density respectively.Scaling:

Sandy Bridge Ivy Bridge Δ

32 nm 22 nm

Fin Pitch

N/A

60 nm

N/AFin Width 8 nm

Fin Height 34 nm

Gate Pitch 112.5 nm 90 nm 0.80x

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Interconnect Pitch 112.5 nm 80 nm 0.71x

4th GENERATION (HASWELL MICROARCHITECTURE)

“Haswell-DT" (22 nm)

Architecture

While sharing a lot of similarities with its predecessor  Ivy Bridge, Haswell introduces many new enhancements and features. Haswell is the first desktop-line of x86s by Intel tailored for a system on chiparchitecture. This is a significant move that will continue to be developed over the next couple of microarchitectures. Overall Haswell shares the same basic flow as Sandy Bridge and Ivy but expends on them considerably in the execution engine with wider execution units and additional scheduler ports.

Key changes from Ivy Bridge

3.5x performance/watt over Nehalem Platform Controller Hub (PCH)

Shrink from 65 nm to 32 nm Support for DDR4 (server/enthusiast

segments) Full Integrated voltage regulator

(FIVR) New C6 & C7 sleep states Cache

L1D$ has double the bandwidth

Load: 64B/cycle (up from 32B/cycle)

Store: 32B/cycle (up from 16B/cycle)

L2$ bandwidth to L1 is doubled 64B/cycle (up from 32B/cycle)

STLB been made to support 2MB pages Table has been doubled to 1,024 entries 8-Way (up from 512, 4-way)

Reorder Buffer (ROB) was increased to 192 entries (up from 168) Scheduler has been widened,

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Increased to 60 entries (up from 54) Integer register file up 8 entries to 168 FP register file up 24 entries to 168 2 additional execution ports

New memory model for Transactional Synchronization Extensions6th GENERATION (SKYLAKE MICROARCHITECTURE)

“Skylake-S" (14 nm)

Skylake (SKL) Client Configuration is Intel's successor to Broadwell, a 14 nm process micro architecture for mainstream workstations, desktops, and mobile devices. Skylake succeeded the short-lived Broadwell which experienced severe delays. Skylake is the "Architecture" phase as part of Intel's PAO model. The micro architecture was developed by Intel's R&D center in Haifa, Israel.

For desktop and mobile, Skylake is branded as 6th Generation Intel Core i3, Core i5, Core i7 processors. For workstations it's branded as Xeon E3 v5.

Die shot of the dual-core GT2 Skylake processors. Those are found in mobile models, and entry-level/budget processors:

14 nm process 11 metal layers ~1,750,000,000 transistors ~9.19 mm x ~11.08 mm ~101.83 mm² die size 2 CPU cores + 24 GPU EUs 7th GENERATION (KABY LAKE MICROARCHITECTURE)

“Kaby Lake-S" (14 nm)

7th generation, modes which was introduced by Intel in early 2017, are manufactured on Intel's improved 14 nm process "14nm+" which allowed for higher clock speeds at similar voltage levels. As such most models enjoy 100-300 MHz clock increase over their previous generation for the same price (Note that clock-for-clock there is no performance improvement over 6th generation Core i3). Overall very few minor features were introduced in the 7th Generation Core i3 models, including improved GPU support for 4K playback via native hardware acceleration. All models incorporate a 600-series  integrated graphics processor which is largely identical to their 6th generation 500-series counterparts. Note that 7th generation Core i3 models have dropped support for ECC memory which were used in many small-business and home servers.

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Desktop

Desktop 7th generation Core i3 processors were launched in January of 2017. While their clock-for-clock performance is identical to their 6th generation counterparts, they are clocked higher which allowed for a slight performance increase. All desktop models use Socket LGA-1151 and have the following common features:

TDP: 35-60 W ISA: Everything up to AVX (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3,

SSE4.1, SSE4.2, AES, AVX) Tech: Software Guard (SGX), Memory Protection (MPX), OS Guard, VT-x, and Hyper-

ThreadingMobile

zThe 7th generation Mobile Core i3 processors which are based on the Kaby Lake microarchitecture were introduced in mid-2016 with later models introduced in early 2017. All mobile models use BGA-1356socket for U-series models and BGA-1440 socket for H-series with the following common features:

TDP: 15-35 W ISA: Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3,

SSE4.1, SSE4.2, AES, AVX, FMA3, and AVX2) Tech: Software Guard (SGX), Memory Protection (MPX), OS Guard, VT-x, VT-

d, Hyper-Threading, and Speed Shift

8th /9th GENERATION (COFFEE LAKE MICROARCHITECTURE)

“Coffee Lake-S" (14 nm)

8th Generation-core based on the Coffee Lake microarchitecture were introduced in early 2018. Those parts offer are manufactured on Intel's third generation 14 nm process which allowed for higher clock frequencies and a number of other changes.

