All Core i7 Models _ Hardware Secrets
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5/16/2015 All Core i7 Models | Hardware Secrets
http://www.hardwaresecrets.com/printpage/All-Core-i7-Models/708 1/11
All Core i7 ModelsBy Rafael Coelho e Gabriel Torres on October 18, 2013
Introduction
The Core i7 is a CPU series manufactured by Intel aimed at high-range computers. In this tutorial, wewill present a series of quick reference tables for you to compare the main differences between allmodels released to date.
By the way, the correct name of this line of processors is Core i7, not Intel i7.
Currently, there are four different generations of Core i7 processors available. In the tables below,we describe the main differences between these generations and the model series within eachgeneration.
Model 8xx 9xx 6xx 7xx 8xx and 9xx
Market Desktop Desktop Mobile Mobile Mobile
Generation First First First First First
Microarchitecture Nehalem Nehalem Nehalem Nehalem Nehalem
Manufacturing Process 45 nm 45 nm or 32 nm 32 nm 45 nm 45 nm
Number of Cores 4 4 or 6 2 4 4
Hyper-Threading Yes Yes Yes Yes Yes
L1 cache (per core) 32 kiB+32 kiB 32 kiB+32 kiB 32 kiB+32kB 32 kiB+32 kiB 32 kiB+32 kiB
L2 cache (per core) 256 kiB 256 kiB 256 kiB 256 kiB 256 kiB
L3 cache (total) 8 MiB 8 MiB or 12 MiB 4 MiB 6 MiB 8 MiB
DMI bus 1 GB/s No 1 GB/s 1 GB/s 1 GB/s
Memory (DDR3) 1066, 1333 1066 800, 1066 1066, 1333 1066, 1333
Memory Channels 2 3 2 2 2
DDR3L and DDR3L-RS No No No No No
Graphics Engine No No HD Graphics No No
DirectX No No 10 No No
Graphics Processors No No 6 No No
Graphics Base Clock No No 166, 266 or 500 MHz No No
Graphics Boost Clock No No 500, 566 or 766 MHz No No
Displays Supported None None 2 None None
PCIe Controller 2.0 No 2.0 2.0 2.0
PCIe Configuration 1x16, 2x8 NA 1x16 1x16 1x16
Turbo Boost 1.0 1.0 1.0 1.0 1.0
EM64T Yes Yes Yes Yes Yes
Virtualization Yes Yes Yes Yes Yes
SSE4.2 Yes Yes Yes Yes Yes
AES-NI No On 32 nm models Yes No No
AVX No No No No No
AVX2 No No No No No
Base Clock 133 MHz 133 MHz 133 MHz 133 MHz 133 MHz
Pinout LGA1156 LGA1366 G1 or BGA1288 G1 G1
Except for UM and UE models, which only support DDR3-800 memory.
Model 2xxx 38xx 39xx 2xxx
Market Desktop Desktop Desktop Mobile
Generation Second Second Second Second
Microarchitecture Sandy Bridge Sandy Bridge Sandy Bridge Sandy Bridge
ManufacturingProcess
32 nm 32 nm 32 nm 32 nm
Number of Cores 4 4 6 2 or 4
Hyper-Threading Yes Yes Yes Yes
L1 cache (per core) 32 kiB+32 kiB 32 kiB+32 kiB 32 kiB+32 kiB 32 kiB+32kB
L2 cache (per core) 256 kiB 256 kiB 256 kiB 256 kiB
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L3 cache (total) 8 MiB 10 MiB 12 MiB or 15 MiB 4 MiB, 6 MiB or 8 MiB
DMI bus 2 GB/s 2 GB/2 2 GB/s 2 GB/s
Memory (DDR3) 1066, 13331066, 1333,
16001066, 1333,
16001066, 1333, 1600
Memory Channels 2 4 4 2
DDR3L and DDR3L-RS
No No No No
Graphics EngineHD 2000 or HD
3000No No HD 3000
DirectX 10.1 No No 10.1
Graphics Processors 6 or 12 No No 12
Graphics Base Clock 850 MHz No No 350, 500 or 650 MHz
Graphics Boost Clock 1.35 GHz No No950 MHz, 1 GHz, 1.1 GHz, 1.2 GHz or 1.3
GHz
Displays Supported 2 No None 2
PCIe Controller 2.0 3.0 3.0 2.0
PCIe Configuration 1x16, 2x8 40 lanes 40 lanes 1x16, 2x8, 1x8, 2x4
Turbo Boost 2.0 2.0 2.0 2.0
EM64T Yes Yes Yes Yes
Virtualization Yes Yes Yes Yes
SSE4.2 Yes Yes Yes Yes
AES-NI Yes Yes Yes Yes
AVX Yes Yes Yes Yes
AVX2 No No No No
Base Clock 100 MHz 100 MHz 100 MHz 100 MHz
Pinout LGA1155 LGA2011 LGA2011 G2, BGA1023 or BGA1224
There are three ports, two of them supporting 1x16, 2x8, 4x4, 8x2, and 16x1 speeds, and one ofthem supporting 1x8, 4x2, and 8x1 speeds. The best configuration allowed is x16/x16/x8, howeverother configurations are supported, such as x8/x8/x8/x8/x8.
