Adopt Open AI, Compute, Storage and Total Solution

Alan ChangDeputy GM & Sr. Director of Server Product Line, Inspur

Path to Adoption

Marketplace

FSI CoSP

E&Ge-Commerce

San JoseGoose LakeJDM

Productize

CSP

Crane MountainOlympus StorageOAM AI NoteMission Bay

OAI

Rack and

Power

ODCC

ServerOpenRMC Storage

High Density Compute on Tencent Cloud

2U 4S OCP Compute Node

Jason WaxmanIntel CVP in 2019 OCP Global Summit

High Performance

Run computing-intensive services

High Frequency

Solve insufficient core density

High I/O

Reducecommunication delay

Powering Computing Services for a FinTech Cloud Customer

2 0 0 % p e r f o r m a n c e i n s a m e s p a c e

2 3 % c o s t r e d u x

c o m p a r e d t o 2 d u a l - s o c k e t s e r v e r s

4CPU & 48RAM

Customer Needs: • Larger capacity and higher

performance cloud DB• More VMs for cloud ECS

OCP Solution:• Inspur NF8260M5

Application:• Cloud ECS (high reliability,

manageability and flexibility)

https://pmem.cfapps.eu10.hana.ondemand.com/

SAP HANA Value Prop

7

With Intel® Optane™ Persistent Memory

Simpler Queries Lower Platform TCOLandscape Consolidation

Customer Data in 4 CPU Systems

Before & After Persistent Memory

DRAM used to store HANA Main Data

DRAM used for Working Memory

PMEM used to store HANA Main Data

HA

NA

Dat

a in

TB

0Haswell &Ivy Bridges

Broadwell Skylake Cascade Lake

3

4

6

1.5

9

3

3

2

2.1.5

1.53

3

Intel Persistent Memory

6

3

12

3

HANA Transactional Workloads4-CPU system: DRAM vs. Intel® Optane™ persistent memory DIMM

DRAM used for Working Memory PMEM used to store HANA Main DataDRAM used to store HANA Main Data

Total:3,072 GB

Storage

DRAM:3,072 GB

Total:4,608 GB

DRAM:1,536 GB

64 128

64 128

64

12864

128

64 128

64 128

64 128

64 128

64

12864

128

64 128

64 128

64 128

64 128

64

12864

128

64 128

64 128

64 128

64 128

64

12864

128

64 128

64 128

Persistent Memory:3,072 GB

Storage

64 64

64 64

64

6464

64

64 64

64 64

64 64

64 64

64

6464

64

64 64

64 64

64 64

64 64

64

6464

64

64 64

64 64

64 64

64 64

64

6464

64

64 64

64 64

Existing HANA 1 / HANA 2 Systems Future Landscape HANA 2 SP04+

Storage

Deliver More for Less

SAP HANA Use Case With Intel® Optane™ Persistent Memory

SaveMore

SimplifyConsolidate

MoreCapacity 100%

Lower Cost/System

Scale-out21 Node

Scale-up8 Node

40% + TCO Saving

Technology Pipeline

Adopting OCP Universal Baseboard (UBB) and OAI (Open Accelerator Infra) Design

OCP CTO Bill Carter showing Inspur UBB in 2019 OCP Amsterdam Summit

Announced in OCP summit, Amsterdam

Inspur 21” OAM reference Platform

NF5468M6 6U 8x AI Acceleration Module

UBB Designed to Support Flexible Topology Designs

Consider a Grid of Planar OAM sites

Standard Volumetric

Protocol Agnostic Interconnects

Common Components and Connectors

OAMUBB

AI Use Case 1: Open Rack with Dual San Jose Nodes Connecting 8xOAMs

System Topology

4x Inspur 3OU OAM systems

8x San Jose Nodes

4x Inspur 3OU OAM systems

4x 4 SocketOlympus Nodes

AI Use Case 2: OCP Accepted JBOG and Compute NodesSupport retail / shopper analytics

Closed Division Times much improved

4x Inspur 3OU ON5388M5V100 SXM 2GPU Expansion

8x ON5263Head Nodes

Head Node Head Node

GPU 5 GPU 4

GPU 7 GPU 6

GPU 1 GPU 0

GPU 3 GPU 2

P20

P12

P8

P16

P0

P4PEX9707_B

P16

P8

P0

P12

P4 P20

PEX9707_A

P0

P12

P8

P16

P20

P4PEX9707_C

Up Stream Post Slot B2 Slot B1 Slot B0 Slot A2 Up Stream PostSlot A0 Slot A1

PCIe x16

NVLINK V100

NVLINK V100/P100

Open Storage Platform Collaboration with Samsung

Disaggregated and Shared

NVMeoF Interface Cascades with the JBOF in 1U Chassis

Contributing Hardware

Inspur Switches on SONiC

Join the SONiCcommunity

Contribute Hardware

Ongoing Commitment

25GE high-density TOR switch100GE Spine-Leaf switch

Open For All

Adoption beyond Hyperscale

Technology PipelineStrong Community

Thank You

For more information, please visitwww.inspursystems.com