4/8-Bit Parallel-Input Latched Drivers

2019 Microchip Technology Inc. DS20006184A-page 1

MIC5800/1

Features

• 4.4 MHz Minimum Data Input Rate

• High-Voltage, High-Current Sink Outputs

• Output Transient Protection

• CMOS, PMOS, NMOS, and TTL Compatible Inputs

• Internal Pull-Down Resistors

• Low-Power CMOS Latches

General Description

The MIC5800 and MIC5801 latched drivers arehigh-voltage, high-current integrated circuitscomprised of four or eight CMOS data latches, abipolar Darlington transistor driver for each latch, andCMOS control circuitry for the common CLEAR,STROBE, and OUTPUT ENABLE functions.

The bipolar/MOS combination provides an extremelylow-power latch with maximum interface flexibility.MIC5800 contains four latched drivers; MIC5801contains eight latched drivers.

Data input rates are greatly improved in these devices.With a 5V supply, they will typically operate at betterthan 5 MHz. With a 12V supply, significantly higherspeeds are obtained. The CMOS inputs are compatiblewith standard CMOS, PMOS, and NMOS circuits. TTLor DTL circuits may require the use of appropriatepull-up resistors. The bipolar outputs are suitable foruse with relays, solenoids, stepping motors, LED orincandescent displays, and other high-power loads.Both units have open-collector outputs and integraldiodes for inductive load transient suppression. Theoutput transistors are capable of sinking 500 mA andwill sustain at least 50V in the OFF state. Because oflimitations on package power dissipation, thesimultaneous operation of all drivers at maximum ratedcurrent can only be accomplished by a reduction induty cycle. Outputs may be connected in parallel forhigher load current capability.

Package Types

MIC5800YM14-Lead SOIC (M)

(Top View)

MIC5801YWM24-Lead SOIC (WM)

(Top View)

MIC5801YV28-Lead PLCC (V)

(Top View)

COMGND

LA

TC

HE

S

CLEAR OE

S T R O B E VDD

IN1 OUT1

IN2 OUT2

IN3 OUT3

IN4 OUT4

1

2

3

4

5

6

7

14

13

12

11

10

9

8

24

23

22

21

20

19

18

17

16

1

2

3

4

5

6

7

8

9

10 15

11 14

12 13

OE VDD

CLEAR NC

OUT1

IN1

STROBE

OUT2

IN2 OUT3

IN3 OUT4

IN4 OUT5

IN5 OUT6

IN6 OUT7

IN7 OUT8

IN8 NC

GND COM

6

IN1

OUT224

7

IN2

OUT323

8

IN3

OUT422

9

IN4

OUT521

10

IN5

OUT620

11

IN6

OUT719

5

CL

EA

R

OUT125

12 13 14 15 16 17 18

4 3 2 1 28 27 26

OE

VD

D

NC

NC

ST

RO

BE

NC

GN

D

NC

CO

M

OU

T8

NC

NC

IN8

IN7

LA

TC

HE

S

4/8-Bit Parallel-Input Latched Drivers

MIC5800/1

DS20006184A-page 2 2019 Microchip Technology Inc.

Typical Application Circuit

Functional Block Diagram

8

9

2

3

4

5

6

7

1 14

13

12

11

10

VDD

OUT1

OUT2

OUT3

OUT4IN4

IN3

IN2

IN1

S T R O B E

CLEAR

LA

TC

HE

SμP

0.1μF

+30V

0.1μF

+30V

S T E P P E RMOTOR

OUTPUT ENABLE

VDD

INn

S T R O B E

CLEAR

OUTPUTENABLE COMMON MOS

CONTROLTYPICAL MOS

LATCHTYPICAL BIPOLARDRIVER

GND

OUTn

COMMON


MIC5800/1

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †

Output Voltage (VCE) ................................................................................................................................................+50VSupply Voltage (VDD) ................................................................................................................................................+15VInput Voltage Range (VIN).................................................................................................................–0.3V to VDD + 0.3VContinuous Collector Current (IC) .........................................................................................................................500 mAESD Rating (Note 1) .................................................................................................................................. ESD Sensitive

