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Transcript of 5G: The Next Generation (Big Wave) of Wireless5G: The Next Generation (Big Wave) of Wireless ... 5G...
5G: The Next Generation (Big Wave)of Wireless
Ed Tiedemann
Sr. VP, Engineering, Qualcomm Technologies Inc.
5G Tokyo Bay Summit
22 July 2015
2015 Qualcomm Technologies, Inc.
Mobile has made a leap every ~10 years
D-AMPS, PDC, GSM,
IS-95 (CDMA)LTE,
LTE Advanced
WCDMA/HSPA+,
CDMA2000/EV-DO
2
AMPS, NMT, TACS,
JTACS
2015 Qualcomm Technologies, Inc. 2015 Qualcomm Technologies, Inc. 3
Empoweringnew user experiencesnew industries and devices
new services
2015 Qualcomm Technologies, Inc.
Ultra-low cost
Deep coverage
Ultra-low energy
Ultra-high reliability
High security
Robust mobility
Ultra-low latency
Deep awarenessExtreme broadband
Extreme variation of requirements
4
Wide area IOEUltra-
Reliable Services
Enhanced
Mobile
Broadband
Ultra-high capacity
2015 Qualcomm Technologies, Inc. 5
User-centric connectivityDevice is not just an endpoint
Device-to-device discovery and communications
Integrated access and backhaul, relays
Multi-hop to extend coverage
2015 Qualcomm Technologies, Inc.
Integrated access & backhaul techniques reduce network deployment cost
6
Comparison of fixed allocation to backhaul
versus dynamic allocation
Minimized number of fibre drops
Integrated access and backhaul techniques are
more adaptive and less expensive
Fewer fiber drop points needed compared to
fixed backhaul for a given backhaul demand
Higher trunking efficiency results in better user
experience
Dynamically adjusts to changes in fiber drop
locations & number
24
6
89
2
5
18 18 18
10 Mbps 20 Mbps 30 Mbps 40 Mbps 50 MbpsUE datarate demand
Number of fiber drops needed
Integrated Access & BH Fixed Access Backhaul
*Assumptions: 28 GHz band, 1GHz b/w, 18 base-stations; 200m ISD; 600 devices, uniform distribution
2015 Qualcomm Technologies, Inc.
Unified 5G design across spectrum types and bandsFrom narrowband to wideband, licensed & unlicensed, TDD & FDD
7
5G
Range of application requirements
Diverse spectrum typesBand
Single component
carrier channel
Bandwidth examples
Target
Characteristics
FDD/TDD
2015 Qualcomm Technologies, Inc.
5G modulation and access techniques
8
OFDM for enhanced mobile broadband access
5G broadband access requires the following
Low latency
Wide channel bandwidth and high data rate
Low complexity per bit
OFDM is well suited to meet these requirements due to the following characteristics
Scalable symbol duration and subcarrier spacing
Low complexity receiver for wide bandwidth
Efficiently supports MIMO spatial multiplexing and multiuser SDMA
OFDM implementations allow for additional transmit/receiver filtering based on link and adjacent channel requirements
In addition, resource spread multiple access (RSMA) waveforms have advantages for
uplink short data bursts such as low power IoE Supports asynchronous, non-orthogonal, contention based access
Reduces IoE device power overhead
2015 Qualcomm Technologies, Inc.
5G scalable numerology to meet varied deployment/application/complexity requirements
9
160MHz bandwidth
Sub-carrier spacing = 8NIndoor
Wideband
(e.g. unlicensed)
Sub-carrier spacing = 2N
80MHz
Normal CP
(e.g. outdoor
picocell)
500MHz bandwidth
Sub-carrier spacing = 16N
mmWave
Note: not drawn to scale ECP
FG
NCP
ECP
ECP
FG
NCP
TTI k TTI k+1 TTI k+2
Numerology Multiplexing
5G mmW synchronized to 5G sub6 at e.g. 125 us TTI level for common MAC, along
with scaled subcarrier spacing, and timing alignment with 1 ms LTE subframes
2015 Qualcomm Technologies, Inc. 10
5G extreme bandwidth: low round trip latency
Order of magnitude lower HARQ RTT
compared to LTE
Low TTI
HARQ latency
Processing time similar to WiFi in TDD
Self-contained TDD subframe
Integrated approach to licensed M-MIMO, unlicensed, D2D
Decoupling UL/DL data ratio from latency
Extremely low application layer latency in both directionsNote: LTE UL/DL Cfg #1 with 7-instance HARQ using the D S
