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IMAPS/ACerS 2nd International Conference on Ceramic Interconnectand Ceramic Microsystem Technologies, Denver, April 24 – 27, 2006Franz Bechtold, VIA electronic GmbH

IMAPS/ACerS 2nd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT)

Keynote Presentation:

„A Specialist Manufacturer's Outlook on theFuture of Ceramics and Ceramic Microsystems“

Franz BechtoldVIA electronic GmbH, Hermsdorf

www.via-electronic.de.


… Outlook on the Future of Ceramics and Ceramic Microsystems:

Overview

• Introduction: VIA electronic, Historical Bricks

• Interoduction: Ceramic Technologies in Electronic Applications

• LTCC Business: Ups and Downs, Successand Failures, Market

Relevance, Technology Drivers,

• State of the art: LTCC vs. PCB and Si, Large and Small companies

• LTCC perspectives: Smart Components, Integrated Passives, Wafer

level Packaging, Optoelectronicsintegration, Biofluidics

• Conclusion: Risk and Opportunities



Introduction: General Company Informations

VIA electronic GmbH is located in Hermsdorf/Germany

We consider ourselve as a „SMART LTCC Foundry“, specialised in the realisation of innovative solutions in LTCC Technology.

On the market since 1997 with 17 Employees per today

Certified according to ISO 9001:2000



Introduction: Historical Bricks

Region: Hermsdorf is a center for Technical Ceramicssince 1910.

Up to 1989 The „Ceramic Plants“ of Hermsdorf were a 7.000 people company

Company: VIA electroncic was found in Hermsdorf in 1997 as a management buy out of Siegert electronic, a German Hybrid manufacturerdealing with LTCC since 1986



Introduction: Services and Customer Products

• advanced CAD design

• flexible manufacturingline

• all lot sizes

• > 1 M sqi of circuits per year

• high precision processing

• different material systems

• rf modules

• 3D packages

• multichip modules

• multilayerceramic boards

• multilayercomponents

• thinfilm substrates


… Outlook on the Future of Ceramics and Ceramic Microsystems:Introduction: Ceramic Technologies and their Applications

Ceramic Technologies and Application Domains in Electronics

• Thickfilm on Alumina: Industrial, Automotive, Military, Aerospace, Medical

• DCB on Alumina: Automotive, Industrial Equipment

• Thickfilm on AlN: Military and Aerospace

• DCB on AlN: Military and Aerospace

• Thinfilm on Alumina: Military, Aerospace, Telecom, Industrial Equipment

• Thinfilm on AlN: Telecom, Military, Aerospace, Medical, Industrial

• Alumina/HTCC/Thickfilm: Telecom, Military, Aerospace, Medical, Industrial

• AlN/HTCC/Thickfilm: Military, Aerospace

• LTCC/Thickfilm : Automotive, Telecom, Industrial, Medical, Military, Aerospace


… Outlook on the Future of Ceramics and Ceramic Microsystems:State of the art: Ceramic Technologies and their Applications

The more specialised, the smallerthe market.

The following part will focus on LTCC as the most advanced and widely spread ceramic technology in electronic applications withthehighestinnovation potential foremerging markets


… Outlook on the Future of Ceramics and Ceramic Microsystems:State of the art: Ceramic Technologies between PCB and Si

+++--

+++-

++++--

++

Si

+-Thermal conductivity

++Acceleration resistivity+-High temperature resistivity

+-Insulation resistivity+-Life time

+-Rf Stability+-Integration of fluidics+-Integration of passive components+-+-Integration density+-+Electrical conductivity

LTCCµ-VIA Technologie

Technical performance



--++++Development and tooling costs

+++++++++++

-

++

Si

-++Logistic

-++Automated routing tools

+-+Simulation tools

+++Time to Market

+++Costs per Interconnection

+++Infrastructure R&D

-++Infrastructure manufacturing technique

-++Infrastructure of suppliers

LTCCPCBEconomical Performance



Silicon: best reliability, constraints concerning passivintegration, insulation resistivity, electrical conductivity and temperature stability

low cost per Interconnection, highest area costs, high tooling costs, long time to market, good infrastructur

LTCC: good reliability, advantages concerning passivintegration, insulation resistivity, electrical conductivity and temperature stability

medium cost per Interconnection, medium area costs, reasonable tooling costs, relatively short time to market

bad infrastructur

PCB: poor reliability, constraints concerning passivintegration, insulation resistivity, rfstability and temperature stability

low cost per Interconnection, lowest area costs, lowest tooling costs, very short time to market

very good infrastructur


… Outlook on the Future of Ceramics and Ceramic Microsystems:LTCC Business: Ups and Downs in Europe