Model 37xx 3xxx 4xxx 4xxx
Market Desktop Mobile Desktop Mobile
Generation Third Third Fourth Fourth
Microarchitecture Ivy Bridge Ivy Bridge Haswell Haswell
ManufacturingProcess
22 nm 22 nm22 nm 22 mm
Number of Cores 4 2 or 4 4 2 or 4
Hyper-Threading Yes Yes Yes Yes
L1 cache (percore)
32 kiB+32kB 32 kiB+32 kiB 32 kiB+32 kiB 32 kiB+32 kiB
L2 cache (percore)
256 kiB 256 kiB 256 kiB 256 kiB
L3 cache (total) 8 MiB 4 MiB, 6 MiB or 8 MiB 8 MiB 4 MiB, 6 MiB or 8 MiB
DMI bus 2 GB/s 2 GB/s 2 GB/s 2 GB/s
Memory (DDR3) 1333, 1600 1333, 1600 1333, 1600 1333, 1600
Memory Channels 2 2 2 2
DDR3L andDDR3L-RS
No Yes Yes Yes
Graphics Engine HD 4000 HD 4000HD 4600 or Iris
Pro 5200 HD 4200, HD 4400, HD 4600, HD 5000, Iris
5100 or Iris Pro 5200
DirectX 11 11 11.1 11.1
GraphicsProcessors
12 12 20 or 40 10, 20 or 40
Graphics BaseClock
650 MHz 350 MHz or 650 MHz 200 or 350 MHz 200 or 400 MHz
Graphics BoostClock
1.15 GHz1.1, 1.2, 1.25, 1.3 or
1.35 GHz1.2, 1.25 or 1.3
GHz850 MHz, 1 GHz, 1.1 GHz, 1.15 GHz, 1.2 GHz
or 1.3 GHz
DisplaysSupported
3 33 3
PCIe Controller 3.0 3.0* 3.0 2.0 or 3.0
PCIeConfiguration
1x16, 2x8,1x8, 2x4
1x16, 2x8, 1x8, 2x41x16, 2x8, 1x8,
2x41x4, 4x1 or 1x16, 2x8, 1x8, 2x4
Turbo Boost 2.0 2.0 2.0 2.0
EM64T Yes Yes Yes Yes
Virtualization Yes Yes Yes Yes
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5/16/2015 All Core i7 Models | Hardware Secrets
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SSE4.2 Yes Yes Yes Yes
AES-NI Yes Yes Yes Yes
AVX Yes Yes Yes Yes
AVX2 No No Yes Yes
Base Clock 100 MHz 100 MHz 100 MHz 100 MHz
Pinout LGA1155G2, BGA1023 or
BGA1224LGA1150 FCPGA946, FCBGA1168 or FCBGA1364
* Except for U models, which have a PCI Express 2.0 controller.
Lets now take a detailed look at all Core i7 models launched so far.
First-Generation Core i7 Desktop Models
In the table below, we listed all Core i7-8xx and Core i7-9xx CPU models. These are desktop modelsbased on the Nehalem microarchitecture. They are also called first-generation Core i7 processors.
The 8xx models are based on socket LGA1156 and support 1,066 MHz and 1,333 MHz DDR3 memoriesunder dual-channel architecture. These models have an integrated PCI Express 2.0 controllersupporting one x16 datapath or two x8 datapaths. On these CPUs, communication with themotherboard chipset is achieved through a DMI bus (1 GB/s per direction, listed as 2.5 GT/s byIntel).
The 9xx models are based on socket LGA1366 and support 1,066 MHz memories under triple-channelarchitecture. These models dont have an integrated PCI Express controller and they talk to themotherboard chipset using a QPI bus working at 2.4 GHz (4.8 GB/s) on the regular models or at 3.2GHz (6.4 GB/s) on the Extreme models, which are listed in a separate table below.
The first-generation Core i7 desktop models are quad-core or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as havingeight or 12 cores. However, only half the cores are real; the other half is simulated.
sSpec Model Clock Turbo Boost Cores HT Video L3 Cache Tech. TDP (W)Max. Temp. (C)* Socket
SLBYU 980 3.33 GHz 3.60 GHz 6 Yes No 12 MiB 32 nm 130 68.8 LGA1366
SLBVF 970 3.20 GHz 3.46 GHz 6 Yes No 12 MiB 32 nm 130 67.9 LGA1366
SLBEU 960 3.20 GHz 3.46 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366
SLBEN 950 3.06 GHz 3.32 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366
SLBCK 940 2.93 GHz 3.20 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366
SLBKP 930 2.80 GHz 3.06 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366
SLBEJ 920 2.66 GHz 2.93 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366
SLBCH 920 2.66 GHz 2.93 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366
SLBPS 880 3.06 GHz 3.74 GHz 4 Yes No 8 MiB 45 nm 95 72.7 LGA1156
SLBS2 875K 2.93 GHz 3.60 GHz 4 Yes No 8 MiB 45 nm 95 72.7 LGA1156
SLBQ7 870S 2.66 GHz 3.60 GHz 4 Yes No 8 MiB 45 nm 82 NA LGA1156
SLBJG 870 2.93 GHz 3.60 GHz 4 Yes No 8 MiB 45 nm 95 72.7 LGA1156
SLBLG 860s 2.53 GHz 3.46 GHz 4 Yes No 8 MiB 45 nm 82 76.7 LGA1156
SLBJJ 860 2.80 GHz 3.46 GHz 4 Yes No 8 MiB 45 nm 95 72.7 LGA1156
In the table below, you will find all first-generation Core i7 Extreme models for desktops. Thesemodels have the QPI bus running at a higher clock rate (3.2 GHz, 6.4 GB/s) and come with their clockmultiplier and Turbo Boost options unlocked, providing additional overclocking options.
