400µm 12mm Steps Towards Mass Production - Stackspx491tp4561/SJ Osterfeld...Layer A: PDMS...

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Layer A: PDMS Microfluidics Testing and Protocol Optimization Testing and Protocol Optimization Steps Towards Mass Production Steps Towards Mass Production Sebastian J. Osterfeld Sebastian J. Osterfeld 1 1 , , Shu Shu - - Jen Han Jen Han 1 1 , Stefano Caramuta , Stefano Caramuta 2 2 , , Liang Liang Xu Xu 1 1 , , Heng Heng Yu Yu 2 2 , Jin Xie , Jin Xie 3 3 Shouheng Shouheng Sun Sun 3 3 , , Nader Nader Pourmand Pourmand 2 2 , Shan X. Wang , Shan X. Wang 1 1 1. Stanford University 1. Stanford University 2. Stanford Genome Technology Center 2. Stanford Genome Technology Center 3. Brown University 3. Brown University (Project funded by DARPA) (Project funded by DARPA) Testing and Fabrication of the MagArray Testing and Fabrication of the MagArray ® ® Biochip Biochip Our aim is to repeatedly test prototype chips with a variety of Our aim is to repeatedly test prototype chips with a variety of nanoparticles nanoparticles , biological molecules, and various , biological molecules, and various experimental protocols, to determine and improve the performance experimental protocols, to determine and improve the performance characteristics of the MagArray. For maximum characteristics of the MagArray. For maximum flexibility, each chip needs to be individually functionalized w flexibility, each chip needs to be individually functionalized w ith ith biomolecules biomolecules . As a result, the prototype chips employ . As a result, the prototype chips employ sensors on a freely accessible surface, and macroscopic fluidics sensors on a freely accessible surface, and macroscopic fluidics are employed instead of are employed instead of microfluidics microfluidics to deliver the to deliver the reagents during the measurement. reagents during the measurement. Left: A prototype MagArray4 chip, made Left: A prototype MagArray4 chip, made at Stanford. Inside the well are two freely at Stanford. Inside the well are two freely accessible arrays, each containing 16 accessible arrays, each containing 16 individually addressable sensors. At the individually addressable sensors. At the Stanford Genome Technology Center, the Stanford Genome Technology Center, the 16 sensors on the left are manually 16 sensors on the left are manually functionalized with a different functionalized with a different biochemistry than the 16 sensors on the biochemistry than the 16 sensors on the right. Additional sensors, in this case 32, right. Additional sensors, in this case 32, are covered with epoxy and serve as an are covered with epoxy and serve as an absolute control. absolute control. 25mm Right: After functionalization, the Right: After functionalization, the chip is returned to Stanford chip is returned to Stanford University for measurements. During University for measurements. During the prototype experiments, the prototype experiments, macrofluidics macrofluidics are employed to are employed to repeatedly transport the reagents to repeatedly transport the reagents to and from the chip. Not shown are the and from the chip. Not shown are the readout electronics and magnetic readout electronics and magnetic field generators for the chip. field generators for the chip. While the prototype chips reach maturity, we also work to While the prototype chips reach maturity, we also work to to to ensure that the functionalization protocol and experimental ensure that the functionalization protocol and experimental procedure can be quickly migrated to a mass procedure can be quickly migrated to a mass - - produced version of the MagArray. This effort encompasses three produced version of the MagArray. This effort encompasses three critical critical areas: Whole areas: Whole - - wafer robotic biofunctionalization, alignment wafer robotic biofunctionalization, alignment - - and topography tolerant and topography tolerant microfluidics microfluidics for reagent transport, for reagent transport, and mass and mass - - producible producible microfluidic microfluidic interconnects that do not require the drilling of holes. All th interconnects that do not require the drilling of holes. All th ese three areas are designed ese three areas are designed to become integral parts of the manufacturing process. to become integral parts of the manufacturing process. Whole Whole - - Wafer Robotic Biofunctionalization Wafer Robotic Biofunctionalization Mass Mass - - Producible Producible Microfluidic Microfluidic Interconnects Interconnects Sensors 1-16: DNA or Antigen1 Sensors 49-64: Bare or Antigen2 The Prototype MagArray4 Chip The Prototype MagArray4 Chip Representative Functionalization and Representative Functionalization and Experimental Protocol Experimental Protocol Magnetic nanoparticle w/ Streptavidin Antigen 1: Ferritin Biotin Antibody (Anti-Ferritin) Antigen 2: BSA Nanoparticle Solution Sensors 17-48 Sensors 49-64 Sensors 1-16 Epoxy Antibody Solution Sensors 17-48 Sensors 49-64 Sensors 1-16 Epoxy BSA Solution Ferritin Solution Sensors 17-48 Sensors 49-64 Sensors 1-16 Epoxy Functionalization 1. The antigens are applied selectively Measurement Results Measurement Results Shown on the right is a measurement curve that was Shown on the right is a measurement curve that was recorded as MACS recorded as MACS nanoparticles nanoparticles , coated with , coated with streptavidin streptavidin , , were binding to a MagArray4 chip. Some sensors on the were binding to a MagArray4 chip. Some sensors on the chip were bare. These resulted in the yellow signal curve chip were bare. These resulted in the yellow