Analysis of Grain Boundary Mobility in Commercially Pure Copper and Pure Nickel

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Analysis of Grain Boundary Mobility in Commercially Pure Copper and Pure Nickel Ana Erb Advisor: Professor A. D. Rollett

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Analysis of Grain Boundary Mobility in Commercially Pure Copper and Pure Nickel. Ana Erb Advisor: Professor A. D. Rollett. Interests & Goals. Mobility pertains to the movement of grain boundaries, dominated by solute. Solute present in commercial alloys affect the migration of the boundaries. - PowerPoint PPT Presentation

Transcript of Analysis of Grain Boundary Mobility in Commercially Pure Copper and Pure Nickel

Page 1: Analysis of Grain Boundary Mobility in Commercially Pure Copper and Pure Nickel

Analysis of Grain Boundary Mobility in Commercially Pure

Copperand Pure Nickel

Ana Erb

Advisor: Professor A. D. Rollett

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Interests & Goals• Mobility pertains to the movement of

grain boundaries, dominated by solute.

• Solute present in commercial alloys affect the migration of the boundaries.

• Boundary mobility controls recrystallization in alloys, which is of importance to industry.

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• Recrystallization: the formation of new, strain-free grain structure from that existing in cold worked metal.

The effects of annealing on metals: (a) cold work, (b) after recovery, (c) after recrystallization, and (d) after grain growth.

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ApproachEquation for grain boundary mobility:

MPV where, V is the velocity of the boundaries, M is the mobility of the boundaries, and P is the driving pressure for migration.

V M P

HardnessTest

Annealing & OIM(during recrystallization)

StoredEnergy

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Commercially Pure Copper

• Initial treatment– Anneal at 800°C for 20

hours– Roll to 30% reduction– Polish overnight on the

Vibromet – Scratch sample

perpendicular to the rolling direction

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Figure on the left is after initial treatment, scratch can be seen.

Figure on the right is after the second anneal (800°C for 2 hours), sample oxidized and scratch gone.

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Commercially Pure Copper• Twin boundaries observed

in copper samples.• Characterized as a 60°

rotation about <111> crystal direction.

• Used information from “Extracting Twins from Orientation Imaging Microscopy Scan Data,” Ryan J.Larson and Stuart I. Wright.

3 60°<111> (depicted in black) 111 Pole Figure for Copper Sample

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Pure Nickel

• Initial treatment– Anneal two samples at

1000°C for 30 minutes– Roll to 30% reduction– Electro-polish – Scratch sample

perpendicular to the rolling direction

• Second anneal– Anneal sample again after

first OIM scan– one sample at 900°C in

argon for 20 minutes– other sample at 700°C in

argon for 20 minutes

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Figure on the left is after initial treatment.

The sample was then annealed at 900°C for 20 minutes in an argon tube

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Figure on the left is after initial treatment.

The sample was then annealed at 700°C for 20 minutes in an argon tube.

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Nickel OIM Datagrain boundary number misorientation angle < > sigma

1 59.1 1 1 1 32 59.9 1 -1 1 33 37.9 1 0 1 94 59.7 1 1 -1 35 59.4 -1 1 1 36 47.4 -2 -1 3 -7 54.6 0 -7 -8 118 38.3 10 -6 3 -9 59.7 -1 -1 1 310 54.8 2 -2 3 -11 57.6 -7 5 -5 -12 38.1 8 2 -13 -

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MPV

G

GP

2

factortaylor

hardness

Shear Modulus

annealedtime

diametergbV

Solving For Mobility

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Calculated Mobility and Grain Boundary Diameters

gb # grain diameter (m) gb mobility (m2 s/kg)1 189.9 1.84E-072 385.3 3.73E-073 552.9 5.36E-074 278.3 2.70E-075 316.1 3.06E-076 522.2 5.06E-077 289.6 2.80E-078 186.1 1.80E-079 123.8 1.20E-0710 152.4 1.48E-0711 507.5 4.92E-0712 182.9 1.77E-07

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Future Work

• Take samples back to FAMU/FSU COE.

• Prepare more nickel samples, now knowing what temperature range to work on.

• Obtain more grain mobility data on both the commercially pure copper samples and pure nickel samples.

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Acknowledgements

• Dr. Anthony D. Rollett• Mitra Taheri• Jason Gruber• Herb Miller• Chaovoon Samuel Lim• Mohammed Haroon Alvi• Jennifer Barrow• Diego Laboy

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Reference

• Humphreys, F.J. and M. Hatherly Recrystallization and Related Annealing Phenomena. Elsevier Science Ltd. 1996.

• Kalu, Peter. Recrystallization and Grain Size Determination. PowerPoint Presentation, Fall 2003.

• Rollett, A.D. Grain Boundary Properties: Energy, Mobility. PowerPoint presentation, Spring 2003.

• Taheri, Mitra L. In-Situ Quantification of the Solute Effect on Mobility, Character and Driving Pressure of Grain Boundaries During Recrystallization in Aluminum Alloys. Carnegie Mellon University.

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More on Mobility

Two main categories of boundary types:

• Low angle grain boundaries– Migration in the LAGBs occur during recovery

• High angle grain boundaries– Migration in the HAGBs occur during

recrystallization

• Angle refers to the angle of rotation required to coincide the two lattices.

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Solutes & Mobility• Solutes tend to segregate to any

interface and lower the free energy of the system.

• For a boundary to move away from the segregated solute requires energy to be supplied.

• Mobility is also strongly sensitive to boundary type.

• High mobilities tend to be associated with CSL structures.

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Coincident Site Lattice(CSL)

• A CSL is when a finite fraction of lattice sites coincide between two lattices.

• The reciprocal of the ratio of CSL sites to lattice sites is denoted by .