Operating Ratings ††

Package Power Dissipation (PD)MIC5800 SOIC..........................................................................................................................................................1.0WDerate above TA = +25°C ................................................................................................................................8.5 mW/°CMIC5801 PLCC.......................................................................................................................................................2.25WDerate above TA = +25°C ..............................................................................................................................18.2 mW/°CMIC5801 Wide SOIC ................................................................................................................................................1.4WDerate above TA = +25°C ................................................................................................................................. 11 mW/°C

† Notice: Exceeding the absolute maximum ratings may damage the device.

†† Notice: The device is not guaranteed to function outside its operating ratings.

Note 1: Microchip CMOS devices have input-static protection, but are susceptible to damage when exposed toextremely high static electrical charges.

ELECTRICAL CHARACTERISTICS

Electrical Characteristics: VDD = 5V, TA = +25°C, VA ≤ +85°C unless otherwise noted. Note 1

Parameter Sym. Min. Typ. Max. Units Conditions

Output Leakage Current ICEX

— — 50µA

VCE = 50V, TA = +25°C

— — 100 VCE = 50V, TA = +70°C

Collector-Emitter Saturation Voltage

VCE(SAT)

— 0.9 1.1

V

IC = 100 mA

— 1.1 1.3 IC = 200 mA

— 1.3 1.6 IC = 350 mA, VDD = 7.0V

Input Voltage (Low) VIN(0) — — 1.0 V —

Input Voltage (High) VIN(1)

10.5 — —

V

VDD = 12V

8.5 — — VDD = 10V

3.5 — — VDD = 5V, Note 2

Input Resistance RIN

50 200 —

kΩ

VDD = 12V

50 300 — VDD = 10V

50 600 — VDD = 5V

Supply Current ON (Each Stage)

IDD(ON)

— 1.0 2.0

mA

VDD = 12V, Outputs Open

— 0.9 1.7 VDD = 10V, Outputs Open

— 0.7 1.0 VDD = 5V, Outputs Open

Supply Current OFF (Total)

IDD(OFF)

— — 200µA

VDD = 12V, Outputs Open, Inputs = 0V

— 50 100 VDD = 5V, Outputs Open, Inputs = 0V

Note 1: Specification for packaged product only.

2: Operation of these devices with standard TTL or DTL may require the use of appropriate pull-up resistors to ensure a minimum logic “1”.

MIC5800/1


Information present at an input is transferred to its latch when the STROBE is high. A high CLEAR input will set alllatches to the output OFF condition regardless of the data or STROBE input levels. A high /OE will set all outputs to theoff condition, regardless of any other input conditions. When the /OE is low, the outputs depend on the state of theirrespective latches.

Clamp Diode Leakage Current

IR— — 50

µAVR = 50V, TA = +25°C

— — 100 VR = 50V, TA = +70°C

Clamp Diode Forward Voltage

VF — 1.7 2.0 V IF = 350 mA

TRUTH TABLE

INN Strobe Clear /OEOUTN

t – 1 t

0 1 0 0 X OFF

1 1 0 0 X ON

X X 1 X X OFF

X X X 1 X OFF

X 0 0 0 ON ON

X 0 0 0 OFF OFF

Legend: X = Irrelevant; t – 1 = Previous output state; t = Present output state.

TEMPERATURE SPECIFICATIONS

Parameters Sym. Min. Typ. Max. Units Conditions

Temperature Ranges

Storage Temperature Range TS –65 — +125 °C —

Operating Temperature Range TA –40 — +85 °C —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

ELECTRICAL CHARACTERISTICS (CONTINUED)

Electrical Characteristics: VDD = 5V, TA = +25°C, VA ≤ +85°C unless otherwise noted. Note 1

Parameter Sym. Min. Typ. Max. Units Conditions

Note 1: Specification for packaged product only.

2: Operation of these devices with standard TTL or DTL may require the use of appropriate pull-up resistors to ensure a minimum logic “1”.