sSpec ModelInternal Clock Turbo Boost Cores HT Video L3 Cache Tech. TDP (W)Max. Temp. (C)* Socket
SLBVZ 990X 3.46 GHz 3.73 GHz 6 Yes No 12 MiB 32 nm 130 67.9 LGA1366
SLBUZ 980X 3.33 GHz 3.60 GHz 6 Yes No 12 MiB 32 nm 130 67.9 LGA1366
SLBEQ 975 3.33 GHz 3.60 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366
SLBCJ 965 3.20 GHz 3.46 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., theCPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU.
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On some other models, the manufacturer lists Tjunction, which is the maximum internal temperatureof the CPU. The two are not comparable.
First-Generation Core i7 Mobile Models
The first-generation Core i7 processors targeted to laptops are based on the Nehalemmicroarchitecture. They can use two different pinouts, G1 or BGA1288, and have an integrated dual-channel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories on models 6xx(except for models UM and UE, which only support DDR3-800 memories), and 1,066 MHz and1,333 MHz DDR3 memories on models 7xx, 8xx, and 9xx. They have an integrated PCI Express 2.0controller, supporting one x16 connection. Communication with the motherboard chipset is achievedthrough a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). The 6xx modelshave an integrated DirectX 10 video controller running at 166 MHz with a 500 MHz boost clock onUM and UE models, 266 MHz with a 566 MHz boost clock on LM models, or 500 MHz with a 766MHz boost clock on M and E models. This video controller uses an engine called Intel HDGraphics, and models with integrated video support two video monitors.
First-generation Core i7 mobile CPUs can have two (6xx models) or four (all other models) processingcores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores ineach physical core. Therefore, they are recognized by the operating system as four- or eight-coreCPUs. However, only half the cores are real; the other half is simulated.
sSpec Model ClockTurboBoost
Cores HT VideoVideoClock
VideoBoost
L3Cache
Tech.TDP(W)
Max. Temp.(C)*
Pinout
SLBMP 840QM1.86MHz
3.20 GHz 4 Yes No No No 8 MiB45nm
45 100 G1
SLBLX 820QM1.73GHz
3.06 GHz 4 Yes No No No 8 MiB45nm
45 100 G1
SLBQG 740QM1.73GHz
2.93 GHz 4 Yes No No No 6 MiB45nm
45 100 G1
SLBLY 720QM1.60GHz
2.80 GHz 4 Yes No No No 6 MiB45nm
45 100 G1
SLBST 680UM1.46GHz
2.53 GHz 2 YesHD
Graphics166 MHz 500 MHz 4 MiB
32nm
18 105 BGA1288
SLBSS 660UM1.33GHz
2.40 GHz 2 YesHD
Graphics166 MHz 500 MHz 4 MiB
32nm
18 105 BGA1288
SLBWV 660UE1.33GHz
2.40 GHz 2 YesHD
Graphics166 MHz 500 MHz 4 MiB
32nm
18 105 BGA1288
SLBMM 640UM1.20GHz
2.26 GHz 2 YesHD
Graphics166 MHz 500 MHz 4 MiB
32nm
18 105 BGA1288
SLBMK 640LM2.13GHz
2.93 GHz 2 YesHD
Graphics266 MHz 566 MHz 4 MiB
32nm
25 105 BGA1288
SLBTN 640M2.80GHz
3.46 GHz 2 YesHD
Graphics500 MHz 766 MHz 4 MiB
32nm
35 105 G1
SLBZU 640M2.80GHz
3.46 GHz 2 YesHD
Graphics500 MHz 766 MHz 4 MiB
32nm
35 105 BGA1288
SLBMN 620UM1.06GHz
2.13 GHz 2 YesHD
Graphics166 MHz 500 MHz 4 MiB
32nm
18 105 BGA1288
SLBTQ 620M2.66GHz
3.33 GHz 2 YesHD
Graphics500 MHz 766 MHz 4 MiB
32nm
35 105 G1
SLBPE 620M2.66GHz
3.33 GHz 2 YesHD
Graphics500 MHz 766 MHz 4 MiB
32nm
35 105 BGA1288
SLBPD 620M2.66GHz
3.33 GHz 2 YesHD
Graphics500 MHz 766 MHz 4 MiB
32nm
35 105 G1
SLBSU 620LM2.00GHz
2.80 GHz 2 YesHD
Graphics266 MHz 566 MHz 4 MiB
32nm
25 105 BGA1288
SLBML 620LM2.00GHz
2.80 GHz 2 YesHD
Graphics266 MHz 566 MHz 4 MiB
32nm
25 105 BGA1288
SLBXX 610E2.53GHz
3.20 GHz 2 YesHD
Graphics500 MHz 766 MHz 4 MiB
32nm
35 105 BGA1288
In the table below, you will find all first-generation mobile Core i7 Extreme models. They come withtheir cock multipliers and Turbo Boost options unlocked, adding more overclocking options for theenthusiast.