Desktop

Coffee Lake-based Core i3s were introduced in late 2017 with a number of high-end SKUs. A larger number of SKUs were introduced in April 2018. Although they still use standard Socket LGA-1151, those parts are no longer backwards compatible with earlier 100/200-series chipsets and must be paired with an appropriate 300-series chipset. A significant configuration change has taken place with the introduction of Coffee Lake including bumping the

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core count for the Core i3s from 2 cores to 4 and doubling the L3 cache which has signficantly increased the performance of those parts over the prior generation. Note that with the doubling of the core, Intel has dropped hyper-threading support from those models. All models have the following features in common:

Quad-core without Hyper-threading, 6/8 MiB L3$ Mem: Up to 64 GiB of 2400 MT/s DDR4 with ECC support I/O: PCIe Gen 3.0 x16 lanes TDP: 54-65 W (SP), 35 W (LP) ISA: Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3,

SSE4.1, SSE4.2, AES, AVX, FMA3, and AVX2) Tech: VT-x, VT-d, EPT, SpeedStep (EIST), Software Guard (SGX), Secure Key,

Memory Protection (MPX), OS Guard, and Identity Protection (IPT) GPU: UHD Graphics 630 @ 350 MHz with bursts of 1.1-1.15 GHz

CORE I5:“Core i5 is family of mid-range performance 64-bit x86 processors designed by Intel for desktops and laptops. The Core i5 family was introduced by Intel in 2009, following the

retirement of the Core 2 family”.

It can be used in both desktop and laptop computers, and is one of three types of processors in the "i" series (also called the Intel Core family of processors).

The Core i5 processor is available in multiple speeds, ranging from 1.90 GHz up to 3.80 GHz, and it features 3 MB, 4 MB or 6 MB of cache.

It utilizes either the LGA 1150 or LGA 1155 socket on a motherboard. Core i5 processors are most often found as quad-core, having four cores. However, a select few high-end Core i5 processors feature six cores.

Core i5 microprocessors are positioned between the high-end performance Core i7  and the low-end performance Core i3 .

The most common type of RAM used with a Core i5 processor is DDR3 1333 or DDR3 1600, however, higher performance RAM can be used as well (if the motherboard supports it).

POWER USAGE AND SPEED

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Power usage varies for the Core i5 processors:

Slower speeds (1.90 GHz to 2.30 GHz) use 11.5 W of power Medium speeds (2.60 GHz to 3.10 GHz) use 15 W, 25 W, 28 W or 37 W of power Faster speeds (3.20 GHz to 3.80 GHz) use 35 W, 37 W, 45 W, 47 W, 65 W or 84 W of

powerADVANTAGES:

Core i5 processors are commonly found in desktop computers for most everyday use and some higher performance needs. Some laptop computers feature Core i5 processors as well, to provide improved performance for heavier usage needs. At the lower speeds, battery usage is pretty conservative and can reach up to five hours or usage on a single charge. However, at higher speeds, battery usage is higher and may result in up to three hours or so of usage per charge.

1st GENERATION (NEHALEM MICROARCHITECTURE)

Nehalem was the microarchitecture for Intel's 45 nm process for desktops and servers as a successor to Penryn. Nehalem is named after the Nehalem River. Nehalem was replaced by the Westmere microarchitecture in 2010

Penryn-based microprocessors were manufactured on a 45 nm process. Intel's 45 nm process is the is the first high-volume manufacturing process to introduce High-k + metal gate transistors.

Die ShotBloomfield

Scaling: 263 mm²

731,000,000 transistors 45 nm process 4 coresLynnfield[edit]

296 mm² 774,000,000 transistors 45 nm process 4 coresNehalem-EX[edit]

648 mm² 2.300,000,000 transistors 45 nm process

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8 cores

1st GENERATION (WESTMERE MICROARCHITECTURE)

Arrandale Core

The Arrandale-based i5 processors are dual-core processors. These processors had the FSB replaced with Direct Media Interface 1.0 and introduced AES instructions. These processors use Socket-G1. They all have the following features:

Bus: DMI (2.5 GT/s) interface TDP: 18, 35 W ISA: Everything up

to AES (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, and AES), and TXT.