MIC5800/1

2.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1 and Table 2-2.

FIGURE 2-1: Typical Input.

TABLE 2-1: MIC5800 PIN FUNCTION TABLE

Pin Number Pin Name Description

1 CLEAR Resets all latches and turns all outputs OFF (open).

2 STROBE Input strobe pin. Loads output latches when high.

3, 4, 5, 6 INN Parallel inputs, 1 through 4.

7 GND Logic and Output Ground pin.

8 COM Transient suppression diode common cathode pin.

9, 10, 11, 12 OUTN Parallel outputs, 4 through 1.

13 VDD Logic Supply Voltage.

14 /OEOutput Enable. When low, outputs are active. When high, outputs are inactive and device is reset from a fault condition. An undervoltage condition emulates a high OE input.

TABLE 2-2: MIC5801 PIN FUNCTION TABLE

Pin Number SOIC

Pin Number PLCC

Pin Name Description

1 28 /OEOutput Enable. When low, outputs are active. When high, outputs are inactive and device is reset from a fault condition. An undervoltage condition emulates a high OE input.

2 1 CLEAR Resets all latches and turns all outputs OFF (open).

3 3 STROBE Input strobe pin. Loads output latches when high.

4, 5, 6, 7, 8, 9, 10, 11

5, 6, 7, 8, 9, 10, 11, 12

INN Parallel inputs, 1 through 8.

12 15 GND Logic and Output Ground pin.

13 17 COM Transient suppression diode common cathode pin.

14, 232, 4, 13, 14,

16, 26NC No Connection. Leave floating.

15, 16, 17, 18, 19, 20, 21, 22

18, 19, 20, 21, 22, 23, 24, 25

OUTN Parallel outputs, 8 through 1.

24 27 VDD Logic Supply Voltage.

IN

VDD

MIC5800/1


3.0 TIMING

FIGURE 3-1: Timing Diagram.

TABLE 3-1: TIMING CONDITIONS

Characteristics: TA = +25°C; Logic levels are VDD and Ground; VDD = 5V.

Condition Min. Typ. Max.

A. Minimum data active time before strobe enabled (data set-up time) 50 ns — —

B. Minimum data active time after strobe disabled (data hold time) 50 ns — —

C. Minimum strobe pulse width 125 ns — —

D. Typical time between strobe activation and output on to off transition — 500 ns —

E. Typical time between strobe activation and output off to on transition — 500 ns —

F. Minimum clear pulse width 300 ns — —

G. Minimum data pulse width 225 ns — —

CLEARF

STROBE

OUTPUTENABLE

INN

C BA

G

E

C BA

G

D

C B

E

OUTN


MIC5800/1

4.0 TYPICAL APPLICATIONS

FIGURE 4-1: MIC5800 Unipolar Stepper-Motor Drive.

FIGURE 4-2: Unipolar Wave Drive. FIGURE 4-3: Unipolar 2-Phase Drive.

8

9

2

3

4

5

6

7

1 14

13

12

11

10

VDD

OUT1

OUT2

OUT3

OUT4IN4

IN3

IN2

IN1

S T R O B E

CLEAR

LA

TC

HE

SμP

0.1μF

+30V

0.1μF

+30V

S T E P P E RMOTOR

OUTPUT ENABLE

STROBE

IN1

OUT1

IN2

IN3

IN4

OUT2

OUT3

OUT4

STROBE

IN1

OUT1

IN2

IN3

IN4

OUT2

OUT3

OUT4

MIC5800/1


FIGURE 4-4: MIC5801 Relay Driver.

FIGURE 4-5: MIC5800 Incandescent/Halogen Lamp Driver.

1

2

3

4

5

6

7

24

23

22

21

20

19

18LA

TCH

ES

8

9

10

11

17

16

15

14

12 13

K1

K3

K2

K8

K7

K6

K5

K4

STROBE

INPUT 7

INPUT 6

INPUT 5

INPUT 4

INPUT 3

INPUT 2

INPUT 1

+12V+5V

CLEAR

INPUT 8

Relays: Guardian Electric 1725-1C-12D

0.1μF 22μF

+

1

2

3

4

5

6

7

14

13

12

11

10

9

8

LATC

HE

S

+24V+5V

INPUT 4

INPUT 3

INPUT 2

INPUT 1

0.1μF 22μF +

Note: Lamp inrush current is approximately 10× lamp operating current.


