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Advanced From Technologies to Markets Packaging Quarterly ...
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© 2021
From Technologies to Markets
Q1 2021
Advanced Packaging
Quarterly Market Monitor
Sample
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• Stefan CHITORAGA
• AnalystSemiconductor Packaging
› Experience
7+ years in electronics package development and design
› At Yole
Packaging, assembly and substrates
› Education
M.Sc of Engineering in Electroncis and Computer
Science
SEMICONDUCTOR PACKAGING TEAM
Santosh KUMAR
Principal Analyst
Semiconductor Packaging
› Experience
15+ years in semiconductor industry
› At Yole
Package, assembly and substrates and Manufacturing
› Education
M.Sc in Materials Science and Engineering, Electronics
Packaging
Favier SHOO
Team Lead Analyst
Semiconductor Packaging
› Experience
8+ years in technology, packaging and manufacturing
› At Yole
Packaging, assembly and substrates
› Education
Bachelor in Materials Engineering (Hons)
Minor in Entrepreneurship
Vaibhav TRIVEDI
Senior AnalystSemiconductor Packaging
› Experience
12+ in electronics business
› At Yole
Packaging, assembly and substrates
› Education
M.Sc in Materials Science and Engineering
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021 3
ADVANCED PACKAGING MONITOR - EVOLUTION
Advanced Packaging Monitor
Fan out Package Monitor (Wafer & Panel Level)
WLCSP / Fan-In Package Monitor
2.5D/3D Stacked Package
FCBGA Package
FCCSP Package
System In Package (SiP)
Module I
Module III
Module IV
2019 Q4 released
2020 Q1 released
2021 Q1
Publication Date
Module II
2020 Q3 released
2020 Q4 released
Module V
Module VI 2021 Q3
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021 4
ADVANCED PACKAGING MONITOR SCOPE
The main objectives of this monitor are the following:
• Near-term market dynamics on quarterly basis
• Long-term market dynamics for 2019-2025
• CapEx & Capacity per major players
• Market share of major OSAT/Foundry players
• Package ASP per given market/platform
• Device/application adoption for advanced packaging technologies
The Fan-Out, WLCSP / Fan-In, 3D Stack (NEW), FCBGA (NEW), FCBGA, and FCCSP (NEW) markets are studied from the following angles:
• Supply and demand
• End-user applications and key growth drivers/areas
• Process technologies
• Device application Mix
• Production, CapEx, Revenue and Package ASP
• **WLCSP components used in RF-SiP packages are NOT included in the WLCSP category – This will be provided in future update to the monitor
• 3D stacked package include Logic & DRAM wafers (NEW): 3D Stacked package includes HBM, 3DS DRAM, 3D NAND, 3D SoC/SoIC, 3D stacked CMOS Image Sensors
• FC package family will be added in future update of the Advanced Packaging Monitor
• Revenue & ASP reflect packaging service only. Final Test is NOT included.
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ADVANCED PACKAGING MONITOR METHODOLOGY
Mobile/Consumer etc. Markets
End systems/ Phones/
Wearables
Device such as PMIC/ SoC etc.
Package Type
# of Die, components,
Package Construction
# of Wafers
OSAT/Foundry Suppliers
Supplier market share per package
Top-down approach
Bottom-up approach
MONITOR
Consumer Automotive
Medical
IndustrialTelecom &
Infrastructure
Mobile
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021 6
KEY TERMS & DEFINITIONS AS USED IN THIS MONITOR
FCCSP:
• Defined as a package that is processed as strip based typically ranging from 5 x 5 to 13 x 13
• Typical BOM (Bill of Materials) include substrate, mold, solder balls, and in some cases underfill
• FCCSP substrate typically are 2L or 4L substrate and with some ETS based
• FCCSP revenue is defined as services that include wafer backgrinding, die singulation and fc assembly on the substrate and also include bill of materials such as substrate and assembly materials such as mold.