signal curve with a final value of ca. 1 with a final value of ca. 1 μ μ V. V. Other sensors on the same chip were functionalized with Other sensors on the same chip were functionalized with single stranded single stranded biotinylated biotinylated DNA. These sensors, in red, DNA. These sensors, in red, show a rapid increase in signal to ca. 38 show a rapid increase in signal to ca. 38 μ μ V as soon as the V as soon as the nanoparticles nanoparticles are applied around t = 25 minutes. Thus, the are applied around t = 25 minutes. Thus, the nanoparticles nanoparticles are clearly revealing the presence of DNA on are clearly revealing the presence of DNA on the chip with a signal to noise ratio of ca. 31 dB. The signal the chip with a signal to noise ratio of ca. 31 dB. The signal rise time of the red curve can also give insights into the rise time of the red curve can also give insights into the biotin biotin - - streptavidin streptavidin binding kinetics. binding kinetics. Note that the washing the chip with Note that the washing the chip with deionized deionized water (H2O) water (H2O) leads to temporary shifts in the signal, but it does not leads to temporary shifts in the signal, but it does not remove the remove the nanoparticles nanoparticles . The wash at t = 73 minutes only . The wash at t = 73 minutes only minimally reduces the signal minimally reduces the signal - - MACS are bound strongly. MACS are bound strongly. In the second figure, a different functionalization based on In the second figure, a different functionalization based on antibodies was used. The red curve shows the binding of antibodies was used. The red curve shows the binding of nanoparticles nanoparticles to the to the ferritin ferritin - - functionalized sites. The large functionalized sites. The large signal increase of these sites reveals the presence of an anti signal increase of these sites reveals the presence of an anti - - ferritin ferritin antibody. On the other hand, the lack of a distinct antibody. On the other hand, the lack of a distinct signal increase of the BSA signal increase of the BSA - - functionalized sensors reveals functionalized sensors reveals that no anti that no anti - - BSA antibodies were present. BSA antibodies were present. The rise time of the anti The rise time of the anti - - ferritin ferritin signal is slower than in the signal is slower than in the experiment using DNA, possibly indicating a lower density experiment using DNA, possibly indicating a lower density of available biotin sites on the chip surface. The exact of available biotin sites on the chip surface. The exact relation of signal and binding kinetics is being investigated relation of signal and binding kinetics is being investigated in more detail. in more detail. The electron microscope images on the right, taken after the The electron microscope images on the right, taken after the experiment, show clearly that signal differences correspond experiment, show clearly that signal differences correspond to to nanoparticle nanoparticle coverage differences. coverage differences. Substrate SV SiO 2 SiO 2 Au Au lead Au lead Spotting Needle Upper Right: Upper Right: Shown here is the result of a sample Shown here is the result of a sample run of our functionalization robot. run of our functionalization robot. The robot has placed different The robot has placed different functionalizations functionalizations on different on different sensors as programmed with good sensors as programmed with good accuracy. accuracy. Lower Right: Lower Right: Shown here is a Shown here is a microfluidic microfluidic MagArray4 chip. Instead of the open MagArray4 chip. Instead of the open well that the prototype has, this chip well that the prototype has, this chip features closed features closed microfluidic microfluidic structures that carry the reagents structures that carry the reagents across the chip. Some of the larger across the chip. Some of the larger microfluidic microfluidic features are visible in features are visible in the center of the chip. Note also the the center of the chip. Note also the three three DNA Align DNA Align marks that aid marks that aid the robot the robot - - to to - - chip alignment. chip alignment. The robotic functionalization is The robotic functionalization is applied first, and then encapsulated applied first, and then encapsulated by the by the microfluidic microfluidic structures. structures. 400μm 12mm Left: Left: A schematic representation of the A schematic representation of the chip and the robotically controlled chip and the robotically controlled spotting needle used for the spotting needle used for the functionalization. functionalization. In a custom In a custom - - build application, the build application, the functionalization for each of the 64 functionalization for each of the 64 (or more) sensors can be individually (or more) sensors can be individually programmed. A video camera is used programmed. A video camera is used to control the functionalization and to to control the functionalization and to aid in the alignment of the robotic aid in the alignment of the robotic applicator to either a single chip, or applicator to either a single chip, or to an entire wafer. The program is to an entire wafer. The program is highly flexible and adaptable to a highly flexible and adaptable to a variety of chips. It can apply up to variety of chips. It can apply up to 384 different 384 different functionalizations functionalizations e.g. e.g. antibodies or genes of interest antibodies or genes of interest to an to an arbitrarily sized and positioned arbitrarily sized and positioned