MIC5800/1

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

Example28-Lead PLCC*

XXXXXXXXXXXXXXXWNNN

MICRELMIC5801YV7691

Example24-Lead SOICW*

XXXXXXXXXXXXXXXXWNNN

MICRELMIC5801YWM8664

Example14-Lead PDIP*

XXXXXXXXXXXXXXXWNNN

MICRELMIC5800YN3570

Example14-Lead SOIC*

XXXXXXXXXXXXXXXWNNN

MICRELMIC5800YM1963

Legend: XX...X Product code or customer-specific informationY Year code (last digit of calendar year)YY Year code (last 2 digits of calendar year)WW Week code (week of January 1 is week ‘01’)NNN Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn)* This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

, , Pin one index is identified by a dot, delta up, or delta down (trianglemark).

Note: In the event the full Microchip part number cannot be marked on one line, it willbe carried over to the next line, thus limiting the number of availablecharacters for customer-specific information. Package may or may not includethe corporate logo.

Underbar (_) and/or Overbar (⎯) symbol may not be to scale.

3e

3e

MIC5800/1


14-Lead Plastic Small Outline SOIC Package Outline and Recommended Land Pattern

0.20 C

0.25 C A–B D

1 2

N

2X N/2 TIPS

TOP VIEW

SIDE VIEW

VIEW A–A

Microchip Technology Drawing No. C04-065-D3X Rev D

For the most current package drawings, please see the Microchip Packaging Specification located athttp://www.microchip.com/packaging

Note:

A

e

B

E

D

E2

D

E1

E22

NX b

A1

A2ACSEATING

PLANE

0.10 C14X

0.10 C A–B

0.10 C D

c

hh

H

SEE VIEW C

(L1)L

R0.13R0.13

VIEW C

NOTE 1 3

0.10 C

NOTE 5

NOTE 5

2X

2X

14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC]Atmel Legacy Global Package Code SVQ


MIC5800/1

Microchip Technology Drawing No. C04-065-D3X Rev D Sheet 2 of 2

14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC]


Note:

Foot Angle 0° - 8°

15°-5°Mold Draft Angle Bottom15°-5°Mold Draft Angle Top0.51-0.31bLead Width0.25-0.10cLead Thickness

1.04 REFL1Footprint

0.50-0.25hChamfer (Optional)8.65 BSCDOverall Length3.90 BSCE1Molded Package Width6.00 BSCEOverall Width

0.25-0.10A1Standoff--1.25A2Molded Package Thickness

1.75--AOverall Height1.27 BSCePitch

14NNumber of PinsMAXNOMMINDimension Limits

MILLIMETERSUnits

Foot Length L 0.40 - 1.27

§

or protrusion, which shall not exceed 0.25 mm per side.

3.

REF: Reference Dimension, usually without tolerance, for information purposes only.BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1.2.

4.

Notes:

Dimension D does not include mold flash, protrusions or gate burrs, which shall

Pin 1 visual index feature may vary, but must be located within the hatched area.§ Significant Characteristic

Dimensioning and tolerancing per ASME Y14.5M

not exceed 0.15 mm per end. Dimension E1 does not include interlead flash

5. Datums A & B to be determined at Datum H.

Lead Angle 0° - -

Atmel Legacy Global Package Code SVQ

MIC5800/1


RECOMMENDED LAND PATTERN

Dimension LimitsUnits

Contact Pitch

MILLIMETERS

1.27 BSCMIN

EMAX

Contact Pad Length (X14)Contact Pad Width (X14)

YX

1.550.60

NOM

CContact Pad Spacing 5.40

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:Dimensioning and tolerancing per ASME Y14.5M1.


