Advance Engineering Mathematics Presentation
-
Upload
freddielisto -
Category
Documents
-
view
225 -
download
0
Transcript of Advance Engineering Mathematics Presentation
-
8/14/2019 Advance Engineering Mathematics Presentation
1/26
1
Card_Hz Manual,Version 4.00
Copyright 2005 Advanced Thermal Engineering, Inc.
All Rights Reserved
P. O. Box 4528Huntsville, AL 35815
USA
-
8/14/2019 Advance Engineering Mathematics Presentation
2/26
2
Electronic PackagingFour Thermal Frame Options
-
8/14/2019 Advance Engineering Mathematics Presentation
3/26
3
Electronic Packaging
Graphical User Interface
Input the printed wiring board
(PWB) dimensions.
Input the thermal frame values.
Move scroll bars and click
option buttons to create an
interactive trade study.
This executable (28 kb) and dynamic
link library (398 kb) operate on an MS
Windows platform (3.0 or later).
-
8/14/2019 Advance Engineering Mathematics Presentation
4/26
4
Card_HzCircuit Card Assembly (CCA) Capacity
Make the CCA compatible with
the vibration environment. The
long edge should be in the
housing and the short edge shouldbe in the connector mating to the
motherboard.
Solve the size problem before
the vibration requirements
demand a smaller CCA.
Manage your resources before a
conflict exists between
disciplines.
-
8/14/2019 Advance Engineering Mathematics Presentation
5/26
5
Card_HzFour Structural Solutions
Electrical Engineers use it
as a quick solution.
Industrial (Reliability)Engineers use it as a
simplified solution.
Mechanical Engineers use
it as a sanity check.
-
8/14/2019 Advance Engineering Mathematics Presentation
6/26
6
Electronic PackagingReliability
Calculate the Reliability. The Reliability Engineers calculate the card
reliability. It is based on maximum single amplitude deflection and
the number of cycles. Less deflection is good, it creates less normal
stress acting on the longitudinal fibers of the materials. Less time invibration is good, it creates less cycles for fatigue. Dave S. Steinberg
recommends no more than 0.3% of the shorter edge be allowed for
maximum single amplitude deflection to avoid components breaking
their solder joints.
-
8/14/2019 Advance Engineering Mathematics Presentation
7/26
7
Users Guide
-
8/14/2019 Advance Engineering Mathematics Presentation
8/26
8
Card_HzCopyright 2005 Advanced Thermal Engineering, Inc.
All Rights Reserved
hz400.exe 28 kb
lice400.doc 4 kb
read400.doc 5 kb
vbrun300.dll 398 kb
The executable (*.exe) and
dynamic link library (*.dll) files
must be in the same directory.
The legal license is found in the
two MS Word files (*.doc).
Select the executable file to start
the program. Select buttons to
navigate the various forms.
-
8/14/2019 Advance Engineering Mathematics Presentation
9/26
9
Card_HzLook and Feel of the Program
The selection of buttons will move the
program forward or backward throughthe interactive forms. Scroll bars and
option buttons will change default
values to unique values. Moving
through the forms will bring the user to
the final results of a particular trade
study. Every form has a button to endthe program.
-
8/14/2019 Advance Engineering Mathematics Presentation
10/26
10
Card_Hz
Forms of the Program
Table I. Form Titles
Name Title
Start: Form 1 (Options) Introduction (Form 1 of 3)
Form 2 (Input) PWB Mechanical Design (Form 2 of 3)
Finish: Form 3 (Input/Output) Results (Form 3 of 3)
-
8/14/2019 Advance Engineering Mathematics Presentation
11/26
11
Card_Hz
Navigating the Program
tart: orm 1
orm
inish: orm
-
8/14/2019 Advance Engineering Mathematics Presentation
12/26
12
Card_Hz
Manipulating the Program
When the program starts
Form1 is displayed. The usermoves forward to Form 2 to
change default values and
complete his trade study on
Form 3. If the results are not
acceptable to the user, hesimply moves backward to the
various forms to update new
unique values for his design.
tart Form 1
Form 2
Finish Form 3
-
8/14/2019 Advance Engineering Mathematics Presentation
13/26
13
Form Details
-
8/14/2019 Advance Engineering Mathematics Presentation
14/26
14
Start: Form 1
-
8/14/2019 Advance Engineering Mathematics Presentation
15/26
15
Start: Form 1Options
Select Forward to moveforward to the next form.
(Select End the Program if
you wish to end the program
session.)