•Until1995: Narrow niche marketin high price high performance sections

•Until 2000: Break through in mass markets: IT, Telecom and Automotive

•Until2001: Overestimation of ltccfor in mass productsin Telecom

heavyinvestmentsin manufacturing capacities

•Until2002: Underestimation of development costs and time, late market

introduction, break down of the Telecom market

•Until2004: end of life for high runner products, change to less expensive

technologies, consolidation of theinstalled capacities

Untiltoday: Detachement of LTCC by more cost effective technologies

Gain of new applications through increasing requirements


… Outlook on the Future of Ceramics and Ceramic Microsystems:LTCC Business: success and failure stories of high runners

•Hard Disc Driver, Information Technology, Mass Market

Ramp up and ramp down of several world wide supplyers within 3 Years, new generation

withoutceramic. Involved: Sorep, NS, CTS, Scrantum

•Blue Tooth, Information Technology, Mass Market

Heavy investment and fast ramp up at the biggest European supplieron thefree market,

instableload, Involved: Thales (Sorep), DTM, Taiwan

•ABS/Motorcontroll Unit/Gear Controll Untit, Automotive, High Volume Market

Heavy invstment and fast ramp up at the biggest European supplieron the captive

market.Involved: Bosch



•Motor Management/Gear Car Controll, Automotive, High Volume Market

Heavy investments and ramp up at the second European supplieron theopen market. Long

lasting productqualificationincluding a new material system. Delayin time to market.

Involved: Sumitomo, Elektrokeramik, C-Mac and EPCOS

• Triband Front end module, Telecom, Mass Market

Heavy investment and steadyramp up to diversifyfrom componentsto subsystems on the

captive market: EPCOS



•Successful:

Captive suppliers Bosch in Automotive

and Epcos bothin Telecom and Automotive Business, captive and free market

Why: Subsystem supplier, high added value chain, given ceramic structure

Failed:

Suppliers on the open marketin IT, Telecom and Automotive business outsidefar-

east: Elektrokeramik, C-Mac, Thales, National Semiconductor, CTS

Why: Foundry, low added value, ceramic structure had to beinvested


… Outlook on the Future of Ceramics and Ceramic Microsystems:LTCC Business: Market Relevance versus Market Size

Entertainment

Consumer

Information Technologie

Telecom

Automotive

Industrial Equipment

Military/Aerospace

Market relevance Market Size


… Outlook on the Future of Ceramics and Ceramic Microsystems:LTCC Business: Technology Driver versus Market Domain

Reliability, Integration Density, Weight, CostsMilitary/Aerospace

Feasability, Costs, ReliabilityIndustrial Equipment

Costs, Reliability, Weight,Automotive

Costs, Integration Density, ReliabilityTelecom

Cost, Integration Density, ReliabilityInformation Technologie

Cost, SizeConsumer

Cost, SizeEntertainment

Main Technology DriversMarket Domain


… Outlook on the Future of Ceramics and Ceramic Microsystems:LTCC Business: Technology Driver versus Market Domain

All volume applications are cost driven.

Ceramic can provide cost advantages at system level fornew packaging solutions

Ceramic remains a cost driver

Each cost driver will be designed out as far as possible during change of generations


… Outlook on the Future of Ceramics and Ceramic Microsystems:LTCC outlook: Emerging Market Opportunities and challanges

Technical RequirementsChallangeOpportunity

no XY shrinkage, excellentplanarity and accuracy

Integration of opticaland electricalconductors/components

•M OE MS Packaging

TCE matching of Ceramic to Si, no XY shrinkage

3D integration, hermeticity, Wafer level packaging

ME MS Packaging

New and adaptedmaterials, new and adeptedprocesse

3D interconnection, passive integration, thermal management

System in Package

Flatness, TCE matching of Ceramic to PCB,

High pin count, QFP, LGA, BGA, functionalintegration

•HeterogeneousSystem Integration

ChemicalperformanceBiocompatibility

Lab on Chip, integratedfluidic, integratedreactors and sensors

Biotechnology and chemical sensors


… Outlook on the Future of Ceramics and Ceramic Microsystems:Outlook: SMEs versus Large companies in Ceramics business

Captive Market

High Volume

Low Flexibility

Proprietary Materials

Proprietary Processes

Leading edge Technologies

Lower Costs

Open Market

Low Volumes

High Flexibility

AvailableMaterials

Available Processe

State of the Art Technologies

Higher Costs

Large CompaniesSMEs

SMEs arefacing heavy effortsto follow the technology trend set bythe big players. We solvethisby active networking and R&D cooperations


… Outlook on the Future of Ceramics and Ceramic Microsystems:Outlook: Exploration of new application fields

In future, new applicationfields haveto beexplored and ceramic and especially LTCC is

providing a high innovation potential

All the examplesfollowing are processedin VIA electronic. New LTCC Materials and processes as well as demonstratorapplications were developedin

theframe of jointresearch programmes.


