8GB DDR3 VLP RDIMM · Tambient= 27C 7m/s and Tambient=6 1C Vertical Orientation [Max Tc, °C]...
Transcript of 8GB DDR3 VLP RDIMM · Tambient= 27C 7m/s and Tambient=6 1C Vertical Orientation [Max Tc, °C]...
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8GB DDR3 VLP RDIMMP/N SG5721G4AH8P0PH1
512Mx4 (36)
April 2010
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SMART Modular Technologies Company Confidential 2
ObjectiveObjective
• To analyze the given DIMM module at
different airflow and vertical orientation.
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SMART Modular Technologies Company Confidential 3
Modeling AssumptionsModeling Assumptions
� The Icepak model for analysis are with reference to the given components data sheet.
�Thermal Conductivity of PCB:
�In Plane : K = 20W/mK
�Normal to Plane : K = 0.2W/mK
� Airflow Condition: Ducted airflow at 7m/s at 61C & 3 m/s at 27C.
�The Rjb & Rjc Values are taken from components data sheet & unknown values are assumed.
�The analysis is done for vertical orientation of DIMM with Aluminum Core.
�Radiation effect between PCB to the ambient is considered in the simulation.
� For all the heat dissipating components and PCB, emissive value of 0.8 is considered in the simulation.
�Modeling details for components:
2X3X0.9
11.6X10.1X1.2
Package Size(mm)
Rjc = 4.34C/W,Rjb = 10C/W
0.2358K4B2G0846CSamsungMemory
Rjc = 5.00C/W,Rjb = 10C/W
0.360STTS424E02STMicroelectonicsEEPROM
Thermal ResistancePower Dissipation
(W)
Mfr P/NMfrPart
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SMART Modular Technologies Company Confidential 4
Components Layout [Given Model]
Icepak Model
PCB details
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SMART Modular Technologies Company Confidential 5
Components Layout [Icepak Model]
PCB details
Bottom Side
Top Side
Total Power DIMM is 9.12W
Memory: 0.2358W each
EEPROM: 0.32W
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SMART Modular Technologies Company Confidential 6
PCB details
Aluminum Core
PCB
PCB Components
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SMART Modular Technologies Company Confidential 7
Airflow : 7m/s at 61C
Gravity
Icepak Model
Vertical Orientation
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SMART Modular Technologies Company Confidential 8
Case 1) VERTICAL DIMM, 7m/s VELOCITY and Tambient 61C
PCB Surface Temperature
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SMART Modular Technologies Company Confidential 9
Aluminum Core Surface Temperature
Case 1) VERTICAL DIMM, 7m/s VELOCITY and Tambient 61C
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SMART Modular Technologies Company Confidential 10
Components Case temperature distributionCut Location
Case 1) VERTICAL DIMM, 7m/s VELOCITY and Tambient 61C
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SMART Modular Technologies Company Confidential 11
Velocity Vectors across the enclosure Temperature contour across the enclosure
Case 1) VERTICAL DIMM, 7m/s VELOCITY and Tambient 61C
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SMART Modular Technologies Company Confidential 12
Airflow : 3m/s at 27C
Gravity
Icepak Model
Vertical Orientation
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Case 2) VERTICAL DIMM, 3m/s VELOCITY and Tambient 27C
PCB Surface Temperature
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SMART Modular Technologies Company Confidential 14
Aluminum Core Surface Temperature
Case 2) VERTICAL DIMM, 3m/s VELOCITY and Tambient 27C
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SMART Modular Technologies Company Confidential 15
Components Case temperature distribution
Cut Location
Case 2) VERTICAL DIMM, 3m/s VELOCITY and Tambient 27C
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SMART Modular Technologies Company Confidential 16
Velocity Vectors across the enclosure Temperature contour across the enclosure
Case 2) VERTICAL DIMM, 3m/s VELOCITY and Tambient 27C
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SMART Modular Technologies Company Confidential 17
Results Summary
Maximum case Temperature of Components
61.3684.69<950.2358MEMORY
94.22116.42<1250.32EEPROM
3m/s and
Tambient=
27C
7m/s and
Tambient=6
1C
Vertical Orientation [Max
Tc, °C]
Thermal
Requirement
[Tcase °C]
Power
Dissipation
W
Part
Comments:
1. All Components case temperatures are below the spec for both air flow conditions, 7m/s at 61C & 3m/s at 27C.