Aiwa Cx Jds30

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CX-JDS30SERVICE MANUALVer. 1.0 2005.04

E Model Russian Model

CX-JDS30 is the Amplifier, CD player, Tape Deck and Tuner section in DBX-DS30.

Model Name Using Similar Mechanism CD Section TAPE Section CD Mechanism Type Optical Pick-up Name Model Name Using Similar Mechanism Tape Transport Mechanism Type

CX-JDS20 BU-F1BD81AA KSM-215DCP/C2NP CX-JDS50 CMAL1Z240A

SPECIFICATIONSAmplifier section Russian model:DIN power output (rated): 120 + 120 watts (6 ohms at 1 kHz, DIN) Continuous RMS power output (reference): 150 + 150 watts (6 ohms at 1 kHz, 10% THD) Music power output (reference): 240 + 240 watts (6 ohms at 1 kHz, 10% THD) SPEAKER: accepts impedance of 6 to 16 ohms

Tuner sectionFM stereo, FM/AM superheterodyne tuner FM tuner section Tuning range Antenna Antenna terminals Intermediate frequency AM tuner section Tuning range Russian model: 87.5 108.0 MHz (50 kHz step) FM lead antenna 75 ohms unbalanced 10.7 MHz

CD player sectionSystem Laser Diode Properties Compact disc and digital audio system Emission duration: continuous Laser Output: Less than 44.6 W (This output is the value measurement at a distance of 200 mm from the objective lens surface on the Optical Pick-up Block with 7 mm aperture) 2 Hz 20 kHz (0.5 dB) More than 90 dB More than 90 dB

Other models:The following measured at AC 120, 127, 220, 240 V 50/60 Hz DIN power output (rated): 120 + 120 watts (6 ohms at 1 kHz, DIN) Continuous RMS power output (reference): 150 + 150 watts (6 ohms at 1 kHz, 10% THD) Inputs AUDIO IN (stereo mini jack): voltage 250 mV, impedance 47 kilohms MIC (phone jack): sensitivity 1 mV, impedance 10 kilohms Outputs PHONES (stereo mini jack): accepts headphones of 8 ohms or more

Other models:

Frequency response Signal-to-noise ratio Dynamic range

Tape deck sectionRecording system Frequency response 4-track 2-channel, stereo 50 13,000 Hz (3 dB), using Sony TYPE I cassettes

Antenna Antenna terminals Intermediate frequency

531 1,602 kHz (with the tuning interval set at 9 kHz) 530 1,710 kHz (with the tuning interval set at 10 kHz) 531 1,602 kHz (with the tuning interval set at 9 kHz) AM loop antenna External antenna terminal 450 kHz

Continued on next page

COMPACT DISC DECK RECEIVER

9-879-520-012005D1678-1 2005.04

Sony CorporationPersonal Audio Group Published by Sony Engineering Corporation

CX-JDS30

GeneralPower requirements Russian model: Mexican model: Other models: 230 V AC, 50/60 Hz 127 V AC, 60 Hz 120 V, 220 V or 230 240 V AC, 50/60 Hz Adjustable with voltage selector 245 watts

MODEL IDENTIFICATION BACK PANEL

Part No.

Power consumption

Dimensions (w/h/d) (excl. speakers): Approx. 230 365.5 409 mm Mass (excl. speakers) Approx. 9.1 kg3 # #

Design and specifications are subject to change without notice.

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Model MX model E51 model RU model Abbreviation E51 : Chilean and Peruvian models MX : Mexican model RU : Russian model

Part No. 2-595-344-0[] 2-595-524-0[] 2-599-604-0[]

SAFETY-RELATED COMPONENT WARNING!! COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY.

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CX-JDS30

The release method of a CD disc tray LOCK function There is a disc lock function for the disc theft prevention for a demonstration at a shop front in this machine. Procedue: 1. Press the ?/1 button to turn the set on. 2. Press two buttons of x and Z simultaneously for five seconds. 3. The message LOCKED is displayed and the tray is locked. (Even if exiting from this mode, the tray is still locked.) 4. Press two buttons of x and Z simultaneously for five seconds again. 5. The message UNLOCKED is displayed and the tray is unlocked. 6. To exit from this mode, press the ?/1 button to turn the set off. UNLEADED SOLDER Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead. (Caution: Some printed circuit boards may not come printed with the lead free mark due to their particular size) : LEAD FREE MARK Unleaded solder has the following characteristics. Unleaded solder melts at a temperature about 40 C higher than ordinary solder. Ordinary soldering irons can be used but the iron tip has to be applied to the solder joint for a slightly longer time. Soldering irons using a temperature regulator should be set to about 350 C. Caution: The printed pattern (copper foil) may peel away if the heated tip is applied for too long, so be careful! Strong viscosity Unleaded solder is more viscou-s (sticky, less prone to flow) than ordinary solder so use caution not to let solder bridges occur such as on IC pins, etc. Usable with ordinary solder It is best to use only unleaded solder but unleaded solder may also be added to ordinary solder.