Tech: EIST, VT-x, VT-d, Hyper-threading, and TBT. 2nd GENERATION (SANDY BRIDGE MICROARCHITECTURE)

Mobile

2nd Generation mobile Core i5 processors were based on Sandy Bridge, an entirely new microarchitecture that provided higher performance at higher power efficiency along with many other improvements and changes. Those new models also integrate a higher performance GPU onto the same die as the microprocessor as well as introduced a new SIMD AVXinstruction set extension as well as a number of new technologies. It's also worth pointing out that the ulta-low voltage models are now 1 watt of TDP less than previous generation while having higher clock speed. All Core i5 has the following features in common:

Chipset Bus: DMI 2.0 (5 GT/s) TDP: 17 W, 35 W ISA: Everything up

to AVX (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, and AVX).

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Tech: SpeedStep (EIST), VT-x/EPT, Hyper-threading, FMA, Flex Memory, Identity Protection, and My WiFi

Wireless: 4G WiMAX3RD GENERATION (IVY BRIDGE MICROARCHITECTURE)

Ivy Bridge (IVB) was Intel's microarchitecture based on the 22 nm process for desktops and servers. Ivy Bridge was introduced in 2011 as a process shrink of Sandy Bridge which introduced a number of enhancements. Ivy Bridge became Intel's first microarchitecture to use tri-gate transistors for their commercial products.

For desktop and mobile, Ivy Bridge is branded as 3rd Generation Intel  Core processors. For server class processors, Intel branded it as Xeon E3 v2, Xeon E5 v2, and Xeon E7 v2.

Ivy Bridge introduced a number of new instructions:

F16C  - Extension for performing HP-SP conversions RDRAND  - Secure Key Technology extension FS/GS base access 5-3330, i5-3330S, and i5-3350P support Intel VT-d. Non-K processors have limited

turbo over clocking (extra 4 turbo bins).

Transistors: 1.4 billion Die size: 133 mm² or 160 mm²

Quad-core Ivy Bridge die

1,480,000,000 transistors 160 mm2

4 CPU cores 1 GPU core

2x8xEU (64 ALUs) 22 nm processHexa-core Ivy Bridge Die

Core i7-4960X 1,860,000,000 transistors 256.5 mm² 15.0 mm x 17.1 mm 6 CPU cores 22 nm processHexa-core Ivy Bridge Die

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Core i7-4960X 1,860,000,000 transistors 256.5 mm² 15.0 mm x 17.1 mm 6 CPU cores 22 nm processPentadeca-Core Ivy Bridge die

541 mm² 4,310,000,000 transistors 15 CPU cores 22 nm process 4TH GENERATION (HASWELL MICROARCHITECTURE)

Haswell (HSW) is Intel's microarchitecture based on the 22 nm process for mobile, desktops, and servers. Haswell, which was introduced in 2013, became the successor to Ivy Bridge. Haswell is named after Haswell, Colorado (Originally Molalla after Molalla, Oregon, it was later renamed due to the difficult pronunciation). In 2014 Intel introduced Haswell's successor, Broadwell.

For desktop and mobile, Haswell is branded as 4th Generation Intel  Core processors. For server class processors, Intel branded it as Xeon E3 v3, Xeon E5 v3, and Xeon E7 v3.

Die:

Client Die[edit]

Client die come in 2, 4, or 8 cores setup with dual/quad being mainstream models and the octa-core being the high-end desktop.

Dual-core GT2

22 nm process 960,000,000 transistors 131 mm² die size 2 CPU coresDual-core GT3

22 nm process 1,300,000,000 transistors 181 mm² die size 2 CPU cores

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Quad-core GT2

22 nm process 1,400,000,000 transistors 177 mm² die size 4 CPU cores 1 GPU core

2x10xEU (80 ALUs)Octa-core

Core i7-5960X Octa-core processor 22 nm process 2,600,000,000 transistors 355.52 mm² die size 17.6 mm x 20.2 mm5TH GENERATION (BROADWELL MICROARCHITECTURE)

Broadwell (BDW) is Intel's microarchitecture based on the 14 nm process for mobile, desktops, and servers. Introduced in early 2015, Broadwell is a  process shrink of Haswell which introduced several enhancements. Broadwell is named after Broadwell, Illinois.

