35bit LVDS Receiver 5:35 DeSerializerrohmfs.rohm.com/en/products/databook/datasheet/ic/... ·...

Datasheet

Product structure：Silicon monolithic integrated circuit This product is not designed protection against radioactive rays

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© 2011 ROHM Co., Ltd. All rights reserved. 27.Feb.2015 Rev.002

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TSZ22111・14・001

LVDS Interface LSI

35bit LVDS Receiver 5:35 DeSerializer BU90R104

Key Specifications Supply Voltage Range Operating Frequency Operating Temperature Range

Packages TQFP64V

Applications Flat panel display Security camera, Digital camera Tablet

2.30 to 3.60 V 8 to 112 MHz

-40 to +85

12.0mm×12.0mm×1.0mm

General Description The BU90R104 receiver operates from 8MHz to 112MHz wide clock range. The BU90R104 converts the LVDS serial data streams back into 35bits of LVCMOS parallel data. Data is transmitted seven times (7X) stream and reduce the cable number by 3(1/3) or less. I/O Voltage range is 2.3 to 3.6V,so it is available for many products.

Features 5 channels of LVDS data stream are converted to 35bits data of parallel LVCMOS level outputs.

30bits of RGB output data, 5bits of timing and control output data(HSYNC, VSYNC, DE, CTL1 and CTL2) are transmitted available.

Support clock frequency from 8MHz up to 112MHz. Support consumer video format including 480i, 480P, 720P and 1080i as well.

Support many kinds of PC video formats such as VGA, SVGA, XGA and SXGA.

Provide 784Mbps per 1ch or 3.92Gbps per device throughput rate using 112MHz clock rate.

User programmable LVCMOS data output triggering timing by using either rising or falling edge of clock.

30bit LVDS transmitter is recommended to use BU8254KVT.

Datasheet

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Block Diagram

Figure 1. Block Diagram

LVCMOS Output

Sampling Clocks

PLL RCLK +/－

(8～112MHz) CLKOUT

RA +/－

RESERVE

PD

OE

R/F

LVDS Differential Input

RA6-RA0

7

+

－

+ －

RB +/－ RB6-RB0

7 + －

RC +/－ RC6-RC0

7 + －

RD +/－ RD6-RD0

7 + －

RE +/－ RE6-RE0

7 +

－

7

Serial to Parallel

Serial to Parallel

Serial to Parallel

Serial to Parallel

Serial to Parallel

LVCMOS Input

Datasheet

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VD

D

RA

1

RA

0

RA

2

GN

D

RA

3

RA

4

RA

5

RA

6

RB

0

RB

1

VD

D

RB

2

RB

3

RB

4

RB

5

RB6

CLKOUT

GND

RC0

RC1

RC2

RC3

RC4

RC5

VDD

RC6

RD0

RD1

RD2

RD3

RD4

GN

D

RE

SE

RV

E

PD

OE

R/F

RE

6

RE

5

RE

4

VD

D

RE

3

RE

2

RE

1

RE

0

RD

6

RD

5

GN

D

RA-

PVDD

32

31

30

29

28

27

26

25

24

23

22

21

20

19

18

17

48

47

46

45

44

43

42

41

40

39

38

37

36

35

34

33

1 2 3 4 5 6 7 8 9 10

11

12

13

14

15

16

64-Pin TQFP

(Top View)

RA+

RB-

RB+

PGND

RD-

RD+

RE-

RE+

LGND

RCLK+

RCLK-

RC-

RC+

LVDD

49

50

51

52

53

54

55

56

57

58

59

60

61

62

63

64

Pin Configuration

Figure 2. Pin Configuration (Top View)

Datasheet

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Pin Description

Pin Name Pin No. I/O Description

RA+, RA- 50,49 LVDS Input

RB+, RB- 52,51 LVDS Input

RC+, RC- 55,54 LVDS Input

RD+, RD- 60,59 LVDS Input

RE+, RE- 62,61 LVDS Input

LVDS data input + : Positive input of LVDS data differential pair. - : Negative input of LVDS data differential pair.

RCLK+, RCLK- 57,56 LVDS Input LVDS clock Input

RA6～RA0 40,41,42,43,

45,46,47 Output

RB6～RB0 32,33,34,35,

36,38,39 Output

RC6～RC0 22,24,25,26,

27,28,29 Output

RD6～RD0 14,15,17,18,

19,20,21 Output

RE6～RE0 6,7,8,10, 11,12,13

Output

LVCMOS data outputs.

RESERVE 2 Input Reserved input must be “Low” for normal operation.

PD 3 Input Power down input for the internal system. H : Normal operation. L : Power down (All output are “Low”).

OE 4 Input Power down input for the data output driver. H : Output enable (Normal operation). L : Output disable (All outputs are “Hi-Z”).

R/F 5 Input Select input pin for data output clock triggering edge. H : Output data is latched on rising edge. L : Output data is latched on falling edge.

VDD 9,23,37,48 Power 3.3V output driver and digital core power supply pin.

