© 2006 Hewlett-Packard Development Company, L.P.The information contained herein is subject to change without notice

Adaptive Infrastructure

Power and CoolingJeff Otchis

September 2006

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Adaptive InfrastructureDelivering on the next generation data center vision

“24x7 lights-out computing environment, based on standard building blocks, automated using modular software, delivered through comprehensive services.”

Delivered today as modular systems, products, software and services, and tomorrow through an integrated common architecture.

• Lower cost of IT operations• Higher quality of service• Speed in introducing IT change

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AutomationVirtualizationSecurityIT Systems & Services

Adaptive InfrastructureKey enablers

Current state Future stateHigh-costIT islands

Low-costpooled ITassets Automated 24x7

lights-out computing

Power & Cooling Management

• Scalability based on standards

• IT services and solutions

• Energy-efficient computing

• Proactive best practices and built-in protection

• Pooling and sharing of IT resources to optimize utilization

• Dynamic IT re-deployment to meet changing business demand

• Unified Infrastructure Management

Key enablers

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“Maximize power density while achieving optimal power utilization”

• Efficient systems –processor, servers and storage

• Energy-aware provisioning• Flexible designs and modeling

tools

Power & CoolingEnergy-efficient computing

High-costIT islands

Low-costpooled ITassets

Current state Future stateAutomated 24x7 lights-out computing

AutomationVirtualizationSecurityIT Systems& Services

Key enablers

Power &Cooling

Management

Systems:• Modular Cooling

System• Power Management

– HP BladeSystem– HP ProLiant servers– HP Integrity servers

• Universal Rackinfrastructure

Services:• Data Center Services –

power and cooling• Thermal Modeling

Data Center power

& cooling

HP C ClassBlade – PowerManagement

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A Growing ProblemServer power densities up 10x in last 10 yrs

Source: Datacom Equipment Power Trends and Cooling Applications, ASHRAE, 2005, http://www.ashrae.org

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Current Data Center Design

Intake

Discharge Supply Air Plenum Perforated Tiles

Intake

Raised Floor

CRAC CRAC

22ºC

• Raised floors, with air delivered through perforated floor tilesArchitecture unchanged from mainframe days

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Current Data Center Design

Intake

Discharge Supply Air Plenum Perforated Tiles

Intake

Raised Floor

CRAC CRAC

22ºC34ºC

• Raised floors, with air delivered through perforated floor tiles• 40-50% efficient at best

Architecture unchanged from mainframe days

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Current Data Center Design

Intake

Discharge Supply Air Plenum Perforated Tiles

Intake

Raised Floor

CRAC CRAC

22ºC34ºC40ºC

• 40-50% efficient at best• Barrier to deployment of newer higher density technologies

Poorly suited to cooling today’s server and storage platforms

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Current Data Center Design

Intake

Discharge Supply Air Plenum Perforated Tiles

Intake

Raised Floor

CRAC CRAC

22ºC34ºC40ºC45ºC

• 40-50% efficient at best• Barrier to deployment of newer higher density technologies

Poorly suited to cooling today’s server and storage platforms

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Current Data Center Design

Intake

Discharge Supply Air Plenum Perforated Tiles

Intake

Raised Floor

CRAC CRAC

22ºC34ºC40ºC45ºC52ºC

Poorly suited to cooling today’s server and storage platforms• 40-50% efficient at best• Barrier to deployment of newer higher density technologies

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Improving Data Center Design

Alternating hot and cold aisles are a better solution, however:

• Hot racks/cold racks causes non-trivial rack placement considerations

• 8-10 kW per rack is approaching the maximum supportable with traditional forced air cooling

• A significant percentage of data center costs go to power and cooling

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Next Generation Data Center DesignPower and cooling are becoming more important• Data center power density up 10x in

the last 10 years − 2.1kW/rack (1992); 14kW/rack

(2006)• Larger proportion of IT spend for

energy• 3-year energy cost roughly equivalent

to entry level server acquisition cost in US; in Europe it could be as high as 2X

• Can take as much power to cool the heat generated from a system as it takes to power the system

• Requires a holistic perspective− Complex problem− Multi-layered challenge− Interdependencies – standards-

based approach− Energy – finite planet resource

Tem

pera

tur

e

CHIP

SYSTEM

DATA CENTER

Exergy (available work)

Flow irreversibility

Non-uniform power

Flow irreversibility

Thermodynamic irreversibility

Flow

and

ther

mod

ynam

ic w

ork

Energ

y flow

Ground state (ambient)

Non-ideal effects

Non-ideal effects

Non-uniform power

Non-uniform power

2nd law-based tool from chipscale to data center scale

Source: HP Labs and UC Berkeley

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Important to consider all the costs

Power Generator

UPSSwitch Gear

Battery Backup/Flywheel

Chiller

Q

•TCO model considers details of the power and cooling stack•Power: substation to the chip•Cooling: chip to the cooling tower

Ref. Patel, C. and Shah, A., “Cost Model for Planning, Development and Operation of a Data Center”, HPL-2005-107(r.1)

3-4x server power costs

Power & Cooling Infrastructure

TCO Real Estate Cost

Burdened Power& Cooling Cost

Operation Cost++=

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Localized

Quick AssessmentGap analysis & written report highlighting best practices and quick wins

Enterprise-Plus

Smaller scale investment for quick wins

Larger scale, investment for bigger savings

Adaptive Smart Cooling (future)

Static Modeling Scientific approach to predicting airflow and temperature using sophisticated modeling tools. Changes recommended to eliminate hot spots and reclaim capacity.