For desktop and mobile, Broadwell is branded as 5th Generation Intel  Core processors. For server class processors, Intel branded it as Xeon E3 v4, Xeon E5 v4, and Xeon E7 v4.

DieDual-core[edit]

14 nm process 13 metal layers 1,300,000,000 transistors 82 mm² die size 2 coresDual-core Broadwell with Iris Pro die[edit]

14 nm process 13 metal layers 1,900,000,000 transistors 133 mm2 die size 2 cores

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Quad-core Broadwell with Iris Pro die[edit]

Die shot of the Core i7-5775C microprocessor.

14 nm process 13 metal layers 4 coresDeca-core Broadwell[edit]

Die shot of the Core i7-6950X microprocessor.

14 nm process 3,400,000,000 transistors 246 mm2 die size 10 cores

SKYLAKE MICROARCHITECTURE (6TH GENERATION):

DesktopIntel released the desktop Skylake Mid-range processors in late 2015. All desktop Core i5 models utilize the LGA-1151 socket which is used for most of the Skylake desktop lineup.

Mobile

Mobile Skylake-based Mid-range processors were introduced in late 2015. Mobile Core i5 uses FCLGA-1515/FCLGA-1356 sockets which incorporate the chipset as well as the microprocessor itself in the same package.

KABY LAKE MICROARCHITECTURE (7TH GENERATION):

7th generation Core i5 processors, models which were introduced by Intel in early  2017, are manufactured on Intel's improved 14 nm process "14nm+" which allowed for higher clock speeds at similar voltage levels. As such most models enjoy a modest 100 to 300 MHz clock increase over their previous generation for the same price (Note that clock-for-clock there is no performance improvement over 6th generation Core i5). Overall very few minor features were introduced in the 7th Generation Core i5 models, including improved GPU support for 4K playback via native hardware acceleration. All models incorporate a 600-series integrated graphics processor which is largely identical to their 6th generation 500-seriescounterparts.

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Desktop

Desktop 7th generation Core i5 processors were launched in January of  2017. While their clock-for-clock performance is identical to their 6th generation counterparts, they are clocked higher which allowed for a slight performance increase. All desktop models use Socket LGA-1151, are quad-core with no Hyper-Threading, and have the following common features:

TDP: 35-65 W (with exception for the 7600K) ISA: Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3,

SSE4.1, SSE4.2, AES, AVX, FMA3, and AVX2) Tech: Turbo Boost 2.0, VT-x, VT-d, TSX, SpeedStep, Identity Protection, Secure Key,

Software Guard (SGX), Memory Protection (MPX), OS GuardMobile

The 7th generation Mobile Core i5 processors which are based on the Kaby Lake microarchitecture were introduced in mid-2016 with later models introduced in early 2017. All mobile models use BGA-1356socket for U-series models and BGA-1440 socket for H-series, are dual-core with Hyper-Threading, and have the following common features:

TDP: 4.5-45 W ISA: Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3,

SSE4.1, SSE4.2, AES, AVX, FMA3, and AVX2) Tech: SpeedStep, Speed Shift, Turbo Boost 2.0, VT-x, VT-d/EPT, TSX, Flex

Memory, Smart Response, My WiFi, Software Guard (SGX), Memory Protection (MPX), OS Guard, Secure Key

COFFEE LAKE MICROARCHITECTURE (8TH/9TH GENERATION):

Mobile

In August 2017 Intel introduced 8th generation mobile Core i5 processors. Contrary to their namesake, those initial chips were still based on the same Kaby Lake microarchitecture as 7th generation. Those new microprocessors do bring some considerable performance increase in both single thread and more significantly in multi-threaded applications due to Intel doubling the number of cores from 2 to 4 while maintaining roughly the same price as previous generation. All mobile models still use soldered BGA-1356 socket and as with previous generation, those new mobile Core i5 chip also have Hyper-Threading enabled, providing 8 threads for all models.