substrate. substrate. Shown in the lower image is the Shown in the lower image is the robotic applicator and video camera robotic applicator and video camera during a test run. during a test run. Topography Topography - - and Alignment and Alignment - - Tolerant Tolerant Microfluidics Microfluidics Optical microscope and electron microscope images of the two microfluidic layers combined and separated. The reagents are guided towards the sensor in the large and, since they are on a separate wafer, coarsely aligned PDMS channels. The reagents then traverse the actual sensor in the much narrower and precisely aligned SiO2 channel. Layer B: SiO2 Microfluidics Flow 20 μm To be suitable for high To be suitable for high - - yield mass production, it is important that yield mass production, it is important that the the microfluidics microfluidics are somewhat tolerant to small alignment and are somewhat tolerant to small alignment and process variations. This is achieved with a 2 process variations. This is achieved with a 2 - - layer process. Layer A layer process. Layer A carries large channels and is fabricated on a separate wafer fro carries large channels and is fabricated on a separate wafer fro m m polydimethylsiloxane polydimethylsiloxane (PDMS). Layer B is fabricated right on the (PDMS). Layer B is fabricated right on the MagArray4 substrate wafer from SiO2 with photolithographic MagArray4 substrate wafer from SiO2 with photolithographic precision. Layer B contains the small precision. Layer B contains the small microfluidic microfluidic features, such as features, such as sub sub - - micron channels over the active sensing elements. The overlap micron channels over the active sensing elements. The overlap of the layers is generously sized to accommodate alignment error of the layers is generously sized to accommodate alignment error s s (see finished sample structure on the right). (see finished sample structure on the right). After the MagArray4 substrate wafer has been robotically After the MagArray4 substrate wafer has been robotically functionalized, the support wafer carrying layer A is cold seale functionalized, the support wafer carrying layer A is cold seale d to d to the substrate wafer. Since PDMS is the substrate wafer. Since PDMS is elastomeric elastomeric , it can seal over , it can seal over uneven topography and even accommodate an occasional particle uneven topography and even accommodate an occasional particle this would be impossible with the standard procedure of anodic this would be impossible with the standard procedure of anodic bonding. bonding. Sensor Electric lead Connecting the Connecting the microfluidic microfluidic structures to the outside world is one of the engineering structures to the outside world is one of the engineering challenges. We have developed an automatable approach which does challenges. We have developed an automatable approach which does not require the drilling not require the drilling of holes into any of the wafers, which would be laborious and un of holes into any of the wafers, which would be laborious and un wanted for wafer processing. wanted for wafer processing. The main feature consists of cleavable edges that, once removed, The main feature consists of cleavable edges that, once removed, provide openings to the provide openings to the microfluidics microfluidics . These openings can be robotically sealed to a complementary, s . These openings can be robotically sealed to a complementary, s elf elf - - centering centering microfluidic microfluidic holder, which can be a cheap mass holder, which can be a cheap mass - - producible plastic part. On the right, a producible plastic part. On the right, a MagArray prototype with working two MagArray prototype with working two - - layer layer microfluidics microfluidics and and microfluidic microfluidic holders is shown. holders is shown. Microfluidic Holder Microfluidic Channel IV Tubing Large channel, Ca. 10μm deep Ca. 2-100μm wide Sensor Shallow trench, Ca. 200nm deep Ca. 1-5μm wide Layer B SiO2, 200nm thick PDMS Sub-micron channel, Ca. 180nm deep Layer A Layer B Layer A PDMS 10μm thick Support Wafer (glass) Large channel, Ca. 10μm deep Ca. 2-100μm wide Substrate Wafer (silicon) Sensor Shallow trench, Ca. 200nm deep Ca. 1-5μm wide Layer B SiO2, 200nm thick PDMS PDMS Support Wafer (glass) Substrate Wafer (silicon) Sub-micron channel, Ca. 180nm deep Layer A Layer B Layer B Layer B Layer B Microfluidic Layer B PDMS Support Wafer (glass) Substrate Wafer (silicon) Layer A Layer B Partial Cut Layer B PDMS Support Wafer (glass) Substrate Wafer (silicon) Layer A Layer B Insert blade and twist edge off Layer B Microfluidic PDMS Support Wafer (glass) Substrate Wafer (silicon) Layer A Layer B Microfluidic opening Layer B Layer B PDMS Support Wafer (glass) Substrate Wafer (silicon) Layer A Layer B Adhesive Microfluidic Holder Inlet / Outlet DNA Detection (ssDNA w/ Biotin) on the MagArray4 Wafer RB2, Chip 2-2, Nov-29-2005, using Streptavidin Nanoparticles (MACS) -10 0 10 20 30 40 50 0 10 20 30 40 50 60 70 Timeline, Minutes Signal Amplitude, μV ssDNA-Biotin Bare Sensor H2O H2O H2O H2O Nanoparticles <-- SNR ~ 31 dB --> Figure 1: DNA Detection Antibody Detection (Anti-Ferritin w/ Biotin) on the MagArray4 Wafer RB2, Chip X-1, Jan-18-2006, using Streptavidin Nanoparticles (MACS) -10 0 10 20 30 40 50 0 10 20 30 40 50 60 70 Timeline, Minutes Signal Amplitude, μV Ferritin BSA PBS H2O PBS PBS PBS PBS PBS PBS PBS PBS H2O H2O Nanoparticles <-- SNR ~ 21dB --> Figure 2: Antibody Detection The measurement is carried out while the nanoparticles bind Functionalization 2. The biotinylated antibody is applied globally