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sSpec Model Clock Turbo Boost Cores HT Video L3 Cache Tech. TDP (W)Max. Temp. (C)* Pinout
SLBSC 940XM 2.13 GHz 3.33 GHz 4 Yes No 8 MiB 45 nm 55 100 G1
SLBLW 920XM 2.00 GHz 3.20 GHz 4 Yes No 8 MiB 45 nm 55 100 G1
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., theCPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of theCPU. On some other models, the manufacturer lists Tcase, which is the maximum externaltemperature of the CPU. The two are not comparable.
Second-Generation Core i7 Desktop Models
In the table below, we listed all second-generation Core i7 desktop processors, which are based onthe Sandy Bridge microarchitecture.
The 3xxx models are based on socket LGA2011 and have an integrated memory controller supportingfour channels as well as 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They have anintegrated PCI Express 3.0 controller with 40 lanes, available through two x16 ports and one x8 port.This way, the CPU can be directly connected to two PCI Express 3.0 x16 slots and one PCI Express3.0 x8 slot. Each port can be broken down, so the CPU also has direct support for five PCI Express3.0 x8 slots, for example. These models dont have integrated video. Communication with themotherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel).
The 2xxx models are based on socket LGA1155 and have a dual-channel memory controller supporting1,066 MHz and 1,333 MHz DDR3 memories. They have an integrated PCI Express 2.0 controllersupporting one x16 connection or two x8 connections. Communication with the motherboard chipsetis achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models havean integrated DirectX 10.1 video controller running at 850 MHz with a 1.35 GHz boost clock, withsix (HD 2000) or 12 (HD 3000) processing cores. Models with integrated video support two displays.
The second-generation Core i7 desktop models are quad-core or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as havingeight or 12 cores. However, only half the cores are real; the other half is simulated.
sSpec Model ClockTurboBoost
Cores HT VideoVideoClock
VideoBoost
L3Cache
Tech.TDP(W)
Max. Temp.(C)*
Socket
SR0KF 3960X3.3GHz
3.9 GHz 6 Yes No No No 15 MiB32nm
130 66.8 LGA2011
SR0GW 3960X3.3GHz
3.9 GHz 6 Yes No No No 15 MiB32nm
130 66.8 LGA2011
SR0KY 3930K3.2GHz
3.8 GHz 6 Yes No No No 12 MiB32nm
130 66.8 LGA2011
SR0H9 3930K 3.2
GHz 3.8 GHz 6 Yes No No No 12 MiB
32nm
130 66.8 LGA2011
SR0LD 38203.6GHz
3.8 GHz 4 Yes No No No 10 MiB32nm
130 66.8 LGA2011
SR0DG 2700K3.5GHz
3.9 GHz 4 YesHD
3000850 MHz 1.35 GHz 8 MiB
32nm
95 72.6 LGA1155
SR00E 2600S2.80GHz
3.80 GHz 4 YesHD
2000850 MHz 1.35 GHz 8 MiB
32nm
65 69.1 LGA1155
SR00C 2600K3.40GHz
3.80 GHz 4 YesHD
3000850 MHz 1.35 GHz 8 MiB
32nm
95 72.6 LGA1155
SR00B 26003.40GHz
3.80 GHz 4 YesHD
2000850 MHz 1.35 GHz 8 MiB
32nm
95 72.6 LGA1155
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., theCPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU.On some other models, the manufacturer lists Tjunction, which is the maximum internal temperatureof the CPU. The two are not comparable.
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Second-Generation Core i7 Mobile Models
The second-generation Core i7 processors targeted to laptops are based on the Sandy Bridgemicroarchitecture and can be based on three different pinouts: BGA1023, BGA1224 or socket G2.These processors have an integrated dual-channel DDR3 memory controller, supporting 1,066 MHz,1,333 MHz and, on 27xx, 28xx, and 29xx models, 1,600 MHz memories. They also have an integratedPCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection ortwo x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus(2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integratedDirectX 10.1 video controller running at 350 MHz, 500 MHz or 650 MHz (see table below for specificclock rates), with 12 processing cores (HD 3000 graphics engine).