TDP: 15 W ISA: Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3,

SSE4.1, SSE4.2, AES, AVX, FMA3, and AVX2)

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Tech: SpeedStep, Speed Shift, Turbo Boost 2.0, VT-x, VT-d/EPT, TSX, Flex Memory, Smart Response, My WiFi, Software Guard (SGX), Memory Protection (MPX), OS Guard, Secure Key

Desktop

Coffee Lake-based Core i5s were introduced in late 2017 with a number of high-end SKUs. A larger number of SKUs were introduced in April 2018. Although they still use standard Socket LGA-1151, those parts are no longer backwards compatible with earlier 100/200-series chipsets and must be paired with an appropriate 300-series chipset. A significant configuration change has taken place with the introduction of Coffee Lake including bumping the core count for the Core i5s from 4 cores to 6 and appropriately increasing the L3 cache which has significantly increased the performance of those parts over the prior generation. Note that with the doubling of the core, Intel has dropped hyper-threading support from those models. All models have the following features in common:

Hexa-core without Hyper-threading, 9 MiB L3$ Mem: Up to 64 GiB of 2666 MT/s DDR4 I/O: PCIe Gen 3.0 x16 lanes TDP: 95 W (HP), 65 W (SP), 35 W (LP) ISA: Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3,

SSE4.1, SSE4.2, AES, AVX, FMA3, and AVX2) Tech: Turbo Boost, VT-x, VT-d, EPT, SpeedStep (EIST), Software Guard

(SGX), Secure Key, Memory Protection (MPX), OS Guard, and Identity Protection (IPT)

GPU: UHD Graphics 630 @ 350 MHz with bursts of 1.05-1.15 GHz

CORE I7: Core i7 is a family of high-end performance 64-bit x86-64 processors designed by Intel for high-end desktops and laptops. Core i7 was introduced in 2008 following the retirement of the Core 2 Quad family

The first i7 processors were released in November 2008.

Variations of the i7 processor are manufactured for a variety of personal computing devices.

Some high-performance i7 processors for desktop computers, such as the i7-8700K, are unlocked for over clocking.

High-efficiency i7 processors (which conserve energy as much as possible, at the expense of some performance) are manufactured for desktop computers, laptops, and mobile devices.

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The i7 processor is marketed primarily to gaming enthusiasts, and digital artists such as filmmakers and animators.

Limited edition i7-8086K

In June 2018, Intel announced a limited edition i7 processor, the i7-8086K, to commemorate the 40th anniversary of the 8086 CPU. Only 8086 of these processors were produced. It is the first Intel processor to reach speeds of 5 GHz without overclocking (using Intel Turbo Boost technology).

NEHALEM MICROARCHITECTURE (1ST GENERATION):

MobileClarksfield Core

The Clarksfield-based i7 processors are quad-core processors. These processors had the FSB replaced with Direct Media Interface 1.0. All processors use PGA-988 (Socket G1) packaging. They all have the following features:

Bus: DMI (2.5 GT/s) interface TDP: 45 W ISA: Everything up

to SSE4.2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, and SSE4.2), and TXT.

Tech: EIST, VT-x, VT-d, Hyper-threading, and TBT.WESTMERE MICROARCHITECTURE (1ST GENERATION):

MobileArrandale Core

The Arrandale-based i7 processors are dual-core processors. These processors had the FSB replaced with Direct Media Interface 1.0 and introduced AES instructions. These processors use Socket-G1. They all have the following features:

Bus: DMI (2.5 GT/s) interface TDP: 18, 25, 35 W ISA: Everything up

to AES (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, and AES), and TXT.

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Tech: EIST, VT-x, VT-d, Hyper-threading, and TBT.

SANDY BRIDGE MICROARCHITECTURE (2ND GENERATION):

Mobile

2nd Generation mobile Core i7 processors were based on Sandy Bridge, an entirely new microarchitecture that provided higher performance at higher power efficiency along with many other improvements and changes. Those new models also integrate a higher performance GPU onto the same die as the microprocessor as well as introduced a new SIMD AVXinstruction set extension as well as a number of new technologies. It's also worth pointing out that the ulta-low voltage models are now 1 watt of TDP less than previous generation while having higher clock speed. All Core i7 has the following features in common:

Chipset Bus: DMI 2.0 (5 GT/s) TDP: 17 W, 35 W, 45 W, 55 W ISA: Everything up

to AVX (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, and AVX).