Transcript of 400µm 12mm Steps Towards Mass Production - Stackspx491tp4561/SJ Osterfeld...Layer A: PDMS...

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pplie

d se

lect

ivel

y

Mea

sure

men

t Res

ults

Mea

sure

men

t Res

ults

Show

n on

the

rig

ht i

s a

mea

sure

men

t cu

rve

that

was

Sh

own

on t

he r

ight

is

a m

easu

rem

ent

curv

e th

at w

as

reco

rded

as

MA

CS

reco

rded

as

MA

CS

nano

parti

cles

nano

parti

cles

, coa

ted

with

, c

oate

d w

ith s

trept

avid

inst

rept

avid

in, ,

wer

e bi

ndin

g to

a M

agA

rray

4 ch

ip.

Som

e se

nsor

s on

the

w

ere

bind

ing

to a

Mag

Arr

ay4

chip

. So

me

sens

ors

on t

he

chip

wer

e ba

re.

Thes

e re

sulte

d in

the

yel

low

sig

nal

curv

e ch

ip w

ere

bare

. Th

ese

resu

lted

in t

he y

ello

w s

igna

l cu

rve

with

a fi

nal v

alue

of c

a. 1

w

ith a

fina

l val

ue o

f ca.

1 µµ

V.

V.

Oth

er s

enso

rs o

n th

e sa

me

chip

wer

e fu

nctio

naliz

ed w

ith

Oth

er s

enso

rs o

n th

e sa

me

chip

wer

e fu

nctio

naliz

ed w

ith

sing

le s

trand

ed

sing

le s

trand

ed b

iotin

ylat

edbi

otin

ylat

edD

NA

. Th

ese

sens

ors,

in r

ed,

DN

A.

Thes

e se

nsor

s, in

red

, sh

ow a

rapi

d in

crea

se in

sig

nal t

o ca

. 38

show

a ra

pid

incr

ease

in s

igna

l to

ca. 3

8 µµ V

as

soon

as

the

V a

s so

on a

s th

e na

nopa

rticl

esna

nopa

rticl

esar

e ap

plie

d ar

ound

t =

25 m

inut

es. T

hus,

the

are

appl

ied

arou

nd t

= 25

min

utes

. Thu

s, th

e na

nopa

rticl

esna

nopa

rticl

esar

e cl

early

reve

alin

g th

e pr

esen

ce o

f DN

A o

n ar

e cl

early

reve

alin

g th

e pr

esen

ce o

f DN

A o

n th

e ch

ip w

ith a

sig

nal t

o no

ise

ratio

of c

a. 3

1 dB

. The

sig

nal

the

chip

with

a s

igna

l to

nois

e ra

tio o

f ca.

31

dB. T

he s

igna

l ris

e tim

e of

the

red

cur

ve c

an a

lso

give

ins

ight

s in

to t

he

rise

time

of t

he r

ed c

urve

can

als

o gi

ve i

nsig

hts

into

the

bi

otin

biot

in-- s

trept

avid

inst

rept

avid

inbi

ndin

g ki

netic

s. bi

ndin

g ki

netic

s.

Not

e th

at th

e w

ashi

ng th

e ch

ip w

ith

Not

e th

at th

e w

ashi

ng th

e ch

ip w

ith d

eion

ized

deio

nize

dw

ater

(H2O

) w

ater

(H2O

) le

ads

to t

empo

rary

shi

fts i

n th

e si

gnal

, bu

t it

does

not

le

ads

to t

empo

rary

shi

fts i

n th

e si

gnal

, bu

t it

does

not

re

mov

e th

e re

mov

e th

e na

nopa

rticl

esna

nopa

rticl

es. T

he w

ash

at t

= 73

min

utes

onl

y . T

he w

ash

at t

= 73

min

utes

onl

y m

inim

ally

redu

ces t

he si

gnal

m

inim

ally

redu

ces t

he si

gnal

--M

AC

S ar

e bo

und

stro

ngly

.M

AC

S ar

e bo

und

stro

ngly

.

