Aluminum conductor
Transcript of Aluminum conductor
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A subsidiary of TT electronics plc
Thermal Solutions
Excellence in Techno logy
Insulated Aluminum Substrates Thermal Solutions for
Power Applications
T.T. Electronics is a leading designer and
manufacturer of electronic components.
As a result of our experience with power
components, Anotherm™ substrates, an
innovative method of addressing thermal
problems was developed.
Anotherm™ substrates consist of a highly
thermally conductive aluminum alloy
substrate, with a special anodized
aluminum oxide electrically insulating
layer chemically grown on the aluminum
core. This high temperature anodizedlayer offers good electrical isolation and
excellent thermal transfer. Screen-printed,
solderable conductors are then applied to
the board and fired at 600°C.
Anotherm™ substrates offerAnotherm™ substrates offerAnotherm™ substrates offerAnotherm™ substrates offerAnotherm™ substrates offer
very high thermal conductivitiesvery high thermal conductivitiesvery high thermal conductivitiesvery high thermal conductivitiesvery high thermal conductivities
with low thermal resistance fromwith low thermal resistance fromwith low thermal resistance fromwith low thermal resistance fromwith low thermal resistance from
the die or chip to the substrate.the die or chip to the substrate.the die or chip to the substrate.the die or chip to the substrate.the die or chip to the substrate.
This results in: This results in: This results in: This results in: This results in:
••••• Reduced Operating T Reduced Operating T Reduced Operating T Reduced Operating T Reduced Operating Temperatureemperatureemperatureemperatureemperature
••••• Higher operating power density Higher operating power density Higher operating power density Higher operating power density Higher operating power density
••••• Reduce or eliminate heat sinks Reduce or eliminate heat sinks Reduce or eliminate heat sinks Reduce or eliminate heat sinks Reduce or eliminate heat sinks
••••• Improved reliability and Improved reliability and Improved reliability and Improved reliability and Improved reliability and
reduced failures due to reduced failures due to reduced failures due to reduced failures due to reduced failures due to
thermally induced problems. thermally induced problems. thermally induced problems. thermally induced problems. thermally induced problems.
••••• Lower assembly cost by Lower assembly cost by Lower assembly cost by Lower assembly cost by Lower assembly cost by
eliminating attached heatsinks eliminating attached heatsinks eliminating attached heatsinks eliminating attached heatsinks eliminating attached heatsinks
and mounting hardware and mounting hardware and mounting hardware and mounting hardware and mounting hardware
The result is a low cost, rigid circuit board
with unsurpassed thermal efficiency. The
completely inorganic construction results
in substrate characteristics, that maintain
their properties even at high continuous
operating temperatures.
Traditional methods of removing excess
heat from components have centered on
the use of heat sinks with thermal grease
or polymer pads to thermally connect the
device to the heatsink. With Anotherm™
substrates, the entire board becomes theheat sink with no extra hardware (clips,
screws, etc) required. In addition, the
characteristics of the printed thick film
conductors allow direct wirebonding from
dies to the printed conductors.
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Thermal Solutions
Solder Masks: Printed solder masking is available using
a polymeric formulation.
Heatsinks: One interesting characteristic of this
technology is the capability of printing solderableconductors directly onto heatsinks, thereby simplifying theassembly of power systems.
Reliability: Anotherm™ substrates have been proven
through use in millions of unit-hours of successfuloperation in use as power resistors for automotive HVACfan speed applications, many in very harsh applications. They have successfully passed requirements presently in usefor automotive, and class 8 truck applications.
Soldering: Components can be soldered to traces
printed on Anotherm™ substrates. The use of solder alloyscontaining silver is strongly recommended, such as62Sn36Pb2Ag or Sn96Ag4.
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The base material for the Anotherm® substrates is an aluminum alloy, either 3003 or 6061. This aluminum alloy
has a high thermal conductivity and low cost. The thermal expansion coefficient of this material corresponds favorablywith traditional P.C. board materials as shown in the table below. Long term thermal shock testing confirms theruggedness of the dielectric medium.
Dielectric Layer: The Insulation system used on the
Anotherm® substrate system is an anodically growncoating (similar to hard coat anodizing), that deposits adense, thin film of aluminum oxide approximately 0.0014"thick (0.035mm) onto the aluminum surface. This inorganicdielectric layer gives a high quality insulation that is notaffected by temperature or chemicals.
Multiple Layers: Anotherm™ substrates are ideal for
applications requiring single layer or front and backsidetraces. When multiple layers or printed crossovers arerequired, polymer materials are used. As a result, theexcellent thermal conductivity properties of Anotherm™
substrates are lost in the additional layers. However, thesetraces can be used for carrying low power and controlsignals.
Substrate Characteristics
Magnified sectioned view of AnothermMagnified sectioned view of AnothermMagnified sectioned view of AnothermMagnified sectioned view of AnothermMagnified sectioned view of Anotherm™ substrate andsubstrate andsubstrate andsubstrate andsubstrate andtrace. The anodized insulation layer gives excellenttrace. The anodized insulation layer gives excellenttrace. The anodized insulation layer gives excellenttrace. The anodized insulation layer gives excellenttrace. The anodized insulation layer gives excellentcontinuos coverage, even around sharp cornerscontinuos coverage, even around sharp cornerscontinuos coverage, even around sharp cornerscontinuos coverage, even around sharp cornerscontinuos coverage, even around sharp corners
Printed traces on finned heatsink available.
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Thermal Solutions
Specifications
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Applications:
• Solid State Relays
• Automotive Power Electronics
• L.E.D. Displays
• DC-DC Switching Power Supplies
• Power Amplifiers
• Low Voltage Motor Controls
• High Temperature Electronics such as “down-hole”oilfield telemetry and automotive enginecompartment applications
AnothermAnothermAnothermAnothermAnotherm™ substrates can be scored and grooved for easysubstrates can be scored and grooved for easysubstrates can be scored and grooved for easysubstrates can be scored and grooved for easysubstrates can be scored and grooved for easysingulation.singulation.singulation.singulation.singulation.
AnothermAnothermAnothermAnothermAnotherm™ substrates are compatible with chip & wire assemblysubstrates are compatible with chip & wire assemblysubstrates are compatible with chip & wire assemblysubstrates are compatible with chip & wire assemblysubstrates are compatible with chip & wire assembly.....
Custom circuits and traces are also available on arrayedCustom circuits and traces are also available on arrayedCustom circuits and traces are also available on arrayedCustom circuits and traces are also available on arrayedCustom circuits and traces are also available on arrayedAnothermAnothermAnothermAnothermAnotherm™ substrates.substrates.substrates.substrates.substrates.
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Thermal Solutions
Excellence in Technology
IRC Inc. (AFD)
4222 South Staples Street
Corpus Chr isti, Texas 78411, USA
Telephone: 361 992 7900Facsimile: 361 992 337
Email: [email protected]
Website: www.irctt.com
General NoteIRC reserves the right to make changes in product specification without notice or liability.All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of TT electronics plc
Performance Data
Issue September 2002
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