Tech: SpeedStep (EIST), VT-x/EPT, Hyper-threading, FMA, Flex Memory, Identity Protection, and My WiFi

Wireless: 4G WiMAX (except for embedded models)IVY BRIDGE MICROARCHITECTURE (3RD GENERATION):

Ivy Bridge (IVB) was Intel's microarchitecture based on the 22 nm process for desktops and servers. Ivy Bridge was introduced in 2011 as a process shrink of Sandy Bridge which introduced a number of enhancements. Ivy Bridge became Intel's first microarchitecture to use tri-gate transistors for their commercial products.

For desktop and mobile, Ivy Bridge is branded as 3rd Generation Intel Core processors. For server class processors, Intel branded it as Xeon E3 v2, Xeon E5 v2, and Xeon E7 v2.

DieQuad-core Ivy Bridge die[edit]

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1,480,000,000 transistors 160 mm2

4 CPU cores 1 GPU core

2x8xEU (64 ALUs) 22 nm processHexa-core Ivy Bridge Die[edit]

Core i7-4960X 1,860,000,000 transistors 256.5 mm² 15.0 mm x 17.1 mm 6 CPU cores 22 nm processDeca-core Ivy Bridge Die[edit]

341 mm² 10 CPU cores 22 nm processPentadeca-Core Ivy Bridge die[edit]

541 mm² 4,310,000,000 transistors 15 CPU cores 22 nm processHASWELL MICROARCHITECTURE (4TH GENERATION):

"Haswell-DT" (quad-core, 22 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AVX, AVX2, FMA3, F16C, (BMI1)(Bit Manipulation Instructions1)+BMI2, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel VT-x, Hyper-threading, Turbo Boost 2.0, AES-NI, Smart Cache, Intel Insider

All models except the i7-4770K additionally supported Intel TSX-NI at launch, but support was disabled in later stepping and microcode updates, due to the incorrect implementation, that couldn't be solved by microcode without hurting performance or fixing it fully.

All models except the i7-4770K additionally support Intel VT-d All models except the i7-4770K and i7-4790K additionally support vPro and TXT

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Transistors: 1.4 billion Die size: 177 mm²

BROADWELL MICROARCHITECTURE (5TH GENERATION):

Broadwell (BDW) is Intel's microarchitecture based on the 14 nm process for mobile, desktops, and servers. Introduced in early 2015, Broadwell is a  process shrink of Haswell which introduced several enhancements. Broadwell is named after Broadwell, Illinois.

For desktop and mobile, Broadwell is branded as 5th Generation Intel  Core processors. For server class processors, Intel branded it as Xeon E3 v4, Xeon E5 v4, and Xeon E7 v4.

Die

Dual-core

14 nm process 13 metal layers 1,300,000,000 transistors 82 mm² die size 2 coresDual-core Broadwell with Iris Pro die

14 nm process 13 metal layers 1,900,000,000 transistors 133 mm2 die size 2 cores

Quad-core Broadwell with Iris Pro die

Die shot of the Core i7-5775C microprocessor.

14 nm process 13 metal layers  ? transistors  ? mm2 die size 4 cores

Deca-core Broadwell

Die shot of the Core i7-6950X microprocessor.

14 nm process  ? metal layers 3,400,000,000 transistors

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246 mm2 die size 10 cores

SKYLAKE MICROARCHITECTURE (6TH GENERATION):

Desktop

Intel released the desktop Skylake High-end processors in late 2015. All desktop Core i7 models utilize the LGA-1151 socket which is used for most of the Skylake desktop lineup

Mobile

Mobile Skylake-based High-end processors were introduced in late 2015. Mobile Core i7 uses FCLGA-1515/FCLGA-1356 sockets which incorporate the chipset as well as the microprocessor itself in the same package.

KABY LAKE MICROARCHITECTURE (7TH GENERATION):

7th generation Core i7 processors, models which were introduced by Intel in early  2017, are manufactured on Intel's improved 14 nm process "14nm+" which allowed for higher clock speeds at similar voltage levels. As such most models enjoy a modest 100 to 300 MHz clock increase over their previous generation for the same price (Note that clock-for-clock there is no performance improvement over 6th generation Core i7). Overall very few minor features were introduced in the 7th Generation Core i7 models, including improved GPU support for 4K playback via native hardware acceleration. All models incorporate a 600-series integrated graphics processor which is largely identical to their 6th generation 500-seriescounterparts.