• FCCSP wafer bumping is separately reported in terms of wafer volume & revenue & supplier market share
FCBGA:
• Defined as a singulated package (Not Strip based processing for assembly)
• Typically larger than 15 x 15 and can go as high as 60 x 60 in high end applications
• Typically includes Lid and TIM 1 (Thermal Interface Material) for cooling purposes
• BOM (Bill of Materials) also include HDI (High Density Interconnect) substrate
• FCBGA revenue is defined as die prep that includes backgrinding, die singulation and fc assembly on the substrate
• FCBGA wafer bumping is separately reported in terms of wafer volume & revenue & supplier market share
WLP:
• Defined as a wafer level package that is processed based on wafer level manufacturing process
• WLP package can have the same package size as the starting die dimensions such as in the case of WLCSP
• WLP package can have increased package size than the die size as seen in many FO (Fan-out) packages.
• WLP package BOM does NOT include any substrate.
• However, WLP BOM can include assembly materials such as backside lamination, mold compound in the case of fan-out package
TABLE OF CONTENTS▪ KEY METRICS AT A GLANCE 12
▪ Revenue (WLP, WLCSP, FO, 3D, FCBGA, FCCSP)
▪ Shipments (WLP, WLCSP, FO, 3D, FCBGA, FCCSP)
▪ Market Share (WLP, WLCSP, FO, 3D, FCBGA, FCCSP)
▪ Summary of WLCSP, FOWLP & FO-PLP, 3D, FCBGA, FCCSP
market dynamics
▪ ANALYST COMMENTARY & MARKET DYNAMICS 27
▪ SYSTEM DEMAND 36
▪ WLCSP Package demand
▪ Fo package demand
▪ 3d STACKED PACKAGE DEMAND
▪ Fcbga package demand (new)
▪ FCCSP PACKAGE DEMAND (NEW)
▪ FCCSP PKG MARKET DYNAMICS 45
▪ FCCSP Package Market dynamics – summary
▪ Revenue – historical & forecast
▪ Shipments – historical & forecast
▪ Supplier Market shares (OSAT/FOUNDRY/IDM)/
▪ Long term/Near term dynamics & FC CapEx
▪ FCCSP PACKAGE SUPPLY 62
▪ FCBGA PACKAGING MARKET DYNAMICS 65
▪ Revenue – historical & forecast
▪ Shipments – historical & forecast
▪ Supplier Market shares (OSAT/FOUNDRY/IDM)
▪ Long term/Near term dynamics
▪ FCBGA PACKAGE SUPPLY 80
▪ 3D STACKED PACKAGING MARKET DYNAMICS 83
▪ 3D STACKED Market dynamics – summary
▪ Revenue – historical & forecast
▪ Shipments – historical & forecast
▪ Supplier Market shares (OSAT/FOUNDRY/IDM)
▪ Long term/Near term dynamics
▪ 3D STACKED PACKAGE SUPPLY 96
TABLE OF CONTENTS
▪ WLCSP MARKET DYNAMICS 99
▪ Revenue – historical & forecast
▪ Shipments – historical & forecast
▪ Supplier Market shares (OSAT/FOUNDRY)
▪ WLCSP ASP per markets & size
▪ Near-term shipment & pricing outlook
▪ WLCSP supply 113
▪ FO MARKET DYNAMICS 117
▪ FOWLP/FOPLP Market dynamics – summary
▪ Revenue – historical & forecast
▪ Shipments – historical & forecast
▪ Supplier Market shares (OSAT/FOUNDRY)
▪ FOWLP ASP per markets & size
▪ Near-term shipment & pricing outlook
▪ Capex & Capacity
▪ FO PACKAGE SUPPLY 138
TABLE OF CONTENTS▪ SUPPLIER DETAILS (FCBGA, FANOUT, WLCSP, & 3D
STACKED IC PACKAGE) 142
Foundry
▪ TSMC
▪ UMC
IDM
▪ INTEL
▪ SONY
▪ SAMSUNG
▪ TI
Manufacturers/Players
▪ MICRON
▪ SK HYNIX
▪ YMTC
▪ SEMCO
▪ ASE w/SPIL
▪ JCET
▪ AMKOR
▪ PTI
▪ TFME
▪ NEPES LAWEH/DECA
▪ CHINA WLCSP
▪ HUATIAN
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WHO SHOULD BE INTERESTED IN THIS MONITOR
Equipment & material suppliers:o To identify new business opportunities and prospects
o To understand the differentiated value of your products and technologies
o To identify technology trends, challenges and precise requirements
o To evaluate your Advanced Packaging technologies’ market potential
o To position your company in the market
o To monitor and benchmark your competitors
OSATs, IDMs & Foundries:o To understand technology trends related to Advanced Packaging platforms
o To spot new opportunities and define diversification strategies
o To understand the overall Advanced Packaging market
o To monitor and benchmark potential competitors
o To understand the supply chains involved in Advanced Packaging