U U D configuration has HARQ RTT > 10ms
0 1 0 1
ACK
0
Data
ACK ACK1
ACK
0
DataG
PACK
FDD
TDD
HARQ RTT: 0.5 ms
2015 Qualcomm Technologies, Inc.
Multi connectivity across bands & technologies4G+5G multi-connectivity improves coverage and mobility
11
Rural area
4G+5G
Sub-urban area4G+5G
Leverage 4G investments to enable phased 5G rollout
4G & 5G
small cell coverage
Macro5G carrier aggregation with
integrated MAC across
sub-6GHz & above 6GHz
Smallcell
multimode device
Simultaneous connectivityacross 5G, 4G and Wi-Fi
Urban area
4G & 5G macro coverage
2015 Qualcomm Technologies, Inc.
Mesh connectivity improves IoE coverage
12
Wide Area IoE with meshIoE device with high pathloss relays data via
nearby IoE devices with better pathloss
IOE
IOE
IOEIOE
IOE
Direct access on
licensed FDD
Mesh on unlicensed or
partitioned with uplink FDD
Uplink Mesh Downlink Direct (UMDD)
Enabled with common MAC & self-contained TDD sub-frames
Time synchronization from WAN improves peer-to-peer protocol efficiency
WAN licensed downlink provides greater range and protected reference signals
2015 Qualcomm Technologies, Inc.
mmWave enables 5G Extreme Mobile Broadband
13
Challenges Higher path-loss at mmWave
frequencies, susceptibility to blockage,
building penetration issues
Device cost and RF challenges at mmW
Robust beam search & tracking
System design with directional transmissions
Opportunities Availability of large bandwidth from
100s of MHz up to 9 GHz
Extreme data-rates (e.g. up 10 Gbps)
Dense spatial reuse can enable extreme network capacity
Beamforming to overcome poorer propagation
Flexible deployment with integrated backhaul (200m 500m) and access
(100m- 150m)
Solutions Tight integration with 5Gsub6
increases robustness
Smart beam search & tracking algorithms
Antenna management & reconstructive beam forming
algorithms
Coordinated scheduling for proximal user interference management
Phase noise mitigation in RF components for cheaper devices
2015 Qualcomm Technologies, Inc.
Indoor Measurements: Modern Office BuildingPath Loss (2.9 and 29 GHz)
Angular Spread/Diversity (29 GHz)
LO
S
NL
OS
Actual PL = [reference loss at 1m for a given frequency] + [normalized PL as shown]
Path loss characteristics in a dense
multi-wall environment:
LOS: 29 GHz better than 2.9 GHz
NLOS: 29 GHz not significantly worse
than 2.9 GHz
Coverage looks promising
70m50m
Elevation Azimuth
Numerous resolvable paths in elevation
Suggests a 3-D channel model
Significant path diversity in azimuth
Ability to withstand blockage events
2015 Qualcomm Technologies, Inc.
5G Common MAC5G enables tighter integration between 5Gsub6 and mmW
15
Improved mmW DL efficiency & reliability
Accurate DL beam steering by providing fast & reliable CSI feedback through 5Gsub6 UL
Increased sharing of mmW resources across devices
5Gsub6 carrier to bootstrap discovery Reduced temporal/frequency search, focus on spatial search Messaging to kick start directional search
Reduced power consumption Wake-up & sleep commands through 5Gsub6 for efficient
duty cycling of mmW radio
Leveraging mmW & wider 5Gsub6 UL/DL New wider bandwidth of licensed 5Gsub6 carrier (e.g. 160
MHz) provides more balanced experience through mmW
shadowing compared to narrower bands
mmWave and 5Gsub6
5Gsub6
mmWave
mmWave and 5Gsub6
5Gsub6
mmWave
2015 Qualcomm Technologies, Inc.
2015 2016 2017 2018 2019 2020 2021 2022
Current 3GPP timeline delivers 5G specification by 2020*
5G timeline our view
16
Estimated 3GPP standardization timeline for 5G
4G evolution - LTE will evolve in parallel with 5G
5G
5G RAN WG Study Items (SI)
5G Work Items 5G Work Items
5G commercialization timeline5G first deployments
5G full system
Rel 17 & beyond
5G evolution
3GPP Rel 13 Rel 14 Rel 15 Rel 16
* For information on 3GPPs 5G timeline, see: http://www.3gpp.org/news-events/3gpp-news/1674-timeline_5g
3GPP RAN Workshop
SA SI RAN SI
For more information on Qualcomm, visit us at:
www.qualcomm.com & www.qualcomm.com/blog
2015 QUALCOMM Incorporated and/or its subsidiaries. All Rights Reserved.
Qualcomm is a trademark of Qualcomm Incorporated, registered in the United States and other countries,
used with permission. Other products or brand names may be trademarks or registered trademarks of their respective owners.
References in this presentation to Qualcomm m