Optimizing Data Center Design

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Static Data Center Thermal Modeling• The Static Smart Cooling service

enables customers to optimize existing or new data centers for compaction and/or energy efficient operation by:− optimizing placement of

computational resources− optimizing configuration of

cooling resources• AC systems

− failure mitigation• The Static Smart Cooling service

is available today

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Region Size

50% load

100 %load

Dynamic Data Center ModelingImpact of load or cooling changes

For a given data center (at 2250 watts per square meter) with an air-conditioning failure, the reaction time to reduce load is less than ~ 35 seconds to prevent redlining & shutdown

Modeling has the capability to show the impact of:

• Turning on new machines

• Air-conditioning shutdown for scheduled maintenance

• Air-conditioning failure

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c-Class innovation

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Helping Maximize Data Center Energy Budgets• Energy efficient design approach - from each component

to entire data center • 40% reduction in power• Doubling the number of servers with same power• …and using 50% less airflow to cool them• +30% improved energy efficiency versus rack-mount

Measuring and managing every watt for efficiencyThermal Logic Technology

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View/trend power usage and temperature: component, enclosure and rack

• Rack-level BTU/Hr.• Enclosure inflow & outflow temp• Actual power utilization• Max power available

Thermal Logic TechnologyInsight to measure, tools to adapt power & cooling

Dynamically adapt thermal controls to maximize power budget and ensure availability

• Power usage and distribution– HP Dynamic Power Saver

• Airflow and acoustics– PARSEC – HP Active Cool fans

• Performance– HP Power Regulator

• Workload balancing– Virtualization and automation

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Thermal Logic Management Rack-level BTU/hour

Enclosure inflow and

outflow temperatures

Actual power usage

Maximum power available

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HP Dynamic Power Saver

• 6 power supplies, 300W each, 75% efficiency• 2400W in for 1800W out• 600W wasted

• 2 power supplies, 900W each, 91% efficiency• 1978W in for 1800W out• Saving of 422W per enclosure

20 enclosures @ 0.075 per kW/hr can save ≈ US$5,545 per year

Example: 1800W draw system

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Dynamic Power Saver

Greater efficiency and cost savings with Dynamic Power Saver

Typical Rack Servers

Typical server blades

Rack server

Rack server

Rack server

Rack server

Rack server

Rack server

Rack server

Rack server

BL20p

BL20p

BL20p

BL20p

BL20p

BL20p

BL20p

BL20p

Power supply efficiency

0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100%

Output load

Blade PSU

Typical PSU

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

Effic

iency

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HP Active Cool Fan technology

• Best-in-class power consumption• High air flow (CFM)• High pressure• Best-in-class acoustics

20patents

Innovations from HP “Cool Team”• 66% less power consumption

than traditional fans• 50% less data center

air-conditioning required

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PARSEC architecture

Interconnect bays• The interconnects are powered and

cooled as part of the PARSEC architecture

Active Cool fans• Adaptive flow for maximum power

efficiency, air movement, and acoustics

Onboard Administrator• Remote administration view• Robust, multi-enclosure control

Power management• Single- or three-phase enclosures and

N+N or N+1 redundancy• Best performance per watt

PARSEC architecture• Parallel, redundant and

scalable cooling and airflow design

c7000 Enclosure

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HP Modular Cooling System (MCS)• Cooling for high density deployments• 30KW of cooling capacity in a single rack• Uniform air flow across the front of the servers• Redundant power source • Safety features to prevent water contact with

servers• Adjustable temperature setpoint• Does not add to the heat load in data center• Polycarbonate front door reduces ambient noise

considerably • Server/Blade deployment unaffected by design• Level 2 Integration with HP SIM

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MCS Functional Design

Fan Assembly

Heat Exchanger

Water Connections

Side Air Duct

Side ViewTop View

Blind-Mate Quick

Disconnect Couplings

Front Panel

Display

Controller

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MCS Side Airflow Design

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Deployment Options•Options

1-Independent loop connected to water-to-water heat exchanger (see diagram)

2-Independent water chiller dedicated to MCS.

3- Direct connect to house chilled water

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Lifting the Data Center ConstraintsPower and thermal management

Power monitoring PDU

Power Regulator

Power Efficient Components

Modular Cooling System

• Local power monitoring display• Unique color-coded load

segment identification

• Only HP offers direct control thru on board processor (iLO)

• Dynamic power throttling• Power meter reporting

•Power calculator

•High efficiency power supplies•Zone cooling designs•Lower power processors•SFF SAS drives draw ½ the

power

• Cooling for high density deployments

• Support up to 30kW in a single rack

Plus a variety of Data Center planning services

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Key takeaways:Energy efficient IT engineeringHolistic approach across the data center

Efficient data centers • HP Modular Cooling

• Data Center Thermal Assessment• Data Center Site Planning

Efficient systems

• Processor Power Regulator• Enterprise chipsets• Integrity Virtual Server Environment• StorageWorks

Efficient components • Small drives

• Intelligent power supplies• Efficient power conversion

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Q&A

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