In th

e se

cond

fig

ure,

a d

iffer

ent f

unct

iona

lizat

ion

base

d on

In

the

seco

nd f

igur

e, a

diff

eren

t fun

ctio

naliz

atio

n ba

sed

on

antib

odie

s w

as u

sed.

The

red

cur

ve s

how

s th

e bi

ndin

g of

an

tibod

ies

was

use

d. T

he r

ed c

urve

sho

ws

the

bind

ing

of

nano

parti

cles

nano

parti

cles

to t

he

to t

he f

errit

infe

rriti

n --fu

nctio

naliz

ed s

ites.

The

larg

e fu

nctio

naliz

ed s

ites.

The

larg

e si

gnal

incr

ease

of t

hese

site

s re

veal

s th

e pr

esen

ce o

f an

anti

sign

al in

crea

se o

f the

se s

ites

reve

als

the

pres

ence

of a

n an

ti --fe

rriti

nfe

rriti

nan

tibod

y. O

n th

e ot

her

hand

, the

lac

k of

a d

istin

ct

antib

ody.

On

the

othe

r ha

nd, t

he l

ack

of a

dis

tinct

si

gnal

inc

reas

e of

the

BSA

sign

al i

ncre

ase

of t

he B

SA-- f

unct

iona

lized

sen

sors

rev

eals

fu

nctio

naliz

ed s

enso

rs r

evea

ls

that

no

anti

that

no

anti --

BSA

ant

ibod

ies w

ere

pres

ent.

BSA

ant

ibod

ies w

ere

pres

ent.

The

rise

time

of th

e an

tiTh

e ris

e tim

e of

the

anti --

ferr

itin

ferr

itin

sign

al is

slo

wer

than

in th

e si

gnal

is s

low

er th

an in

the

expe

rimen

t usi

ng D

NA

, pos

sibl

y in

dica

ting

a lo

wer

den

sity

ex

perim

ent u

sing

DN

A, p

ossi

bly

indi

catin

g a

low

er d

ensi

ty

of a

vaila

ble

biot

in s

ites

on t

he c

hip

surf

ace.

The

exa

ct

of a

vaila

ble

biot

in s

ites

on t

he c

hip

surf

ace.

The

exa

ct

rela

tion

of s

igna

l and

bin

ding

kin

etic

s is

bei

ng in

vest

igat

ed

rela

tion

of s

igna

l and

bin

ding

kin

etic

s is

bei

ng in

vest

igat

ed

in m

ore

deta

il.in

mor

e de

tail.

The

elec

tron

mic

rosc

ope

imag

es o

n th

e rig

ht, t

aken

afte

r the

Th

e el

ectro

n m

icro

scop

e im

ages

on

the

right

, tak

en a

fter t

he

expe

rimen

t, sh

ow c

lear

ly th

at s

igna

l diff

eren

ces

corr

espo

nd

expe

rimen

t, sh

ow c

lear

ly th

at s

igna

l diff

eren

ces

corr

espo

nd

to

to n

anop

artic

lena

nopa

rticl

eco

vera

ge d

iffer

ence

s.co

vera

ge d

iffer

ence

s.

Subs

trate

SVSi

O2

SiO

2

Au

Au

lead

Au

lead

Spot

ting

Nee

dle

Upp

er R

ight

:U

pper

Rig

ht:

Show

n he

re is

the

resu

lt of

a s

ampl

e Sh

own

here

is th

e re

sult

of a

sam

ple

run

of o

ur f

unct

iona

lizat

ion

robo

t. ru

n of

our

fun

ctio

naliz

atio

n ro

bot.

The

robo

t ha

s pl

aced

di

ffer

ent

The

robo

t ha

s pl

aced

di

ffer

ent

func

tiona

lizat

ions

func

tiona

lizat

ions

on

diff

eren

t on

di

ffer

ent

sens

ors

as p

rogr

amm

ed w

ith g

ood

sens

ors

as p

rogr

amm

ed w

ith g

ood

accu

racy

.ac

cura

cy.

Low

er R

ight

:Lo

wer

Rig

ht:

Show

n he

re is

a

Show

n he

re is

a m

icro

fluid

icm

icro

fluid

icM

agA

rray

4 ch

ip. I

nste

ad o

f the

ope

n M

agA

rray

4 ch

ip. I

nste

ad o

f the

ope

n w

ell t

hat t

he p

roto

type

has

, thi

s chi

p w

ell t

hat t

he p

roto

type

has

, thi

s chi

p fe

atur

es c

lose

d fe

atur

es c

lose

d m

icro

fluid

icm

icro

fluid

icst

ruct

ures

that

car

ry th

e re

agen

ts

stru

ctur

es th

at c

arry

the

reag

ents

ac

ross

the

chip

. Som

e of

the

larg

er

acro

ss th

e ch

ip. S

ome

of th

e la

rger

m

icro

fluid

icm

icro

fluid

icfe

atur

es a

re v

isib

le in

fe

atur

es a

re v

isib

le in

th

e ce

nter

of t

he c

hip.