R&D organizations:o To evaluate the potential of future technologies and products
o Identify market needs for new applications
o To understand the bottle necks of the Advanced Packaging technology anddirect their resources to solve the technical issues
o To identify the best candidates for technology transfers
o To identify the partners for consortia
Financial & Strategic investors: To identify new business opportunities and prospects
To understand the market potential of Advanced Packaging
To understand which players will benefit from Advanced Packaging adoption
To understand the players that are investing in the Advanced Packaging business
OEMs & Integrators: To understand technology trends in Advanced Packaging platforms
To spot new opportunities and define diversification strategies
To understand the overall Advanced Packaging market
To monitor and benchmark potential competitors
To understand the supply chains including the equipment / material suppliers
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021
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GLOSSARY
Abbreviation Meaning
APE Application Processor Engine
ASIC Application-Specific Integrated Circuit
BEOL Back-end Of Line
BGA Ball Grid Array
CSP Chip Scale Package
DSP Digital Signal Processor
ECD Electro-Chemical Deposition
EMC Epoxy Mold Compound
ePLP embedded Package-level-Packaging
ePoP embedded Package-on-Package
eWLB embedded wafer-level BGA
F2F Face to face
FC Flip-Chip
FCIP Flip-Chip In Package
FO Fan-Out
FOWLP Fan-Out Wafer-level Packaging
FPGA Field-Programmable Gate Array
HDI High Density Interconnect
HPC High Processing Computer
HVM High Volume Manufacturing
HD FO High Density Fan-Out
IC Integrated Circuits
IDM Integrated Device Manufacturers
IO Inputs/Outputs
IP Intellectual Property
Abbreviation Meaning
IPD Integrated Passive Devices
L/S Line/Space
LVM Low Volume Manufacturing
MCM Multi Chip Module
MCP Multi Chip Package
OEM Original Equipment Manufacturer
OSAT Outsource Semiconductor Assembly and Test
PCB Printed Circuit Board
PMIC Power Management Integrated Circuit
PMU Power Management Unit
PoP Package on Package
PVD Physical Vapor Deposition
PWB Printed Wiring Board
QFN Quad flat No lead package
RCC Resin Coated Copper
RCP Redistributed Chip Package
RDL Redistribution Layer
SiP System in Package
SoC System on Chip
TMV Through-Mold-Via
TPV Through-Package-Via
TSV Through-Silicon-Via
UBM Under Bump Metalization
WLCSP Wafer-Level Chip Scale Package
WLFO Wafer-Level Fan Out
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021
KEY METRICS AT A GLANCE
FOR WLP, WLCSP, FAN-OUT, FCBGA, FCCSP,AND 3D
STACKED IC PACKAGES
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021 13
A RECORD YEAR FOR THE OSATS: 2020 OSAT RANKINGS (PER REVENUE)
Top OSATs saw 15-20% increase in 2020 revenue compare to 2019 and 2021 is expected to shape up as a “Banner Year” for OSATs.
16 776
5 051
3 951
2 679
1 623
1 282
1 019
809
784
702
517
507
487
461
437
413
370
358
341
340
314
304
292
226
192
ASE (rev w/SPIL & w/ USI)
Amkor
JCET Group
Powertech Technology
Tongfu Microelectronics
Tianshui Huatian Microelectronics
King Yuan Electronics
ChipMOS Technologies
Chipbond Technology
UTAC
Greatek Elec
SFA semicon
Orient Semiconductor Electronics
Hana Micron (Rev w/o Hana Materials)
Sigurd Microelectronics
Carsem
AOI Electronics
Tong Hsing
Formosa Advanced Technologies
Ardentec
Unisem Berhad
Nepes Corporation
Inari Amertron Berhad
Walton Advanced Engineering
Lingsen Precision Industries
TOP 25 OSAT ranking by 2020 revenue [M USD]
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021 14
TOTAL FC & WL PACKAGING MARKET DYNAMICS (FCBGA, FAN-OUT, WLCSP & 3D STACKED) - UNITS
-
20 000
40 000
60 000
80 000
2019 2020 2021 2022 2023 2024 2025 2026 2020 - 2026 CAGR
FC & WL Total Packaged Units Forecast (Mu)
FO WLCSP FCBGA FCCSP 3D Stacked
Overall Advanced Packaging form factors are expected to grow at 6% CAGR (2020-2026) with fcCSPand WLCSP leading in terms of total number of units.
