Analysis and Design of Analog Integrated Circuits … · M.H. Perrott Issue #1: Headroom...

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M.H. Perrott Analysis and Design of Analog Integrated Circuits Lecture 6 Current Mirrors Michael H. Perrott February 8, 2012 Copyright © 2012 by Michael H. Perrott All rights reserved.

Transcript of Analysis and Design of Analog Integrated Circuits … · M.H. Perrott Issue #1: Headroom...

M.H. Perrott

Analysis and Design of Analog Integrated CircuitsLecture 6

Current Mirrors

Michael H. PerrottFebruary 8, 2012

Copyright © 2012 by Michael H. PerrottAll rights reserved.

M.H. Perrott

From Lecture 5: Basic Single-Stage CMOS Amplifiers

SourceM1

W1L

Vout

ZL

idVin

M1

W1L

Vout

ZL

id

iin

Source

M1

W1L

Vout

ZL

VinSource

SourceM1

W1L

Vout

ZL

idVin

ZS

Zsrc

Vsrc Isrc Zsrc

Source

Common Source Common Gate Source Follower

Common Sourcewith Source Degeneration

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A Closer Look at Load Impedance

SourceM1

W1L

Vout

ZL

idVin

M1

W1L

Vout

ZL

id

iin

Source

M1

W1L

Vout

ZL

VinSource

SourceM1

W1L

Vout

ZL

idVin

ZS

Common Source Common Gate Source Follower

Common Sourcewith Source Degeneration

To achieve high gain (or low attenuation in the case of a source follower), it is very desirable to achieve high load impedance, ZL- Unfortunately, using a simple resistor

of high value has issues What are these issues?

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Issue #1: Headroom Limitations

The bias current of the device is a direct function of RL

- Vdd is < 3.6V for most modern CMOS processes- Vds must be greater than V to maintain device saturation

SourceM1

VoutId

Vin

Common Source

RL

Vdd

Want Vds > ΔV

Id =Vdd − VdsRL

Large RL implies small Id(implies small gm, poor frequency response, etc.)

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Issue #2: Area of Circuit

The most common resistors for precision analog circuits are often based on unsilicided polysiliconlayers- The sheet resistance of unsilicided polysilicon is often

< 1k/square

SourceM1

VoutId

Vin

Common Source

RL

Vdd

Want Vds > ΔV

Large polysilicon RL implies relatively large circuit area(implies high relative cost)

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An Elegant Approach to Achieving High Gain

Replacement of resistor load with a current source yields the highest possible DC gain out of the amplifier- Current source determines Id of device

We can make current sources out of transistors- Generally smaller area than polysilicon resistors

SourceM1

VoutId

Vin

Common SourceVdd

Vds1 > ΔV1

Ibias

What is the small signal gain of the above circuit?6

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A Simple Transistor Based Current Source

Simply use a PMOS load that is properly biased- If we keep the PMOS in saturation, its current is

relatively constant despite Vsd variations This is the desired behavior of a current source

SourceM1

VoutId

Vin

Vdd

Vds1 > ΔV1

M2

Vbias Vsd2 > ΔV2

What are the nonideal issues of the above approach?7

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Issue #1: Impedance of PMOS Device

An ideal current source has infinite impedance PMOS devices have finite impedance

- What is ZL in the above circuit?- How does finite ZL impact the gain of the circuit?

SourceM1

VoutId

Vin

Vdd

Vds1 > ΔV1

M2

Vbias Vsd2 > ΔV2

ZL

We will later examine techniques to increase ZL8

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Issue #1: High Bias Sensitivity

The PMOS device current, Id, is very sensitive to the value of Vbias- We want Id to be relatively constant across temperature

and process variations

SourceM1

VoutId

Vin

Vdd

Vds1 > ΔV1

M2

Vbias W2L

How can we achieve tighter control over Id acrosstemperature and process variations?

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Key Technique: Use Current Mirror

Key idea: use a different PMOS device, M3, to transform a bias current, Ibias, into bias voltage, Vbias- Vbias now yields a consistent current, Id, in M2 (assumed to

be in saturation) across temperature and process variations- Note that layout of M2 and M3 must be done properly to

achieve good device matching

SourceM1

VoutId

Vin

Vdd

Vds1 > ΔV1

M2

Vbias

M3

Ibias

W2L

W3L Vsd2 > ΔV2

How does Id relate to Ibias?10

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NMOS Devices Can Also Be Used for Current Mirrors

We often use both NMOS and PMOS versions in designs- We’ll explore this issue further later in the semester

General issue: current mirrors involve direct feedback between drain and gate

M1

Id

VbiasVds1 > ΔV1

W1L

M2

W2L

Ibias

Zo

Can we apply proposed Thevenin modelingapproach to current mirrors?

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Issue: Thevenin Impedances Are Not Adequate

Looking as purely Thevenin impedances

But, in reality

Issue: coupling between source, drain, or gate- Do we have to abandon the Thevenin method?

RS

M1

Zo

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Try Proposed Thevenin Model

Key Calculations (ignore Rthd for now):

RthgAvvgvg

isRths

Rthdisα

g

s

d

Zo

itest vtest

Rs

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Proposed Thevenin Model Works!

Now include Rthd:

RthgAvvgvg

isRths

Rthdisα

g

s

d

Zo

itest vtest

Rs

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Check Thevenin Resistance Calculation

Plug in Hybrid- to do the analysis- Answer agrees with proposed Thevenin model approach

Easiest to just memorize this result:

RS

M1 (gm+gmb)gm

RS

-gmbvsvgs

vs

rogmvgs

Diode-ConnectedDevice

Derive Zo UsingHybrid-π Model

ResultingOne-Port Model

RSgm

1

Zo

Zo

Zo

Diode connected MOS looks like a resistor of value 1/gm15

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Now Apply Thevenin Approach to the Current Mirror

Key parameter of current source: output resistance- Corresponds to ro of device

M1M2

Ibias

Iref

Rthg1 vg1 Rthd1m1vg1g

g1 d1

M1

gm2

1

M2

node1 node2

node1 node2 node2

Rthd1= ro1

Common SourceDiode-Connected

Zo

Zo Zo

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Cascoded Current Source

Offers increased output resistance- Calculate using Thevenin resistance method- How does Iref compare to Ibias?

M1M2

Ibias

Iref

ro1

M3

VbiasM3

Vbias

ZoZo

Vds1 > ΔV1

Vds3 > ΔV3

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Double Cascode Current Source

Offers further increased output resistance- Calculate using Thevenin resistance method- How does I2 compare to I1?

M1

I2

M2Vbias1

M4

I1

M3Vbias2

Zo

Vds1 > ΔV1

Vds2 > ΔV2

Vds3 > ΔV3

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