Second-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core.Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, onlyhalf the cores are real; the other half is simulated.
sSpec Model ClockTurboBoost
Cores HT VideoVideoClock
VideoBoost
L3Cache
Tech.TDP(W)
Max. Temp.(C)*
Pinout
SR02X 2860QM 2.5 GHz 3.6 GHz 4 YesHD
3000650 MHz 1.3 GHz 8 MiB
32nm
45 100 G2
SR02Q 2860QM 2.5 GHz 3.6 GHz 4 YesHD
3000650 MHz 1.3 GHz 8 MiB
32nm
45 100 BGA1224
SR00U 2820QM 2.3 GHz 3.40 GHz 4 YesHD
3000650 MHz 1.3 GHz 8 MiB
32nm
45 100 BGA1224
SR012 2820QM 2.3 GHz 3.4 GHz 4 YesHD
3000650 MHz 1.3 GHz 8 MiB
32nm
45 100 G2
SR02W 2760QM 2.4 GHz 3.5 GHz 4 YesHD
3000650 MHz 1.3 GHz 6 MiB
32nm
45 100 G2
SR02R 2760QM 2.4 GHz 3.5 GHz 4 YesHD
3000650 MHz 1.3 GHz 6 MiB
32nm
45 100 BGA1224
SR00W 2720QM 2.2 GHz 3.3 GHz 4 YesHD
3000650 MHz 1.3 GHz 6 MiB
32nm
45 100 BGA1224
SR014 2720QM 2.2 GHz 3.3 GHz 4 YesHD
3000650 MHz 1.3 GHz 6 MiB
32nm
45 100 G2
SR02T 2710QE 2.1 GHz 3.0 GHz 4 YesHD
3000650 MHz 1.2 GHz 6 MiB
32nm
45 100 G2
SR0D2 2677M 1.8 GHz 2.9 GHz 2 YesHD
3000350 MHz 1.2 GHz 4 MiB
32nm
17 100 BGA1023
SR02S 2675QM 2.2 GHz 3.1 GHz 4 YesHD
3000650 MHz 1.2 GHz 6 MiB
32nm
45 100 BGA1224
SR02N 2670QM 2.2 GHz 3.1 GHz 4 YesHD
3000650 MHz 1.1 GHz 6 MiB
32nm
45 100 G2
SR03S 2657M 2.6 GHz 2.7 GHz 2 YesHD
3000350 MHz 1 GHz 6 MiB
32nm
17 100 BGA1023
SR04N 2649M 2.3 GHz 3.2 GHz 2 YesHD
3000500 MHz 1.1 GHz 4 MiB
32nm
25 100 BGA1023
SR043 2640M 2.8 GHz 3.5 GHz 2 YesHD
3000650 MHz 1.3 GHz 4 MiB
32nm
35 100 BGA1023
SR03R 2640M 2.8 GHz 3.5 GHz 2 YesHD
3000650 MHz 1.3 GHz 4 MiB
32nm
35 100 G2
SR0D3 2637M 1.7 GHz 2.8 GHz 2 YesHD
3000350 MHz 1.2 GHz 4 MiB
32nm
17 100 BGA1023
SR030 2635QM 2.0 GHz 2.9 GHz 4 YesHD
3000650 MHz 1.2 GHz 6 MiB
32nm
45 100 BGA1224
SR02Y 2630QM 2.0 GHz 2.9 GHz 4 YesHD
3000650 MHz 1.1 GHz 6 MiB
32nm
45 100 G2
SR04D 2629M 2.1 GHz 3.0 GHz 2 YesHD
3000500 MHz 1.1 GHz 4 MiB
32nm
25 100 BGA1023
SR03F 2620M 2.7 GHz 3.4 GHz 2 YesHD
3000650 MHz 1.3 GHz 4 MiB
32nm
35 100 G2
SR041 2620M 2.7 GHz 3.4 GHz 2 YesHD
3000650 MHz 1.3 GHz 4 MiB
32nm
35 100 BGA1023
SR03T 2617M 1.5 GHz 2.6 GHz 2 YesHD
3000350 MHz 950 MHz 4 MiB
32nm
17 100 BGA1023
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In the table below, you will find the only second-generation mobile Core i7 Extreme processor modelreleased so far. It comes with its clock multiplier and Turbo Boost options unlocked, adding moreoverclocking options for the enthusiast.
sSpec Model ClockTurboBoost
Cores HT VideoVideoClock
VideoBoost
L3Cache
Tech.TDP(W)
Max. Temp.(C)*
Pinout
SR02F 2960XM2.70GHz
3.70 GHz 4 YesHD
3000650 MHz 1.3 GHz 8 MiB
32nm
55 100 G2
SR02E2920XM2.50GHz
3.50 GHz 4 YesHD
3000650 MHz 1.3 GHz 8 MiB
32nm
55 100 G2
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., theCPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of theCPU. On some other models, the manufacturer lists Tcase, which is the maximum externaltemperature of the CPU. The two are not comparable.