NOTES ON HANDLING THE OPTICAL PICK-UP BLOCK OR BASE UNIT The laser diode in the optical pick-up block may suffer electrostatic break-down because of the potential difference generated by the charged electrostatic load, etc. on clothing and the human body. During repair, pay attention to electrostatic break-down and also use the procedure in the printed matter which is included in the repair parts. The flexible board is easily damaged and should be handled with care. NOTES ON LASER DIODE EMISSION CHECK The laser beam on this model is concentrated so as to be focused on the disc reflective surface by the objective lens in the optical pickup block. Therefore, when checking the laser diode emission, observe from more than 30 cm away from the objective lens. This appliance is classified as a CLASS 1 LASER product. The CLASS 1 LASER PRODUCT MARKING is located on the exterior.

Laser component in this product is capable of emitting radiation exceeding the limit for Class 1. CAUTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous radiation exposure. Notes on chip component replacement Never reuse a disconnected chip component. Notice that the minus side of a tantalum capacitor may be damaged by heat. Flexible Circuit Board Repairing Keep the temperature of the soldering iron around 270 C during repairing. Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). Be careful not to apply force on the conductor when soldering or unsoldering.

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CX-JDS30

TABLE OF CONTENTS 1. 2.2-1. 2-2. 2-3. 2-4. 2-5. 2-6. 2-7. 2-8. 2-9. 2-10. 2-11. 2-12. 2-13. 2-14. 2-15.

GENERAL ................................................................... 5 DISASSEMBLYDisassembly Flow ........................................................... Top Panel, Side Panel ...................................................... Front Section ................................................................... CD Mechanism Section ................................................... Cassette Mechanism Deck, DS-PAI/HP/MIC Board ...... DS-PANEL Board ........................................................... Rear Cabinet .................................................................... Power Trans ..................................................................... DS-MAIN Board, Heat Sink ........................................... Holder (CD Mech) ........................................................... Base Unit (BU-F1BD81AA), CD Mech ......................... BD Board, Optical Pick-up (KSM-215DCP/C2NP) ....... Frame ............................................................................... Belt .................................................................................. Cassette Panel .................................................................. 7 8 8 9 9 10 10 11 11 12 12 13 13 14 15

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DIAGRAMS22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37

6-1. Block Diagram MAIN Section ................................. BD Section ................................................................ 6-2. Printed Wiring Board BD Section ............................ 6-3. Schematic Diagram BD Section ............................... 6-4. Printed Wiring Board MAIN Section ....................... 6-5. Schematic Diagram MAIN Section (1/2) ................. 6-6. Schematic Diagram MAIN Section (2/2) ................. 6-7. Printed Wiring Board PANEL Section ..................... 6-8. Schematic Diagram PANEL Section (1/2) ............... 6-9. Schematic Diagram PANEL Section (2/2) ............... 6-10. Printed Wiring Board PANEL COMB Section ........ 6-11. Schematic Diagram PANEL COMB Section ........... 6-12. Printed Wiring Board AMP Section ......................... 6-13. Schematic Diagram AMP Section ............................ 6-14. Printed Wiring Board POWER Section .................... 6-15. Schematic Diagram POWER Section ......................

7. 3. 4. 5. TEST MODE ............................................................... 16 MECHANICAL ADJUSTMENTS ......................... 17 ELECTRICAL ADJUSTMENTS .......................... 177-1. 7-2. 7-3. 7-4. 7-5.

EXPLODED VIEWSOverall Section ................................................................ Front Section ................................................................... Chassis Section ................................................................ CD Mechanism Section-1 ............................................... CD Mechanism Section-2 ............................................... 46 47 48 49 50

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ELECTRICAL PARTS LIST .................................. 51

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CX-JDS30 SECTION 1 GENERALThis section is extracted from instruction manual.