Desktop

Desktop 7th generation Core i7 processors were launched in January of 2017. While their clock-for-clock performance is identical to their 7th generation counterparts, they are clocked higher which allowed for a slight performance increase. All desktop models use Socket LGA-1151, are quad-core with Hyper-Threading, and have the following common features:

TDP: 35-65 W (with exception for the 7600K)

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ISA: Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, FMA3, and AVX2)

Tech: Turbo Boost 2.0, VT-x, VT-d, TSX, SpeedStep, Identity Protection, Secure Key, Software Guard (SGX), Memory Protection (MPX), OS Guard

Mobile

The 7th generation Mobile Core i7 processors which are based on the  Kaby Lake microarchitecture were introduced in mid-2016 with later models introduced in early 2017. All mobile models use BGA-1356socket for U-series models and BGA-1440 socket for H-series, are dual-core with Hyper-Threading, and have the following common features:

TDP: 4.5-45 W ISA: Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3,

SSE4.1, SSE4.2, AES, AVX, FMA3, and AVX2) Tech: SpeedStep, Speed Shift, Turbo Boost 2.0, VT-x, VT-d/EPT, TSX, Flex

Memory, Smart Response, My WiFi, Software Guard (SGX), Memory Protection (MPX), OS Guard, Secure Key

COFFEE LAKE MICROARCHITECTURE (8TH/9TH GENERATION):

DesktopCoffee Lake-based Core i7s were introduced in late 2017 with a number of high-end SKUs. A larger number of SKUs were introduced in April 2018. Although they still use standard Socket LGA-1151, those parts are no longer backwards compatible with earlier 100/200-series chipsets and must be paired with an appropriate 300-series chipset. A significant configuration change has taken place with the introduction of Coffee Lake including bumping the core count for the Core i7s from 4 cores to 6 and appropriately increasing the L3 cache which has significantly increased the performance of those parts over the prior generation. All models have the following features in common:

Hexa-core with Hyper-threading, 12 MiB L3$ Mem: Up to 64 GiB of 2666 MT/s DDR4 I/O: PCIe Gen 3.0 x16 lanes TDP: 95 W (HP), 65 W (SP), 35 W (LP) ISA: Everything up to AVX2 (SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3,

SSE4.1, SSE4.2, AES, AVX, FMA3, and AVX2)

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Tech: Turbo Boost, VT-x, VT-d, EPT, SpeedStep (EIST), TXT, TSX, vPro, Software Guard (SGX), Secure Key, Memory Protection (MPX), OS Guard, Identity Protection (IPT), SIPP

GPU: UHD Graphics 630 @ 350 MHz with bursts of 1.2 GHz

CORE I9:“A family of 64-bit x86 CPUs with up to 18 cores from

Intel. Introduced in 2017, the Core i9 became the top model in the Core "i" series. Also part of the Intel Core X-series brand, the first i9 CPU (7900x) is based on 14 nm process

technology and the Skylake-X microarchitecture”

It features four channels of DDR4 RAM and 44 lanes of PCI Express (compared with 28 in the i7).

Designed for high-performance computing and gaming, the 3.3 GHz i9 chip can be overclocked to 4.5 GHz.

The following is a list of Intel Core i9 brand microprocessors.

SkylakeSkylake-based Core i9 processors were introduced during Computex 2017. Those processors incorporate a large number of changes over their Broadwell counterparts which brings along a performance increase in addition to other improvements. Those processors are also the first to incorporate the new AVX-512 extension.

TDP: 140 W ISA: Everything up to AVX-512

(SMM, FPU, NX, MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, SSE4.2, AES, AVX, FMA3, AVX2, and AVX-512)

Tech: Turbo Boost 2.0, Turbo Max 3.0, Hyper-Threading, VT-x, VT-d, SpeedStep, Software Guard (SGX), and Memory Protection (MPX)

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REFERENCES

1. https://en.wikichip.org/wiki/intel/core_i92. https://en.wikichip.org/wiki/intel/core_i53. https://en.wikichip.org/wiki/intel/core_i34.  "Intel Core i7-8700K Review: The New Gaming King". TechSpot. Archived from

the original on October 5, 2017. Retrieved October 5, 2017.5. ^ "Intel 300-series chipsets to provide USB 3.1 Gen2 and Gigabit Wi-Fi |

KitGuru". www.kitguru.net. Archived from the original on May 6, 2017. Retrieved April 29, 2017.

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