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Item Symbol Ratings Unit
Drain-source voltage VDS 100
VDSX *5 70
Continuous drain current ID 50
Pulsed drain current ID(puls] 200
Gate-source voltage VGS 30
Non-repetitive Avalanche current IAS *2 50
Maximum Avalanche Energy EAS *1 465
Maximum Drain-Source dV/dt dVDS/dt *4 20
Peak Diode Recovery dV/dt dV/dt *3 5
Max. power dissipation PD Ta=25C 2.02
Tc=25C 135
Operating and storage Tch +150
temperature range Tstg
Electrical characteristics (Tc=25C unless otherwise specified)
Thermalcharacteristics
2SK3586-01FUJI POWER MOSFET
N-CHANNEL SILICON POWER MOSFET
Features
High speed switching
Low on-resistance
No secondary breadown
Low driving power
Avalanche-proof
Applications
Switching regulators
UPS (Uninterruptible Power Supply)
DC-DC converters
Maximum ratings and characteristicAbsolute maximum ratings
(Tc=25C unless otherwise specified)
Item Symbol Test Conditions
Zero gate voltage drain current IDSSVDS=100V VGS=0V
VDS=80V VGS=0V
VGS=30V
ID=25A VGS=10V
ID=25A VDS=25V
VCC=48V ID=25A
VGS=10V
RGS=10
Min. Typ. Max. Units
V
V
A
nA
m
SpF
nC
A
V
sC
ns
Min. Typ. Max. Units
Thermal resistanceRth(ch-c) channel to case
Rth(ch-a) channel to ambient
0.926
62.0
C/W
C/W
Symbol
V(BR)DSS
VGS(th)
IGSS
RDS(on)
gfs
Ciss
Coss
Crss
td(on)
tr
td(off)
tf
QG
QGS
QGD
IAV
VSD
trrQrr
Item
Drain-source breakdown voltaget
Gate threshold voltage
Gate-source leakage current
Drain-source on-state resistance
Forward transcondutanceInput capacitance
Output capacitance
Reverse transfer capacitance
Turn-on time ton
Turn-off time toff
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Avalanche capability
Diode forward on-voltage
Reverse recovery timeReverse recovery charge
Test Conditions
ID= 250A VGS=0V
ID= 250A VDS=VGS
Tch=25C
Tch=125C
VDS=0V
VDS=75V
VGS=0V
f=1MHz
VCC=50V
ID=50A
VGS=10V
L=100H Tch=25C
IF=50A VGS=0V Tch=25C
IF=50A VGS=0V-di/dt=100A/s Tch=25C
V
V
A
A
V
A
mJ
kV/s
kV/s
W
C
C
100
3.0 5.0
25
250
10 100
19 25
15 301830 2745
460 690
38 57
20 30
35 53
50 75
23 35
52 78
16 24
18 27
50
1.10 1.65
0.10.4
-55 to +150
Outline Drawings (mm)
TO-220AB
Equivalent circuit schematic
Gate(G)
Source(S)
Drain(D)
Super FAP-G Series
*3 IF -ID, -di/dt=50A/s, Vcc BVDSS, Tch 150C=< =< =
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Characteristics
2SK3586-01 FUJI POWER MOSFET
ID=f(VGS):80s Pulse test, VDS=25V,Tch=25CID=f(VDS):80s Pulse test,Tch=25C
gfs=f(ID):80s Pulse test, VDS=25V,Tch=25C RDS(on)=f(ID):80s Pulse test, Tch=25C
0 25 50 75 100 125 1500
25
50
75
100
125
150
175
200
Allowable Power Dissipation
PD=f(Tc)
PD[W]
Tc [C]
0 25 50 75 100 125 1500
100
200
300
400
500
EAV[mJ]
starting Tch [C]
Maximum Avalanche Energy vs. starting Tch
E(AV)=f(starting Tch):Vcc=48V,I(AV)
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2SK3586-01 FUJI POWER MOSFET
VGS=f(Qg):ID=50A, Tch=25C
IF=f(VSD):80s Pulse test,Tch=25C t=f(ID):Vcc=48V, VGS=10V, RG=10
-50 -25 0 25 50 75 100 125 1500
10
20
30
40
50
60
RDS(on)[m]
Tch [C]
typ.
max.
Drain-Source On-state Resistance
RDS(on)=f(Tch):ID=25A,VGS=10V
-50 -25 0 25 50 75 100 125 1500.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
7.0
max.
min.
Gate Threshold Voltage vs. Tch
VGS(th)=f(Tch):VDS=VGS,ID=250
VGS(th)[V]
Tch [C]
A
0 20 40 60 800
2
4
6
8
10
12
14
Qg [nC]
Typical Gate Charge Characteristics
VGS[V] Vcc= 50V
10-1
100
101
102
10-2
10-1
100
101
C[nF]
VDS [V]
Typical Capacitance
C=f(VDS):VGS=0V,f=1MHz
Crss
Coss
Ciss
0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.000.1
1
10
100
IF[A]
VSD [V]
Typical Forward Characteristics of Reverse Diode
10-1
100
101
102
100
101
102
103
Typical Switching Characteristics vs. ID
td(on)
tr
tf
td(off)
t[ns]
ID [A]
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2SK3586-01 FUJI POWER MOSFET
IAV=f(tAV):starting Tch=25C. Vcc=48V
10-6
10-5
10-4
10-3
10-2
10-1
100
10-3
10-2
10-1
100
101
Transient Thermal Impedance
Zth(ch-c)=f(t):D=0
Zth(ch-c)[C/W]
t [sec]
10-8
10-7
10-6
10-5
10-4
10-3
10-2
10-2
10-1
100
101
102
Single Pulse
Maximum Avalanche Current Pulsewidth
AvalancheCurrentI
AV
[A]
tAV
[sec]