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021 15
TOTAL FC & WL PACKAGING MARKET DYNAMICS (FCBGA, FAN-OUT, WLCSP & 3D STACKED) - REVENUE
$-
$10 000
$20 000
$30 000
$40 000
2019 2020 2021 2022 2023 2024 2025 2026 2020 - 2026 CAGR
FC & WL Package Revenue Forecast (M USD)
FO WLCSP FCBGA (Bumping) FCBGA (Assy & Sub) FCCSP (Bumping) FCCSP (Assy & Sub) 3D Stacked
Total Advanced Packaging Revenue is expected to grow at 7.9% CAGR (2020-2026) as 5G, automotive infotainment/ADAS, AI, Datacenter and wearable application megatrends continue to thrive the semiconductor eco-system
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021 16
Amkor
10%
ASE
23%
JCET
8%
TongFu (TFME)
3%PTI
2%Huatian
4%
Samsung
14%
Others
36%
FCCSP PACKAGING SERVICE MARKET SHARE
FCCSP PACKAGING SERVICE MARKET SHARE (2020 REVENUE)
Others**: Include Memory suppliers, smaller OSATs, direct OEM customers purchasing the substrate.
$5.5B
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3D STACKED PACKAGE APPLICATION MIX
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021
HBM; 0,21%
3DS; 1,09%Si Interposer; 0,07%
Foveros; 0,02%
Co-EMIB; 0,00%
3D SoC; 0,00%
3D NAND; 0,10%
24,69%
73,82%
2019 3D Stacked Device Mix
HBM 3DS Si Interposer Foveros Co-EMIB 3D SoC 3D NAND CIS MEMS
© 2020 | www.yole.fr | Advanced Packaging Market Monitor | Q4 2020 18
Amkor
6%
ASE
20%
JCET
5%
TongFu (TFME)
4%
PTI
1%Huatian
2%Intel
41%
Others
21%
FCBGA TOTAL (BUMPING & PACKAGING SERVICES) SUPPLIER MARKET SHARE (REVENUE)
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021
© 2020 | www.yole.fr | Advanced Packaging Market Monitor | Q4 2020 19
ADVANCED PACKAGING QUARTERLY MARKET MONITOR CONTENT
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021
© 2020 | www.yole.fr | Advanced Packaging Market Monitor | Q1 2020 20
ADVANCED PACKAGING QUARTERLY MARKET MONITOR CONTENT
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021
© 2020 | www.yole.fr | Advanced Packaging Market Monitor | Q1 2020 21
ADVANCED PACKAGING QUARTERLY MARKET MONITOR CONTENT
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021
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ADVANCED PACKAGING QUARTERLY MARKET MONITOR CONTENT
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021
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WLP MONITOR CONTENT: WLCSP & FO REVENUE PER PLAYER
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021
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MONITORS AND TRACKS COMBINATION
From module technical content to market forecast and market sharesAdvanced Packaging
Quarterly Market
Monitor
Packaging Service
DRAM
& NAND
Quarterly Market
Monitor
Memory Service
Application Processor
Quarterly Market
Monitor
Computing Service
Market Monitorsby Yole Développement
› Market shares evaluation
› Market and technology forecasts
TeardownTracksby System Plus Consulting
› Design win identification
› Technology assessment
Consumer
Smartphones,
Smart Homes, Wearables
Combine the expertise of
Yole Développement
and
System Plus Consulting :
with our products, get a deep
understanding on the technology,
market and trends of the
semiconductor industry
Automotive
ADAS, Infotainment,
Connectivity© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021
25
Contact our
Sales Team
for more
information
High-End Performance Packaging: 3D/2.5D Integration 2020
Status of the Advanced Packaging Industry 2020
Fan-Out Packaging Technologies and Market 2020
WLCSP/ Fan-In Packaging Technologies and Market 2020
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021
YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement
26
Contact our
Sales Team
for more
information
RF Teardown
© 2021 | www.yole.fr | Advanced Packaging Market Monitor | Sample | Q1 2021
YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting
Iphone 12 Teardown
27
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