Third-Generation Core i7 Desktop Models
In the table below, we listed all third-generation Core i7 desktop processors, which are based on theIvy Bridge microarchitecture. The models released so far are based on socket LGA1155 and have adual-channel memory controller supporting 1,333 MHz and 1,600 MHz DDR3 memories. They have anintegrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8connection or two x4 connections. Communication with the motherboard chipset is achieved througha DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models have an integratedDirectX 11 video controller running at 650 MHz with a 1.15 GHz boost clock, with 12 (HD 4000)processing cores. All models support three displays (previous generations support two).
The third-generation Core i7 desktop models are quad- or six-core CPUs using the Hyper-Threadingtechnology. This means that the operating system will recognize all these CPUs as having either eightor twelve cores. However, only half the cores are real; the other half is simulated.
sSpec Model ClockTurboBoost
Cores HT VideoVideoClock
VideoBoost
L3Cache
Tech.TDP(W)
Max. Temp.(C)*
Socket
SR1AS 4960X3.6GHz
4.0 GHz 6 Yes No - - 15 MiB22nm
130 66.8 LGA2011
SR1AT 4930K3.4GHz
3.9 GHz 6 Yes No - - 12 MiB22nm
130 66.8 LGA2011
SR1AU 4920K3.7GHz
3.9 GHz 4 Yes No - - 10 MiB22nm
130 88.8 LGA2011
SR0PL 3770K3.5GHz
3.9 GHz 4 YesHD
4000650 MHz 1.15 GHz 8 MiB
22nm
77 67.4 LGA1155
SR0PK 37703.4GHz
3.9 GHz 4 YesHD
4000650 MHz 1.15 GHz 8 MiB
22nm
77 67.4 LGA1155
SR0PN 3770S3.1GHz
3.9 GHz 4 YesHD
4000650 MHz 1.15 GHz 8 MiB
22nm
65 69.1 LGA1155
SR0PQ 3770T2.5GHz
3.7 GHz 4 YesHD
4000650 MHz 1.15 GHz 8 MiB
22nm
45 69.8 LGA1155
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., theCPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU.On some other models, the manufacturer lists Tjunction, which is the maximum internal temperatureof the CPU. The two are not comparable.
Third-Generation Core i7 Mobile Models
The third-generation Core i7 processors targeted to laptops are based on the Ivy Bridgemicroarchitecture and can be based on three different pinouts: BGA1023, BGA1224 or socket G2.These processors have an integrated dual-channel DDR3 memory controller, supporting 1,333
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MHz and 1,600 MHz memories. They also have an integrated PCI Express 3.0 controller (in the Umodels, this controller is 2.0) supporting one x16 connection, two x8 connections, one x8 connectionor two x4 connections. Communication with the motherboard chipset is accomplished through a DMIbus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have anintegrated DirectX 11 video controller running at 650 MHz (350 MHz on U models), with a boostclock that depends on the model (see table below for specific clock rates), all with 12 processingcores (HD 4000 graphics engine).
Third-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core.Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, onlyhalf the cores are real; the other half is simulated.
sSpec Model ClockTurboBoost
Cores HT VideoVideoClock
VideoBoost
L3Cache
Tech.TDP(W)
Max. Temp.(C)*
Pinout
NA 3840QM2.8GHz
3.8 GHz 4 YesHD
4000650 MHz 1.3 GHz 8 MiB
22nm
45 105 G2
NA 3840QM2.8GHz
3.8 GHz 4 YesHD
4000650 MHz 1.3 GHz 8 MiB
22nm
45 105 BGA1224
SR0MK 3820QM2.7GHz
3.7 GHz 4 YesHD
4000650 MHz 1.25 GHz 8 MiB
22nm
45 105 BGA1224
SR0MJ 3820QM2.7GHz
3.7 GHz 4 YesHD
4000650 MHz 1.25 GHz 8 MiB
22nm
45 105 G2
SR0UV 3740QM2.7GHz
3.7 GHz 4 YesHD
4000650 MHz 1.3 GHz 6 MiB
22nm
45 105 G2
SR0MM 3720QM2.6GHz
3.6 GHz 4 YesHD
4000650 MHz 1.25 GHz 6 MiB
22nm
45 105 BGA1224
SR0ML 3720QM2.6GHz
3.6 GHz 4 YesHD
4000650 MHz 1.25 GHz 6 MiB
22nm
45 105 G2
SR12R 3689Y1.5GHz
2.6 GHz 2 YesHD
4000350 MHz 850 MHz 4 MiB
22nm
13 105 BGA1023
SR0XH 3687U2.1GHz
3.3 GHz 2 YesHD
4000350 MHz 1.2 GHz 4 MiB
22nm
17 105 BGA1023
SR0N5 3667U2.0GHz
3.2 GHz 2 YesHD
4000350 MHz 1.15 GHz 4 MiB
22nm
17 105 BGA1023
NA 3635QM2.4GHz
3.4 GHz 4 YesHD
4000650 MHz 1.2 GHz 6 MiB
22nm
45 105 BGA1224
