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Advanced SiP Technology and System DesignOct 19 - 20, 2017

Yang Zhang, Ph.D. Senior Director of EngineeringQualcomm Technologies, Inc.

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Agenda

• What is our view of SiP?

• Advantages and Vision

• Trial Products

• Future of SiP

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QTI (Qualcomm Technologies, Inc.) System In PackageWhat is our view of SiP?

• Cutting edge, genuine one chip solution for mobile devices

• All-inclusive – WWLAN (2G/3G/4G), WiFi/BT, GPS, all BB, RF, and PM

• Superior conformal molding and RF shielding

• Pre-certification for quick time-to-commercialization

• Support new competition in mobile industry

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Most SiPs are sub-systems for mobile devices

Current SiPs Commercially Available

• SiP consists of◦ Bare IC die◦ Packaged IC die (2D/3D)◦ SMT active and passive components◦ Integrated passive devices (IPD)◦ Embedded components◦ Performance enhancements• Thermal lids• Shielding• Stiffeners

Tracking devices

Smartphones

GPS SiPsRunning Monitors

WiFi/Bluetooth SiPsWearables

Tablets

3G/4G SiPsIoT/M2M Auto USB Dongles

POS

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A Genuine Mobile SiP!

SiP with Complete Mobile System

Smartphone SiPANT1 ANT0

WiFiMiMO

ANT2WiFi/BT/GPS

Dual MIPI Camera

LCD MIPI

Dual SIM

LED/Flash

Stereo Audio

TouchVibratorSDIOUSB HS

AccelerometerGeomagnetic

GyrosPressureProximity

TemperatureAmbient light

HapticsNFC

Finger PrintEthernet

I2C/SPI

UARTGPIOJTAGI2C

Processor & Memory(RAM+Flash)

Charging & Power Management

(PMICs)

ConnectivityWiFi/BT

TransceiversGPS

WWAN Rx/TxBB + RFFE

(Filters, PAs, Duplexers,

RF Switches)

Components not integrated for customer differentiation

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Integrating ~500 components into one chipMobile SiP Makes Phone Design Simple!

Conventional Phone-mounting over 500 components

Sample Mobile SiP

BT & WiFi

RFBB

PAPA

AP & Memory PM

Front Back

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SIP Benefit for Customers• No large design team and multiple board

turns required to design a phone• No longer need to manage hundreds of

suppliers

Simplified Supply Chain

Help OEMs reduce time-to-market and

cost

Reduce upfront investment and operating cost

Attractive business model

• Simplify complexities of wireless device design and tests

• Flexibility to focus on customization and differentiation

• Comprehensive solution to simplify process of designing, building, and manufacturing

• Reduce phone PCB layer count and burden for system designers

• Small form factor S-SIP to allow ID design flexibility

• Pre-tested and Pre-certification for cost effective ownership

Procurement

Design & Test

CertificationTime to Commercialization

NRE

Single chip solution for smartphone

400—500 components

9SIP designed to spread heat more efficiently

Phone with SiP (25x25mm)

Conventional Phonewith discrete chips

SIP (25x30mm) Flatness – Shadow Moire Test

Module structure engineered to achieve sub-60um max warpage despite large body size!

SiP AdvantagesThermal and Mechanical Performance

System Thermal System Mechanical

10 CLower

Hot Spot

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SiP Examples

Size: 25x25mmComponents: 325+Conformal ShieldingWAN/GPS/WiFi

Size: 24x29mmComponents: 450+Conformal ShieldingWAN/GPS/WiFi

Size: 19x22mmComponents: 120+Conformal ShieldingWAN/GPS

CAM

Speaker CAM

Speaker

Size: 23x24mmComponents: 480+Mental-can ShieldingWAN/GPS/WiFiChina OBOR support

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Future SIPsKey Areas for Innovation

• Single / Double Sided• Conformal / Compartmental• Waterproofing

• WLP / Flip Chip / IPDs• Cost reduction• Yield improvement

• Multiple bare IC die• IPDs• Passives

Embedding ComponentsBare Die IntegrationMolding/Shielding

Silicon

SiP

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Nothing in these materials is an offer to sell any of the components or devices referenced herein.

©2017 Qualcomm Technologies, Inc. and/or its affiliated companies. All Rights Reserved.

Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries. Other products and brand names may be trademarks or registered trademarks of their respective owners.

References in this presentation to “Qualcomm” may mean Qualcomm Incorporated, Qualcomm Technologies, Inc., and/or other subsidiariesor business units within the Qualcomm corporate structure, as applicable. Qualcomm Incorporated includes Qualcomm’s licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a wholly-owned subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm’s engineering, research and development functions, and substantially allof its product and services businesses, including its semiconductor business, QCT.

Thank you