Not

e al

so th

e th

e ce

nter

of t

he c

hip.

Not

e al

so th

e th

ree

thre

e ““ D

NA

Alig

nD

NA

Alig

n ””m

arks

that

aid

m

arks

that

aid

th

e ro

bot

the

robo

t -- toto

-- chi

p al

ignm

ent.

chip

alig

nmen

t.

The

robo

tic fu

nctio

naliz

atio

n is

Th

e ro

botic

func

tiona

lizat

ion

is

appl

ied

first

, and

then

enc

apsu

late

d ap

plie

d fir

st, a

nd th

en e

ncap

sula

ted

by th

e by

the

mic

roflu

idic

mic

roflu

idic

stru

ctur

es.

stru

ctur

es.

400µ

m

12m

m

Left:

Le

ft:

A

sche

mat

ic

repr

esen

tatio

n of

th

e A

sc

hem

atic

re

pres

enta

tion

of

the

chip

and

the

rob

otic

ally

con

trolle

d ch

ip a

nd t

he r

obot

ical

ly c

ontro

lled

spot

ting

need

le

used

fo

r th

e sp

ottin

g ne

edle

us

ed

for

the

func

tiona

lizat

ion.

func

tiona

lizat

ion.

In a

cus

tom

In a

cus

tom

-- bui

ld a

pplic

atio

n, th

e bu

ild a

pplic

atio

n, th

e fu

nctio

naliz

atio

n fo

r eac

h of

the

64

func

tiona

lizat

ion

for e

ach

of th

e 64

(o

r mor

e) se

nsor

s can

be

indi

vidu

ally

(o

r mor

e) se

nsor

s can

be

indi

vidu

ally

pr

ogra

mm

ed. A

vid

eo c

amer

a is

use

d pr

ogra

mm

ed. A

vid

eo c

amer

a is

use

d to

con

trol t

he fu

nctio

naliz

atio

n an

d to

to

con

trol t

he fu

nctio

naliz

atio

n an

d to

ai

d in

the

alig

nmen

t of t

he ro

botic

ai

d in

the

alig

nmen

t of t

he ro

botic

ap

plic

ator

to e

ither

a si

ngle

chi

p, o

r ap

plic

ator

to e

ither

a si

ngle

chi

p, o

r to

an

entir

e w

afer

. The

pro

gram

is

to a

n en

tire

waf

er. T

he p

rogr

am is

hi

ghly

flex

ible

and

ada

ptab

le to

a

high

ly fl

exib

le a

nd a

dapt

able

to a

va

riety

of c

hips

. It c

an a

pply

up

to

varie

ty o

f chi

ps. I

t can

app

ly u

p to

38

4 di

ffer

ent

384

diff

eren

t fun

ctio

naliz

atio

nsfu

nctio

naliz

atio

ns––

e.g.

e.

g.

antib

odie

s or g

enes

of i

nter

est

antib

odie

s or g

enes

of i

nter

est ––

to a

n to

an

arbi

traril

y si

zed

and

posi

tione

d ar

bitra

rily

size

d an

d po

sitio

ned

subs

trate

.su

bstra

te.

Show

n in

the

low

er im

age

is th

e Sh

own

in th

e lo

wer

imag

e is

the

robo

tic a

pplic

ator

and

vid

eo c

amer

a ro

botic

app

licat

or a

nd v

ideo

cam

era

durin

g a

test

run.

durin

g a

test

run.

Topo

grap

hyTo

pogr

aphy

-- and

Alig

nmen

tan

d A

lignm

ent --

Tole

rant

To

lera

nt M

icro

fluid

ics

Mic

roflu

idic

s

Opt

ical

mic

rosc

ope

and

elec

tron

mic

rosc

ope

imag

es o

f the

two

mic

roflu

idic

laye

rs

com

bine

d an

d se

para

ted.

The

rea

gent

s are

gui

ded

tow

ards

the

sens

or in

the

larg

e an

d,

sinc

e th

ey a

re o

n a

sepa

rate

waf

er, c

oars

ely

alig

ned

PDM

S ch

anne

ls. T

he r

eage

nts t

hen

trav

erse

the

actu

al se

nsor

in th

e m

uch

narr

ower

and

pre

cise

ly a

ligne

d Si

O2

chan

nel.