CLKOUT 31 Output LVCMOS level clock output.

GND 1,16,30,44 Ground Ground pin for both data output driver cells and the digital cores.

LVDD 53 Power Power supply pin for LVDS core.

LGND 58 Ground Ground pin for LVDS core.

PVDD 64 Power Power supply pin for PLL core.

PGND 63 Ground Ground pin for PLL core.

.

Datasheet

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Function Description

PD R/F OE Data output (Rxn)

(Note1)

Clock output

0 0 0 Hi-Z Hi-Z

0 0 1 All fixed low Fixed Low

0 1 0 Hi-Z Hi-Z

0 1 1 All fixed low Fixed Low

1 0 0 Hi-Z Hi-Z

1 0 1 Data output Output data is latched by falling edge of clock.

1 1 0 Hi-Z Hi-Z

1 1 1 Data output Output data is latched by rising edge of clock

(Note1): Rxn

x = A,B,C,D,E

n = 0,1,2,3,4,5,6

Datasheet

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Absolute Maximum Ratings

Ratings Parameter Symbol

Min Max Unit

Supply voltage VDD -0.3 +4.0 V

Input voltage VIN -0.3 VDD+0.3 V

Output voltage VOUT -0.3 VDD+0.3 V

Storage temperature range Tstg -55 +125

Package power

Package PD(W) DERATING(W/) (Note2)

0.7 0.007 TQFP64V

1.0(Note3)

0.01(Note3)

(Note2)At temperature Ta > 25

(Note3)Package power when mounting on the PCB board.

The size of PCB board :70×70×1.6(mm3)

The material of PCB board :The FR4 glass epoxy board.(3% or less copper foil area)

Recommended Operating Conditions

Ratings Parameter Symbol

Min Typ Max Unit Condition

Supply voltage VDD 2.3 3.3 3.6 V VDD, LVDD, PVDD

Supply Noise Voltage VNOZ - - 0.1 V

-40 - +85 Clock frequency from 8MHz up to 90MHz

Operating temperature range Topr

0 - +70 Clock frequency from 90MHz up to 112MHz

Datasheet

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DC characteristics

Table 1. LVCMOS DC Specifications (VDD=2.3~3.6V,Ta=-40~+85)

Limits Parameter Symbol

Min Typ Max Unit Conditions

High Level Input Voltage VIH VDD×0.8 - VDD V

Low Level Input Voltage VIL 0.0 - VDD×0.2 V

High Level Output Voltage VOH VDD-0.5 - VDD V IOH=-4mA (data) IOH=-8mA (clock)

Low Level Output Voltage VOL 0.0 - 0.4 V IOL=4mA (data) IOL=8mA (clock)

Input Current IINC - - ±10 µA 0V≦VIN≦VDD

Table 2. LVDS Receiver DC Specifications (VDD=2.3~3.6V,Ta=-40~+85)


Min Typ Max Unit Conditions

Differential Input High threshold VTH - - 100 mV VOC=1.2V

Differential Input Low threshold VTL -100 - - mV VOC=1.2V

Input Current IINL - - ±25 µA VIN=2.4V / 0V VDD=3.6V

Common mode Voltage VOC 0.8 1.2 1.6 V VID =200mV

Differential Input Voltage |VID| 100 - 600 mV -

Figure 3. LVDS Receiver DC Specifications

Datasheet

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Supply Current


Typ Max Unit Conditions

Receiver supply current (Gray Scale Pattern)

IRCCG 52 - mA fCLKOUT=90MHz CL=8pF, VDD=3.3V

Receiver supply current (Worst Case Pattern)

IRCCW 95 - mA fCLKOUT=90MHz CL=8pF, VDD=3.3V

Receiver power down supply current IRCCS - 10 µA PD=L, OE=L

Gray Scale Pattern

Figure 4. Gray Scale Pattern Worst Case Pattern (Maximum power condition)

Figure 5. Worst Case Pattern

CLKOUT

Rx0

Rx1

Rx2

Rx3

Rx4

Rx5

Rx6

x=A,B,C,D,E

CLKOUT

Rx0

Rx2

Rx3

Rx4

Rx5

Rx6

Rx1

x=A,B,C,D,E

Datasheet

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AC characteristics

Table 3. Switching Characteristics (VDD=2.3~3.6V,Ta=-40~85)


