37 th IEEE PV Specialists Conference, Seattle, WA, June 19-24, 2011

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37 th IEEE PV Specialists Conference, Seattle, WA, June 19-24, 2011 PINHOLE DETECTION IN Si SOLAR CELLS USING RESONANCE ULTRASONIC VIBRATIONS (RUV) RUV: How It Works A schematic of RUV system for crack detection in PV wafers and cells Key components: Transducer gives a frequency sweep; Ultrasonic probe records resonance curve characteristics: (a) peak position, (b) amplitude and (c) bandwidth; proprietary statistical algorithm gives accept-rejectcommand; Robotic grippers provide load and unload (RUV-2.2) 91 – 95 % accuracy of crack detection; Higher than 2.0 seconds throughput rate; As-cut and processed wafers; Finished cells Real-time feed-back on cracks; Non-destructive; Cost savings: ~ $500K/year (10MW module line or 25MW cell line) ROI: ~ 3 months 24/7, 97% up-time. RUV: Features and Benefits RUV in Cell/Module Production www.innotechsolar.com; www.ruvsystems.nl 3 tools, 24/7, ~2.8 sec/cell; 97% up-time; ~10M cells inspected; Crack detection, process control, smart tools RUV: pinhole / m- cracks A sub-millimeter pinholeis a process flaw, source of cell breakage and yield reduction. Pinhole image with HR Scanning Acoustic Microscopy. UST developed a protocol to identify Si cells with pinholes using a proprietary Activation Station concept. Activation Station passed a high-volume Acceptance Test at a customer location with RUV: Position in PV Chain WAFER CELL MODULE Quality improvement outgoing wafers Yield improvement Process control (watch dog) Quality improvement outgoing cells Yield improvement incoming cells Quality improvement outgoing modules Frequency sweeps: Green – normal wafer, Red- cracked wafer Fully Automatic RUV-2.2 with Integrated AS Activation Station: FEA pulling stress 3.5 mm www.UltrasonicTech.com Yu. Emirov 2 , A. Belyaev 1 , D. Cruson 1 , I. Tarasov 1 , A. Kumar 2 , Hao Wu 3 , S. Melkote 3 , and S. Ostapenko 1 1 Ultrasonic Technologies, Inc., Wesley Chapel, FL USA, 2 University of South Florida, Tampa, FL USA 3 Georgia Institute of Technology, Atlanta, GA, USA Top surface Bottom Surface Acknowledgement: this material is based upon work supported by the Department of Energy under award number DE-EE0004549 Ultrasonic Technologies, Inc.

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PINHOLE DETECTION IN Si SOLAR CELLS USING RESONANCE ULTRASONIC VIBRATIONS (RUV). Ultrasonic Technologies, Inc. www.UltrasonicTech.com. Crack detection, process control, smart tools. - PowerPoint PPT Presentation

Transcript of 37 th IEEE PV Specialists Conference, Seattle, WA, June 19-24, 2011

Page 1: 37 th  IEEE PV Specialists Conference, Seattle, WA, June 19-24, 2011

37th IEEE PV Specialists Conference, Seattle, WA, June 19-24, 2011

PINHOLE DETECTION IN Si SOLAR CELLS USING

RESONANCE ULTRASONIC VIBRATIONS (RUV)

RUV: How It Works

A schematic of RUV system for crack detection in PV

wafers and cells

Key components:

Transducer gives a frequency sweep;

Ultrasonic probe records resonance curve characteristics: (a) peak position, (b) amplitude and (c) bandwidth;

proprietary statistical algorithm gives ”accept-reject” command;

Robotic grippers provide load and unload (RUV-2.2)

91 – 95 % accuracy of crack detection;

Higher than 2.0 seconds throughput rate;

As-cut and processed wafers;

Finished cells

Real-time feed-back on cracks; Non-destructive; Cost savings: ~ $500K/year (10MW module line or 25MW cell line)

ROI: ~ 3 months 24/7, 97% up-time.

RUV: Features and Benefits

RUV in Cell/Module Productionwww.innotechsolar.com; www.ruvsystems.nl

3 tools, 24/7, ~2.8 sec/cell; 97% up-time; ~10M cells inspected;

Crack detection, process control, smart tools

RUV: pinhole / m-cracks•A sub-millimeter “pinhole” is a process flaw, source of cell breakage and yield reduction. Pinhole image with HR Scanning Acoustic Microscopy.

•UST developed a protocol to identify Si cells with pinholes using a proprietary Activation Station concept.

•Activation Station passed a high-volume Acceptance Test at a customer location with 100% accuracy of pinhole detection.

RUV: Position in PV ChainWAFER CELL MODULE

Quality improvementoutgoing wafers

Yield improvement

Process control (watch dog)

Quality improvementoutgoing cells

Yield improvementincoming cells

Quality improvementoutgoing modules

Frequency sweeps: Green – normal wafer, Red-

cracked wafer

Fully Automatic RUV-2.2 with Integrated AS

Activation Station: FEA pulling stress

3.5 mm

www.UltrasonicTech.com

Yu. Emirov2, A. Belyaev1, D. Cruson1, I. Tarasov1, A. Kumar2, Hao Wu3, S. Melkote3, and S. Ostapenko1

1Ultrasonic Technologies, Inc., Wesley Chapel, FL USA, 2University of South Florida, Tampa, FL USA3 Georgia Institute of Technology, Atlanta, GA, USA

Top surface Bottom Surface

Acknowledgement: this material is based upon work supported by the Department of Energy under award number DE-EE0004549

Ultrasonic Technologies,

Inc.