-
8/14/2019 Advance Engineering Mathematics Presentation
16/26
16
Form 2
-
8/14/2019 Advance Engineering Mathematics Presentation
17/26
17
Form 2Options
1. Select PWB Width (6.200).
2. Select PWB Height (8.0).
3. Select Thermal Frame values if itis not standard aluminum plate.
4. Select Return to return to Form 1.
5. Select Forward to advance to
Form 3.
6. (Select End the Program if you
wish to end the program session.)
-
8/14/2019 Advance Engineering Mathematics Presentation
18/26
18
Finish: Form 3
-
8/14/2019 Advance Engineering Mathematics Presentation
19/26
19
Form 3Options
1. Select any Thermal Frame
Options option button.
2. Results are displayed for thatCCA.
3. Select Card to return to the
Form 2.
4. (Select End the Program toend the program session.)
-
8/14/2019 Advance Engineering Mathematics Presentation
20/26
20
Form 3Details (1 of 2)
1. The CCA mass is based on high density packaging on a PWB.
2. The CCA is a lightly damped system and thus the undamped natural
frequency is used to approximate the resonant frequency.
3. The frequency is based on the single amplitude deflection of a uniformly
loaded beam fixed at two opposite sides. This span is the PWB width.Dynamic response to an input perpendicular to the plane of the PWB will
excite the built in strength of the CCA based on a classical single degree of
freedom spring, damper, and mass system.
4. The transmissibility is based on the CCA frequency (Reference 5).
5. The maximum allowable single amplitude deflection is based on 0.3 % of the
shorter edge (Reference 5).
6. The maximum sine vibration input is based on the classic spring, damper,
mass model.
7. The maximum random vibration input is based on the classic spring, damper,
mass model excited by 3 times the Root Mean Squared value at resonance.
-
8/14/2019 Advance Engineering Mathematics Presentation
21/26
21
Form 3Details (2 of 2)
1. The shock vibration response
is based on a square wave
input of6 or 11 milliseconds.
2. The shock transmissibility cannot develop beyond 2.0
(Reference 6).
3. The maximum input is based
on the classic spring, damper,
mass system.
-
8/14/2019 Advance Engineering Mathematics Presentation
22/26
22
Form 3
CCA Option 1
This is the basic
PWB in a chassis
held by lockingcard guides.
-
8/14/2019 Advance Engineering Mathematics Presentation
23/26
23
Form 3
CCA Thermal Frame Option 2
Each DIP package is
mounted on a thermal
rail finger and everylead is in a plated
through hole. The rails
combine into a plane at
the edge of the PWB to
extend beyond the
PWB into the housingand mounts two wedge
locks that hold it in a
chassis slot.
-
8/14/2019 Advance Engineering Mathematics Presentation
24/26
24
Form 3
CCA Thermal Frame Option 3
This has a PWB with
surface mount
technology (SMT)components and a
circuit side thermal
plane. The thermal
plane extends beyond
the PWB into the
housing and mounts
two wedge locks that
hold it in a chassis
slot.
-
8/14/2019 Advance Engineering Mathematics Presentation
25/26
25
Form 3
CCA Thermal Frame Option 4
This is like option 3 with an
additional PWB bonded to the
thermal plane. Each PWBbonds its circuit side to the
thermal plane. The extra PWB
has jumper wires to the first
PWB, located opposite the
connector. All input and
output is managed through theconnector of the first PWB.
The thermal plane has two
wedge locks to hold it in a
chassis slot.
-
8/14/2019 Advance Engineering Mathematics Presentation
26/26
26
References
1. Schaums Outline Series, Theory and Problems of Strength ofMaterials, 2nd Ed., William A. Nash, McGraw-Hill BookCompany, New York, N. Y., 1972.
2. Marks Standard Handbook for Mechanical Engineers, 8th Ed.,Theodore Baumeister, Editor, McGraw-Hill Book Company,
New York, N. Y., 1978.3. Principles of Dynamics, Donald T. Greenwood, Prentice-Hall,
Englewood Cliffs, New Jersey, 1965.
4. Advanced Engineering Mathematics, 3rd Ed., Erwin Kreyszig,John Wiley, New York, N. Y., 1972.
5. Vibration Analysis for Electronic Equipment, Dave S.Steinberg, John Wiley & Sons, New York, N. Y., 1973.
6. Application Selection Guide, Barry Controls, Bulletin C5-178,Barry Wright Corp., 1978.