SR0V0 3632QM2.2GHz
3.2 GHz 4 YesHD
4000650 MHz 1.15 GHz 6 MiB
22nm
35 105 G2
NA 3632QM2.2GHz
3.2 GHz 4 YesHD
4000650 MHz 1.15 GHz 6 MiB
22nm
35 105 BGA1224
NA 3630QM2.4GHz
3.4 GHz 4 YesHD
4000650 MHz 1.15 GHz 6 MiB
22nm
45 105 G2
SR0MP 3615QM2.3GHz
3.3 GHz 4 YesHD
4000650 MHz 1.2 GHz 6 MiB
22nm
45 105 BGA1224
SR0MQ 3612QM2.1GHz
3.1 GHz 4 YesHD
4000650 MHz 1.1 GHz 6 MiB
22nm
45 105 G2
SR0MR 3612QM2.1GHz
3.1 GHz 4 YesHD
4000650 MHz 1.1 GHz 6 MiB
22nm
45 105 BGA1224
SR0MN 3610QM2.3GHz
3.3 GHz 4 YesHD
4000650 MHz 1.1 GHz 6 MiB
22nm
45 105 G2
SR0X8 3540M3.0GHz
3.7 GHz 2 YesHD
4000650 MHz 1.3 GHz 4 MiB
22nm
35 105 BGA1023
SR0X6 3540M3.0GHz
3.7 GHz 2 YesHD
4000650 MHz 1.3 GHz 4 MiB
22nm
35 105 G2
SR0XG 3537U2.0GHz
3.1 GHz 2 YesHD
4000350 MHz 1.2 GHz 4 MiB
22nm
17 105 BGA1023
SR0MU 3520M2.9GHz
3.6 GHz 2 YesHD
4000650 MHz 1.25 GHz 4 MiB
22nm
35 105 BGA1023
SR0MT 3520M2.9GHz
3.6 GHz 2 YesHD
4000650 MHz 1.25 GHz 4 MiB
22nm
35 105 G2
SR0N6 3517U1.9GHz
3.0 GHz 2 YesHD
4000350 MHz 1.15 GHz 4 MiB
22nm
17 105 BGA1023
In the table below, you will find all third-generation mobile Core i7 Extreme models. They come withtheir clock multipliers and Turbo Boost options unlocked, adding more overclocking options for theenthusiast.
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sSpec Model ClockTurboBoost
Cores HT VideoVideoClock
VideoBoost
L3Cache
Tech.TDP(W)
Max. Temp.(C)*
Pinout
SR0US 3940XM3.0GHz
3.9 GHz 4 YesHD
4000650 MHz 1.35 GHz 8 MiB
22nm
55 105 G2
SR0T2 3920XM2.9GHz
3.8 GHz 4 YesHD
4000650 MHz 1.3 GHz 8 MiB
22nm
55 105 G2
SR0MH 3920XM2.9GHz
3.8 GHz 4 YesHD
4000650 MHz 1.3 GHz 8 MiB
22nm
55 105 G2
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., theCPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of theCPU. On some other models, the manufacturer lists Tcase, which is the maximum externaltemperature of the CPU. The two are not comparable.
Fourth-Generation Core i7 Desktop Models
In the table below, we listed all fourth-generation Core i7 desktop processors, which are based onthe Haswell microarchitecture. The models released so far are based on socket LGA1150 and,therefore, incompatible with motherboards designed for previous models.
These processors have a dual-channel memory controller supporting 1,333 MHz and 1,600 MHz DDR3memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8connections, one x8 connection or two x4 connections. Communication with the motherboard chipsetis achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel).
A new feature brought by these models is the support for AVX2 instructions.
All models have an integrated DirectX 11.1 video controller and two graphics engines are available atthe moment: HD 4600 (codenamed GT2, 20 processing units), and Iris Pro 5200 (codenamedGT3e, 40 processing units, and video memory integrated into the CPU).
The fourth-generation Core i7 desktop models are quad-core CPUs using the Hyper-Threadingtechnology. This means that the operating system will recognize all these CPUs as having eightcores. However, only half the cores are real; the other half is simulated.
sSpec Model ClockTurboBoost
Cores HT VideoVideoClock
VideoBoost
L3Cache
Tech.TDP(W)
Max. Temp.(C)*
Socket
SR1BW 47713.5GHz
3.9 GHz 4 Yes HD 4600 350 MHz 1.2 GHz 8 MiB22nm
84 72 LGA1150
SR147 4770K3.4GHz
3.9 GHz 4 Yes HD 4600 350 MHz 1.25 GHz 8 MiB22nm
84 72.72 LGA1150
SR149 47703.4GHz
3.9 GHz 4 Yes HD 4600 350 MHz 1.2 GHz 8 MiB22nm
84 72.72 LGA1150
NA 4770R3.2GHz
3.9 GHz 4 YesIris Pro5200
200 MHz 1.3 GHz 6 MiB22nm
65 66.45 LGA1150
SR14H 4770S3.1GHz
3.9 GHz 4 Yes HD 4600 350 MHz 1.2 GHz 8 MiB22nm
65 71.35 LGA1150
SR14N 4770T2.5GHz
3.7 GHz 4 Yes HD 4600 350 MHz 1.2 GHz 8 MiB22nm
45 71.45 LGA1150
SR14Q 4765T 2.0GHz
3.0 GHz 4 Yes HD 4600 350 MHz 1.2 GHz 8 MiB22nm
35 66.35 LGA1150
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., theCPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU.On some other models, the manufacturer lists Tjunction, which is the maximum internal temperatureof the CPU. The two are not comparable.