Note:

E

X

Y

C

SILK SCREEN

Microchip Technology Drawing No. C04-2065-D3X Rev D

1 2

14

14-Lead Plastic Small Outline (D3X, UEB, M5B, UEB) - Narrow, 3.90 mm Body [SOIC]Atmel Legacy Global Package Code SVQ


MIC5800/1

14-Lead PDIP Package Outline and Recommended Land Pattern

Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.

MIC5800/1


28-Lead PLCC Package Outline and Recommended Land Pattern



MIC5800/1

24-Lead SOICW Package Outline and Recommended Land Pattern


MIC5800/1


NOTES:


MIC5800/1

APPENDIX A: REVISION HISTORY

Revision A (April 2019)

• Converted Micrel document MIC5800/1 to Micro-chip data sheet template DS20006184A.

• Minor grammatical text changes throughout.

MIC5800/1


NOTES:


MIC5800/1

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.

Examples:

a) MIC5800YM: MIC5800, –40°C to +85°CTemperature Range, 14-LeadSOIC, 54/Tube

b) MIC5800YM-TR: MIC5800, –40°C to +85°CTemperature Range, 14-LeadSOIC, 2,500/Reel

c) MIC5800YN: MIC5800, –40°C to +85°CTemperature Range, 14-LeadPDIP, 25/Tube

d) MIC5801YV: MIC5801, –40°C to +85°CTemperature Range, 28-LeadPLCC, 38/Tube

e) MIC5801YV-TR: MIC5801, –40°C to +85°CTemperature Range, 28-LeadPLCC, 750/Reel

f) MIC5801YWM: MIC5801, –40°C to +85°CTemperature Range, 24-LeadWide SOIC, 31/Tube

g) MIC5801YWM-TR: MIC5801, –40°C to +85°CTemperature Range, 24-LeadWide SOIC, 1,000/Reel

Device:

MIC5800: 4-Bit Parallel-Input, High-Voltage, High-Current Latched Driver

MIC5801: 8-Bit Parallel-Input, High-Voltage, High-Current Latched Driver

Junction Temperature Range:

Y = –40°C to +85°C, Industrial

Package:

M = 14-Lead SOIC (MIC5800)N = 14-Lead PDIP (MIC5800)V = 28-Lead PLCC (MIC5801)WM = 24-Lead Wide SOIC (MIC5801)

Media Type:

<blank>= 54/Tube (M, MIC5800)<blank>= 25/Tube (N, MIC5800)<blank>= 38/Tube (V, MIC5801)<blank>= 31/Tube (WM, MIC5801)TR = 750/Reel (V, MIC5801)TR = 1,000/Reel (WM, MIC5801)TR = 2,500/Reel (M, MIC5800) Note 1: Tape and Reel identifier only appears in the

catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option.

Device X XX -XX

Part No. Junction Temp. Range

Package Media Type

MIC5800/1


NOTES:


Information contained in this publication regarding deviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensure that your application meets with your specifications.MICROCHIP MAKES NO REPRESENTATIONS ORWARRANTIES OF ANY KIND WHETHER EXPRESS ORIMPLIED, WRITTEN OR ORAL, STATUTORY OROTHERWISE, RELATED TO THE INFORMATION,INCLUDING BUT NOT LIMITED TO ITS CONDITION,QUALITY, PERFORMANCE, MERCHANTABILITY ORFITNESS FOR PURPOSE. Microchip disclaims all liabilityarising from this information and its use. Use of Microchipdevices in life support and/or safety applications is entirely atthe buyer’s risk, and the buyer agrees to defend, indemnify andhold harmless Microchip from any and all damages, claims,suits, or expenses resulting from such use. No licenses areconveyed, implicitly or otherwise, under any Microchipintellectual property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

© 2019, Microchip Technology Incorporated, All Rights Reserved.

ISBN: 978-1-5224-4361-2

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

QUALITYMANAGEMENTSYSTEMCERTIFIEDBYDNV

== ISO/TS16949==


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4/8-Bit Parallel-Input Latched Drivers

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