Lay

er B

: SiO

2 M

icro

fluid

ics

Flow 20

µm

To b

e su

itabl

e fo

r hi

ghTo

be

suita

ble

for

high

-- yie

ld m

ass

prod

uctio

n, it

is im

porta

nt th

at

yiel

d m

ass

prod

uctio

n, it

is im

porta

nt th

at

the

the

mic

roflu

idic

sm

icro

fluid

ics

are

som

ewha

t to

lera

nt t

o sm

all

alig

nmen

t an

d ar

e so

mew

hat

tole

rant

to

smal

l al

ignm

ent

and

proc

ess

varia

tions

. Thi

s is

ach

ieve

d w

ith a

2pr

oces

s va

riatio

ns. T

his

is a

chie

ved

with

a 2

-- laye

r pro

cess

. Lay

er A

la

yer p

roce

ss. L

ayer

A

carr

ies

larg

e ch

anne

ls a

nd i

s fa

bric

ated

on

a se

para

te w

afer

fro

carr

ies

larg

e ch

anne

ls a

nd i

s fa

bric

ated

on

a se

para

te w

afer

fro

m

m

poly

dim

ethy

lsilo

xane

poly

dim

ethy

lsilo

xane

(PD

MS)

. Lay

er B

is

fabr

icat

ed r

ight

on

the

(PD

MS)

. Lay

er B

is

fabr

icat

ed r

ight

on

the

Mag

Arr

ay4

subs

trate

waf

er f

rom

SiO

2 w

ith p

hoto

litho

grap

hic

Mag

Arr

ay4

subs

trate

waf

er f

rom

SiO

2 w

ith p

hoto

litho

grap

hic

prec

isio

n. L

ayer

B c

onta

ins

the

smal

l pr

ecis

ion.

Lay

er B

con

tain

s th

e sm

all m

icro

fluid

icm

icro

fluid

icfe

atur

es, s

uch

as

feat

ures

, suc

h as

su

bsu

b --m

icro

n ch

anne

ls o

ver t

he a

ctiv

e se

nsin

g el

emen

ts. T

he o

verla

p m

icro

n ch

anne

ls o

ver t

he a

ctiv

e se

nsin

g el

emen

ts. T

he o

verla

p of

the

laye

rs is

gen

erou

sly

size

d to

acc

omm

odat

e al

ignm

ent e

rror

of th

e la

yers

is g

ener

ousl

y si

zed

to a

ccom

mod

ate

alig

nmen

t err

ors s

(see

fini

shed

sam

ple

stru

ctur

e on

the

right

).(s

ee fi

nish

ed sa

mpl

e st

ruct

ure

on th

e rig

ht).

Afte

r th

e M

agA

rray

4 su

bstra

te

waf

er

has

been

ro

botic

ally

A

fter

the

Mag

Arr

ay4

subs

trate

w

afer

ha

s be

en

robo

tical

ly

func

tiona

lized

, the

sup

port

waf

er c

arry

ing

laye

r A is

col

d se

ale

func

tiona

lized

, the

sup

port

waf

er c

arry

ing

laye

r A is

col

d se

ale d

to

d to

th

e su

bstra

te w

afer

. Si

nce

PDM

S is

th

e su

bstra

te w

afer

. Si

nce

PDM

S is

ela

stom

eric

elas

tom

eric

, it

can

seal

ove

r ,

it ca

n se

al o

ver

unev

en to

pogr

aphy

and

eve

n ac

com

mod

ate

an o

ccas

iona

l par

ticle

un

even

topo

grap

hy a

nd e

ven

acco

mm

odat

e an

occ

asio

nal p

artic

le ––

this

wou

ld b

e im

poss

ible

with

the

sta

ndar

d pr

oced

ure

of a

nodi

c th

is w

ould

be

impo

ssib

le w

ith t

he s

tand

ard

proc

edur

e of

ano

dic

bond

ing.

bond

ing.

Sens

or

Elec

tric

lead

Con

nect

ing

the

Con

nect

ing

the

mic

roflu

idic

mic

roflu

idic

stru

ctur

es t

o th

e ou

tsid

e w

orld

is

one

of t

he e

ngin

eerin

g st

ruct

ures

to

the

outs

ide

wor

ld i

s on

e of

the

eng

inee

ring

chal

leng

es. W

e ha

ve d

evel

oped

an

auto

mat

able

app

roac

h w

hich

doe

sch

alle

nges

. We

have

dev

elop

ed a

n au

tom

atab

le a

ppro

ach

whi

ch d

oes

not r

equi

re th

e dr

illin

g no

t req

uire

the

drill

ing

of h

oles

into

any

of t

he w

afer

s, w

hich

wou

ld b

e la

borio

us a

nd u

nof

hol

es in

to a

ny o

f the

waf

ers,

whi

ch w

ould

be

labo

rious

and

un w

ante

d fo

r waf

er p

roce

ssin

g.

wan

ted

for w

afer

pro

cess

ing.