Fourth-Generation Core i7 Mobile Models
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The fourth-generation Core i7 processors targeted to laptops are based on the Haswellmicroarchitecture.
A new feature brought by these models is the support for AVX2 instructions.
The U and Y models carry an integrated south bridge chip with a four-port USB 3.0 controller anda four-port SATA-600 controller. On these models, the PCI Express controller is 2.0 and supports onlyone x4 connection or four x1 connections. On the other models, the PCI Express controller is 3.0 andsupports one x16 connection, two x8 connections, one x8 connection or two x4connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/seach direction, which is listed as 5 GT/s by Intel).
Several graphics engines are available, all DirectX 11.1: HD 4200 (codenamed GT1, 10 processingunits), HD 4400 (codenamed GT2, 20 processing units), HD 4600 (codenamed GT2, 20 processingunits), HD 5000 (codenamed GT3, 40 processing units), Iris 5100 (codenamed GT3, 40 processingunits), and Iris Pro 5200 (codenamed GT3e, 40 processing units, and video memory integrated intothe CPU).
The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600MHz DDR3L and LPDDR3 (on models U and Y) memories.
Fourth-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core.Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, onlyhalf the cores are real; the other half is simulated.
sSpec Model ClockTurboBoost
Cores HT VideoVideoClock
VideoBoost
L3Cache
Tech.TDP(W)
Max. Temp.(C)*
Package
NA 4960HQ2.6GH
3.8 GHz 4 YesIris Pro5200
200 MHz 1.3 GHz 6 MiB22nm
47 100 NA
SR18G 4950HQ2.4GHz
3.6 GHz 4 YesIris Pro5200
200 MHz 1.3 GHz 6 MiB22nm
47 100 FCBGA1364
SR15K 4900MQ2.8GHz
3.8 GHz 4 Yes HD 4600 400 MHz 1.3 GHz 8 MiB22nm
47 100 FCPGA946
SR18H 4850HQ2.3GHz
3.5 GHz 4 YesIris Pro5200
200 MHz 1.2 GHz 6 MiB22nm
47 100 FCBGA1364
SR15L 4800MQ2.7GHz
3.7 GHz 4 Yes HD 4600 400 MHz 1.3 GHz 6 MiB22nm
47 100 FCPGA946
SR18J 4750HQ2.0GHz
3.2 GHz 4 YesIris Pro5200
200 MHz 1.2 GHz 6 MiB22nm
47 100 FCBGA1364
SR15F 4702HQ2.2GHz
3.2 GHz 4 Yes HD 4600 400 MHz 1.15 GHz 6 MiB22nm
37 100 FCBGA1364
SR15J 4702MQ2.2GHz
3.2 GHz 4 Yes HD 4600 400 MHz 1.15 GHz 6 MiB22nm
37 100 FCPGA946
SR15E 4700HQ2.4GHz
3.4 GHz 4 Yes HD 4600 400 MHz 1.2 GHz 6 MiB22nm
47 100 FCBGA1364
SR15H 4700MQ2.4GHz
3.4 GHz 4 Yes HD 4600 400 MHz 1.15 GHz 6 MiB22nm
47 100 FCPGA946
SR17L 4700EQ2.4GHz
3.4 GHz 4 Yes HD 4600 400 MHz 1 GHz 6 MiB22nm
47 100 FCBGA1364
SR16H 4650U1.7GHz
3.3 GHz 2 Yes HD 5000 200 MHz 1.1 GHz 4 MiB22nm
15 100 FCBGA1168
NA 4610Y1.7GHz
2.9 GHz 2 Yes HD 4200 200 MHz 850 MHz 4 MiB22nm
11.5 100 NA
NA 4600M2.9GHz
3.6 GHz 2 Yes HD 4600 400 MHz 1.3 GHz 4 MiB22nm
37 100 NA
SR1EA 4600U2.1GHz
3.3 GHz 2 Yes HD 4400 200 MHz 1.1 GHz 4 MiB22nm
15 100 FCBGA1168
SR188 4558U2.8GHz
3.3 GHz 2 Yes Iris 5100 200 MHz 1.2 GHz 4 MiB22nm
28 100 FCBGA1168
SR16J 4550U 1.5GHz
3.0 GHz 2 Yes HD 5000 200 MHz 1.1 GHz 4 MiB22nm
15 100 FCBGA1168
SR16Z 4500U1.8GHz
3.0 GHz 2 Yes HD 4400 200 MHz 1.1 GHz 4 MiB22nm
15 100 FCBGA1168
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TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., theCPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of theCPU. On some other models, the manufacturer lists Tcase, which is the maximum externaltemperature of the CPU. The two are not comparable.
Originally at http://www.hardwaresecrets.com/article/All-Core-i7-Models/708
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