Adesto CBRAM Memory - System Plus Consulting · Memory 2016 AMD World’s First HM-Powered Product...
Transcript of Adesto CBRAM Memory - System Plus Consulting · Memory 2016 AMD World’s First HM-Powered Product...
COMPLETE TEARDOWN
WITH:
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• Estimated sales price
Adesto CBRAM Memory
Title: Adesto CBRAM
Memory
Pages: 76
Date: May 2017
Format: PDF & Excel file
Price: Full report:
EUR 2,990
Ultra-low power, ultra-fast memory die designed for the Internet-of-Things and wearables
Conductive-Bridging Random Access Memory (CBRAM®) from AdestoTechnologies.
The memory die comes in Narrow Small Outline Integrated Circuit (SOIC)packaging. We have analyzed devices from 32 kbit to 512 kbit @1MHz speed,and found they all have, surprisingly, the same die size. Another interestingthing is the integration of one transistor, one resistor (1T1R), type memory withinnovative materials, leading to easy CMOS integration.
This report analyzes the complete component, from the package to the diedeveloped by Adesto Technologies and licensed by Infineon. The reportincludes a complete analysis of the resistive layer which forms the memorycells. We use cross-sections of the die and removal of the metal layers tounderstand the technology. We also provide a complete description of thememory cell process to explain the manufacturing.
Finally, the report includes a complete cost analysis and a selling priceestimation of the CBRAM components.
The Internet-of-Things and wearables arethe exciting new frontier for OriginalEquipment Manufacturers (O EMs) .Consequently, from smartwatches to GPStracking devices, low power consumptionand high speed have become the keychallenge for device designers. And thememory component can be key in reducingpower consumption. Electrically ErasableP ro g ra m m ab l e Re ad - O nl y M e m or y(EEPROM) needs a non-negligible current inwrite mode. Therefore, alternative Non-Volatile Memory (NVM) is needed, like the
TABLE OF CONTENTS
Overview / Introduction
Adesto Technologies Company Profile
Physical Analysis• Physical Analysis
Methodology
• Package
View and dimensions
Package opening
Package cross-section
• Memory Die
View, dimensions and markings
Cross-section: metal layers, memory switch, transistor
Die metal deprocessing
Die delayering, main block ID and process
• Die Process Characteristics
Author (Lab):VéroniqueLe Troadec
AUTHORS:
Consulting in 2011 to setup itslaboratory. He previouslyworked for 25 years atAtmel Nantes TechnologicalAnalysis Laboratory as fabsupport in physical analysis,and for three years at HirexEngineering in Toulouse, in adestructive physical analysislab.
Yvon Le Goff (Lab)
Yvon has joinedS y s t e m P l u s
StéphaneElisabeth
Stéphane has adeep knowledge
of materials characterizationsand electronics systems. Heholds an Engineering Degree inElectronics and NumericalTechnology, and a PhD inMaterials for Microelectronics.
Manufacturing Process Flow
• Wafer Fabrication Unit
• Resistive Switch Process Flow
• Final Assembly Unit
Cost Analysis• Cost Analysis Overview
• The Main Steps Used in the Economic Analysis
• Yield Hypotheses
• Die Cost
Front-end (FE) cost
Back-end: tests and dicing
Wafer and die cost
• Component
Packaging cost
Component cost
Estimated Price Analysis
System Plus Consulting offers
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Cost simulation tool to
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The tool performs the
necessary cost simulation of
any Integrated Circuit: ASICs,
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ANALYSIS PERFORMED WITH OUR COSTING TOOLS MEMS COSIM+ AND IC PRICE+
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3D TSV and 2.5D Business
Update – Market and
Technology Trends 2017
Emerging Non-Volatile Memory 2016
AMD World’s First HBM-Powered Product
SK Hynix 3D TSV High-Bandwidth Memory
3D integration, a leading-edgetechnology supporting high-performance applications - Fromimaging to artificial intelligence, anentire ecosystem in motion.
The new Storage-Class Memory(SCM) category will be the biggestemerging NVM market, withembedded MCU seeking emergingNVM for strategic differentiation.
The first ever 3D IC combining DRAMand GPU with TSV and siliconinterposer packaging analysis andreverse costing report.
Pages: 300+Date: May 2017Full report: EUR 6,490*
Pages: 275+Date: July 2016Full report: EUR 6,490*
Pages: 120Date: September 2015Full report: EUR 3,490*
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