Th

e m

ain

feat

ure

cons

ists

of

clea

vabl

e ed

ges

that

, on

ce r

emov

ed,

The

mai

n fe

atur

e co

nsis

ts o

f cl

eava

ble

edge

s th

at,

once

rem

oved

,pr

ovid

e op

enin

gs t

o th

e pr

ovid

e op

enin

gs t

o th

e m

icro

fluid

ics

mic

roflu

idic

s . T

hese

ope

ning

s ca

n be

rob

otic

ally

sea

led

to a

com

plem

enta

ry, s

. The

se o

peni

ngs

can

be r

obot

ical

ly s

eale

d to

a c

ompl

emen

tary

, sel

fel

f --ce

nter

ing

cent

erin

g m

icro

fluid

icm

icro

fluid

icho

lder

, w

hich

can

be

a ch

eap

mas

sho

lder

, w

hich

can

be

a ch

eap

mas

s --pr

oduc

ible

pla

stic

par

t. O

n th

e rig

ht,

a pr

oduc

ible

pla

stic

par

t. O

n th

e rig

ht,

a M

agA

rray

pro

toty

pe w

ith w

orki

ng tw

oM

agA

rray

pro

toty

pe w

ith w

orki

ng tw

o --la

yer

laye

r mic

roflu

idic

sm

icro

fluid

ics

and

and

mic

roflu

idic

mic

roflu

idic

hold

ers i

s sho

wn.

hold

ers i

s sho

wn.

Mic

roflu

idic

Hol

der

Mic

roflu

idic

Cha

nnel

IV T

ubin

g

Laye

r A

P

DM

S

1

0µm

thic

k

Supp

ort W

afer

(gla

ss)

Larg

e ch

anne

l,C

a. 1

0µm

dee

pC

a. 2

-100

µm w

ide

Subs

trate

Waf

er (s

ilico

n)

Sens

or

Shal

low

tren

ch,

Ca.

200

nm d

eep

Ca.

1-5

µm w

ide

Laye

r B

Si

O2,

200

nm th

ick

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Sub-

mic

ron

chan

nel,

Ca.

180

nm d

eep

Laye

r ALa

yer B

Laye

r A

P

DM

S

1

0µm

thic

k

Supp

ort W

afer

(gla

ss)

Larg

e ch

anne

l,C

a. 1

0µm

dee

pC

a. 2

-100

µm w

ide

Subs

trate

Waf

er (s

ilico

n)

Sens

or

Shal

low

tren

ch,

Ca.

200

nm d

eep

Ca.

1-5

µm w

ide

Laye

r B

Si

O2,

200

nm th

ick

PDM

S

Supp

ort W

afer

(gla

ss)

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Sub-

mic

ron

chan

nel,

Ca.

180

nm d

eep

Laye

r ALa

yer B

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Parti

al

Cut

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Inse

rt bl

ade

and

twis

t edg

e of

f

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Mic

roflu

idic

op

enin

g

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Parti

al

Cut

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Parti

al

Cut

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Inse

rt bl

ade

and

twis

t edg

e of

f

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Inse

rt bl

ade

and

twis

t edg

e of

f

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Mic

roflu

idic

op

enin

g

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Mic

roflu

idic

op

enin

gPD

MS

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Adh

esiv

eM

icro

fluid

ic H

olde

r Inle

t / O

utle

t

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Adh

esiv

eM

icro

fluid

ic H

olde

r Inle

t / O

utle

t

PDM

S

Supp

ort W

afer

(gla

ss)

Subs

trate

Waf

er (s

ilico

n)

Laye

r ALa

yer B

Adh

esiv

eM

icro

fluid

ic H

olde

r Inle

t / O

utle

t

DN

A D

etec

tion

(ssD

NA

w/ B

iotin

) on

the

Mag

Arr

ay4

Waf

er R

B2,

Chi

p 2-

2, N

ov-2

9-20

05, u

sing

Str

epta

vidi

n N

anop

artic

les

(MA

CS)

-1001020304050

010

2030

4050

6070

Tim

elin

e, M

inut

es

Signal Amplitude, µV

ssD

NA

-Bio

tinB

are

Sens

or

H2O

H2O

H2O

H2O

Nan

opar

ticle

s

<-- SNR ~ 31 dB -->

Figu

re 1

: DN

A D

etec

tion Ant

ibod

y D

etec

tion

(Ant

i-Fer

ritin

w/ B

iotin

) on

the

Mag

Arr

ay4

Waf

er R

B2,

Chi

p X-

1, J

an-1

8-20

06, u

sing

Str

epta

vidi

n N

anop

artic

les

(MA

CS)

-1001020304050

010

2030

4050

6070

Tim

elin

e, M

inut

es

Signal Amplitude, µV

Ferr

itin

BSA

PBS

H2O

PBS

PBS

PBS

PBS

PBS PBS

PBS

PBS

H2O

H2O

Nan

opar

ticle

s

<-- SNR ~ 21dB -->Fi

gure

2: A

ntib

ody

Det

ectio

n

The

mea

sure

men

t is c

arrie

d ou

t whi

le th

e na

nopa

rticl

esbi

ndFu

nctio

naliz

atio

n 2.

The

bio

tinyl

ated

antib

ody

is a

pplie

d gl

obal

ly