… Outlook on the Future of Ceramics and Ceramic Microsystems:Perspective: Smart LTCC Components with integrated passives

SMT compatible LTCC IntegratedPassive componentsforlow power, high power, low frequency and high frequency applications using new

dielectric materials and newmanufacturing processes

Power transformer

L/C Bandpass

LC phase shifter Integrated resistor

Ferritic ltccinductor


… Outlook on the Future of Ceramics and Ceramic Microsystems:Perspective: Wafer Level Packaging by anodic bonding to LTCC

Silicon

LTCC

LTCC substrate bonded with Si- waferand cross section of bonded area

Electrodes

Silicon

LTCC

Glass

LTCC metallized wafer bonded with theSi- and glass-wafer simultaneously byanodic bonding at 400°C, 1500 V, Schematic and Demonstrator


… Outlook on the Future of Ceramics and Ceramic Microsystems:Perspective: Integrated Passives for MEMS switch modules

ESL

layer 2 layer 3 layer 4

cond 1 cond 2 cond 1a

structured high-K-tape

layer 1

Integrated high-k-tape

ESL

layer 1

layer 2

layer 3

layer 4

cond 1cond 2 cond 1a

highK paste

Integrated high-k ink

layer 2 layer 3 layer 4

cond 1 cond 2 cond 1a

layer 1 structured 40µm

951C2/ 37µ layer

RF-MEMS switch

with cap

sidewall metallization

thermal vias / spreader

cavities for RF-MEMS

sealing

high k layerresistors

RF-structures


… Outlook on the Future of Ceramics and Ceramic Microsystems:Perspective: Integrated Optoelectronics on LTCC

Pressureassisted sintering Material DuPont 951

Cavities, postfire lasercut

Blind holes, postfire laser drilled+-25µ

Vias 90µm, position +-50µm

Application: CSP for Si opticalbench

Window

C M OS

C M OS Bumps C M OS UBM

Blind holeCSP Bumps


… Outlook on the Future of Ceramics and Ceramic Microsystems:Perspective: Integrated Optoelectronics on LTCC

Pressureassisted sintering

Lappedra<0,2µm

Thickness 1,5mm +/- 5µm Vias Interconnection: Thinfilm

Interconnect: BGA Backside

Oprating speed up 10Gbit


… Outlook on the Future of Ceramics and Ceramic Microsystems:Perspective: Integrated Fluidics

Fluidicchannel

0,1 x 0,1 m m

Fluidicchannel

0,2 x 0,2 m m

Fluidicchannel

0,4 x 0,6 m m

Sensorpackagewithintegrated

Fluidic


… Outlook on the Future of Ceramics and Ceramic Microsystems:Perspective: Biotechnology and Biosensor

Bio-Sensor withintegrated Fluidic

Fluidic Chip withintegratedhigh voltage conductors

Fluidicinterconnection at 100µm channel



Cooperation: Full R&D Chain from materials to products

Berlin, 230km

Nurenberg, 220 km

Dedicatedto Grow:

A Network of Industries, R&D Institutes and Universities, forthe Development and Realisation of Ceramic BasedMicroelelectronic Devices and Microsystems•14 SMEs̀ , 1.500 Employees•2 Universities•4 Research Institutes

JenaHermsdorf

From ceramic powdersto ceramic based Microsystems and devices


… Outlook on the Future of Ceramics and Ceramic Microsystems:Conclusion : Ceramics business bears severe risks

No continuously growing demand overthe mainmarketsections visible

Pressuretowardsmore cost efficientsolutionsduringchange of productgenerations

Trend to move from expensive hardware solutionstowards cheap software solutions

High R&D effortsneededto keep pace withtheRoadmaps of the Semiconductor developments


… Outlook on the Future of Ceramics and Ceramic Microsystems:Conclusion : Ceramics business bears excellent chances

Superior reliabilitypropertiesforstrategic markets

High innovation potential fornew I&P solutions

Capabilityforfurtherincreasement of miniaturisation

High integration capability with new functions

Expertise at Universities and Research Institutes in Europe

Material and performanceimprovementsthrough Nanotechnologogyapproach

High innovation speed by networking

Sustainable growth potential with new markets


Thanks for your attention

Parts of the work presented were carried out in the frame of the jointresearch projects 20Ghz+, Multifer, Mabogos, Match-Druck, Imodas

and AHRMS, supported by the Ministery of Reasearch and Technology in Thuringia, The German Ministery of Education and Research and the

European Commission

Ceramic solutions will alwaysplay an importantroll to enablenew strategic, high end and leading edge applications

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