Akimitsu Morimoto Mitsui Chemicals Tohcello, Inc. · 2018-11-21 · •Mobility •Health Care...
Transcript of Akimitsu Morimoto Mitsui Chemicals Tohcello, Inc. · 2018-11-21 · •Mobility •Health Care...
Functional Semiconductor Process Tape
ICROSTM Tape
Akimitsu Morimoto
Mitsui Chemicals Tohcello, Inc.
Contents
Basic Information of ICROSTM Tape
ICROSTM Tape Technology
Summary
・Back Grinding(BG) Tape・Dicing(DC) Tape・The Other Functional Tape
• Mobility
• Health Care
• Food & Packaging
• Basic Materials
• One of the largest chemical manufacturers in the world• $13 billion in sales in fiscal 2017• Over 17,000 employees worldwide• Domestic: 5 manufacturing sites, 7 R&D Laboratories, 4 sales
branches• Over 100 Subsidiary Companies.
• Business Groups
Mitsui Chemicals Inc.
: Performance Compound, Elastomers, Functional Polymers
: Agricultural Materials, Films, Sheets, Tapes
: Personal Care, Nonwovens
: Phenol, Petrochemicals
ICROSTM Tape
Mitsui’sCombination ofTechnologies
Mitsui Chemicals Tohcello, Inc
Back-grinding
Surface protective tape
SemiconductorProcess
Laminating
Detaping
Package
Dicing
Bonding
Molding
Dicing
Pick-up
Grinding
Superior Total
ThicknessHigh Adhesion Anti ESD
Very Low
ContaminationBump Absorption
Chemical
Resistant ExpandabilityHEAT Resistant
≤260℃
Self ReleaseTransparent
ICROSTM Tape Application
Application to other areas
ElectronicComponent
Mitsui’s target is not limited to Semiconductor.ICROS tape are already used in other areas.
Sensors Semiconductor
Optics
Lens
VCSEL
3D Sensing
ICROSTM Tape TechnologyBack Grinding(BG) Tape
Tape TTV Control
Superior Total
Thickness
Back Grinding Tape I
Tape Conventional Mitsui Tape
Histogram
TTV Value * 9 1.5
Excellent TTV Control (<2um) Precise Manufacturing Control
*12inch wafer TTV after taping and grinding to 75um
TTV CheckTaping DetapingGrinding
High controlled TTV wafer
Back Grinding Tape II
Bump Type Solder Bump
Target FlipChip BGA WLCSP
Bump
Image
Tape Type
Si
120 μm
Si
200 μm
Base film Base film
Adhesive
Adhesive
Intermediatelayer I
Intermediate Layer II
Cover high topography (~300um) Maintain No Residue Performance Varieties of Tape Design (>=20)Bump
Absorption
Bump Encapsulation Technology
こんな感じの写真by DHE
Grinding WLCSP and fan-out wafer
Target Bump
ICROSTM Tape Technology Dicing(DC) Tape
High light Transmissivity Good wafer secured during
Dicing Good expansion & pick up
Good visibility
Expansion & Pick up
Target Application:
1) Wafer backside Inspection Transprarent Dicing Tape
Transparent Expandability
Keep chip goodwith no damage
High Lasertransmissivity
2) SD Through Tape
Chip Inspection through tape
SD through Tape
Heat Resistant Dicing Tape
Heat Resistance (≤150 ℃) Good expansion
after heating
Dicing Wafer level TestingExpansion & Pick up
Target Application:
Frame handling wafer level test
-15 ℃ to 150℃
Ring frame
Tape
Heat Resistant Expandability≤150℃
DC Tape property Heat resistance Expandability
Conventional tape
Heat resistant tape
Mitsui DC tape
Heat Resistant Dicing Tape
Dicing Wafer level Testing Expansion & Pick up
-15 ℃ to 150℃
Ring frame
Tape
- Pick up ability -
Chip
Lift 5mm
Good Expansion
Good Pick Up ability
Lift 15mmConventional HR-DC tape
- Heat Resistance -
WL-CSP
Mold Array Package
No Melting
No Attaching to CT.
@100 °C
- Dicing Property-Good Dicing property
Burr
Good
ICROSTM Tape Technology The Other Process Tape
Thermal Release Ability (≥ 190°C) Heat resistance (≤ 150°C) Satisfying Technical Requirements
(No residue, Easy peel-off etc)
Base film
Heat Resistant Adhesive
Thermal Release Adhesive
Liner
Liner
[Tape Construction] [Feature]
Substrate
Substrate
Thermo Release
Thermal release Tape
Target Application: Self Release ability is necessary
Wafer Level Package Thin wafer supportFragile surface
handling
Wafer
TapeSubstrate
MoldResin
TapeSubstrate
Chip
Substrate
e.g. MEMS Chip
Products can be released without any stress
Self Release Heat Resistant
Heat Resistant Bump Tape
Heat Resistant (≤ 150 ℃) Good bump encapsulation No residue after heating
Target Application
Wafer Backside coating process
No ResidueEasy peel-off
Bump wafer BG Tape Lamination
BG Wafer back side coating
Cure (<150°C) Detaping
Good bumpencapsulation
Heat resistant
Heat ResistantBump
Absorption
≤150℃
WfRing frame
Tape
Plating(Wet, 80°C)
High Heat Resistant Tape
Heat Resistant≤260℃ Very Low
Contamination
Heat Resistant (≤260 ℃) Easy peel-off after heating No residue after heating
Target Application:
Bumping reflow process with Tape
Bumping Reflow 260°C
Control adhesive strength Superior low contamination
High Adhesion tape Target Application:
Dry Lift-off
<Dry Metal Lift-off process>
Tape
Our proposal
Resist pattern Metalizing
Dry Lift-off
High Adhesion
(Equipment: TAKATORI AMR2200G )
Dry Lift-off
Advantage of Dry Lift-off
Easy to collect precious metal like Au
Saving of chemical and metal waste
Short tact-time (vs Wet lift-off)
No risk of surface damage (vs. Chemical Jet lift-off)
Summary
ICROSTM Tape widely cover semiconductor and Electronic components packaging process
Transparent DC tape(T : >90%@visible light)
Heat Resistant DC tape (150degC HR, with expandability)
Thermal Release Tape (150degC HHR & 190degC self release)
Heat Resistant and Bump Encap. Tape (150degC HR, ~ 250um Bump Encap. )
Summary
Back Grinding Tape(~ 250um Bump Encap. 1~2um TTV,)
High Heat Resistance Tape (260degC Heat Resistance)
High Adhesion Tape (Metal Lift-off by tape adhesion)
For detailed information, Please visit our booth : Hall A4, Booth No. 1004
≤150℃
≤260℃
≤150℃
≤150℃