Min Typ Max Unit

CLKOUT Period tRCP 8.93 - 125 ns

CLKOUT "H" Time tRCH - 0.5tRCP-1.0 - ns

CLKOUT "L" Time tRCL - 0.5tRCP-1.0 - ns

LVCMOS Data Setup to CLKOUT tRS 0.5tRCP-1.4 - - ns

LVCMOS Data Hold from CLKOUT tRH 0.23tRCP-1.0 - - ns

LVCMOS Data Rise time tTLH - 1.0 2.0 ns

LVCMOS Data Fall time tTHL - 1.0 2.0 ns

Input Data Position 0 tRIP1 -0.25 0.0 +0.25 ns

Input Data Position 1 tRIP0 7

tRCIP-0.25

7

tRCIP

7

tRCIP+0.25 ns


tRCIP-0.25 2

7

tRCIP 2

7

tRCIP+0.25 ns


tRCIP-0.25 3

7

tRCIP 3

7

tRCIP+0.25 ns


tRCIP-0.25 4

7

tRCIP 4

7

tRCIP+0.25 ns


tRCIP-0.25 5

7

tRCIP 5

7

tRCIP+0.25 ns


tRCIP-0.25 6

7

tRCIP 6

7

tRCIP+0.25 ns

Phase Locked Loop Set Time tRPLL - - 10.0 ms

Clock Input Period tRCIP 8.93 - 125 ns

Datasheet

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AC Timing

LVCMOS

Figure 6. LVCMOS Output Timing

Phase-Locked Loop Set Time

Figure 7. Phase-Locked Loop Set Time

CL =8pF

LVCMOS Output Load

LVCMOS Output

Rxn

VDD/2 VDD/2 VDD/2 VDD/2

tRCP

tRCH tRCL

VDD/2

tRS tRH

CLKOUT

VDD/2

R/F=H

R/F=L

x=A,B,C,D,E n=0,1,2,3,4,5,6

3.0V

tRPLL

VDD

RCLK +/-

CLKOUT

PD VDD/2

VDD/2

Datasheet

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LVDS Data ,Clock Input Timing

Figure 8. LVDS Data ,Clock Input Timing

Next cycle Previous cycle Current cycle

RCLK + (Differential)

tRCIP

Vdiff=0V Vdiff=0V

RA+/- RA1 RA0 RA6 RA5 RA4 RA3 RA2 RA1 RA0 RA6 RA2 RA3

RB+/- RB1 RB0 RB6 RB5 RB4 RB3 RB2 RB1 RB0 RB6 RB2 RB3

RC+/- RC1 RC0 RC6 RC5 RC4 RC3 RC2 RC1 RC0 RC6 RC2 RC3

RD+/- RD1 RD0 RD6 RD5 RD4 RD3 RD2 RD1 RD0 RD6 RD2 RD3

RE+/- RE1 RE0 RE6 RE5 RE4 RE3 RE2 RE1 RE0 RE6 RE2 RE3

Datasheet

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BU90R104

LVDS Data, Clock Input and LVCMOS Output Timing

Figure 9. LVDS Data, Clock Input and LVCMOS Output Timing

RA+/-

RCLK+/-

RA6

LVDS Input

RB+/-

RC+/-

RD+/-

RE+/-

RA5 RA4 RA3 RA2 RA1 RA0

RB6 RB5 RB4 RB3 RB2 RB1 RB0

RC6 RC5 RC4 RC3 RC2 RC1 RC0

RD6 RD5 RD4 RD3 RD2 RD1 RD0

RE6 RE5 RE4 RE3 RE2 RE1 RE0

RE0～6 VALID

LVCMOS Output

VALID

VALID

VALID

VALID

VALID

VALID

VALID

VALID

VALID

CLKOUT

RA0～6

CLKOUT

RB0～6

RC0～6

(R/F=L)

(R/F=H)

RD0～6

Datasheet

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About the Power On Reset Power on reset is not mandatory for this device. (The PD pin should be set to high level when power on reset procedure is not used.)

Figure 10. Terminal connection when power on reset is not used.

However, Power on reset procedure is strongly recommend for internal logic initialization by following two methods.

①The method of using CR circuit.

②The method of using external specific IC.

It is recommend to do enough examination for target application.

Figure 11. Power on reset by external a CR circuit

Figure 12. Power on reset by specific IC

BU90R104

PD

VDD

td is approximately equal to 20ms when the left RC coleus are applied.

td

VDD

Internal Reset

2.2µF

PD

PD

10KΩ

220Ω

schottky barrier diode

Be careful of temperature ofthe capacitor especially over and again. B characteristic ceramics and function polymer aluminum electrolysis are recommended.

VT+

VDD VDD

B Characteristic ceramics.

PD

VDD

VOUT

Power on IC (Open drain output)

GND

220KΩ

0.1µF

Detection voltage VDD

Internal Reset

PD

td

VT+

VDD VDD

Datasheet

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Application Circuit (10bit LVCMOS Level Input & LVCMOS Level Output) Example:

BU8254KVT : LVCMOS level input/Falling edge/LVDS normal(350mV) swing output BU90R104 : LVCMOS level output/Falling edge

（Note4）Recommended Parts:

F.Bead : BLM18A-Series (Murata Manufacturing Co.)

（Note5）If RS pin is tied to VDD, LVDS swing is 350 mV.

If RS pin is tied to GND, LVDS swing is 200 mV.

Figure 13. Application Circuit (10bit LVCMOS Level Input & LVCMOS Level Output)

About the no used differential inputs If there are no used differential inputs, be sure to set them into GND level. The outputs are fixed High level, when differential inputs set GND.

VDD

GND

0.1uF

LVDS VDD

0.01uF

0.1uF0.01uF

CLKIN

VDDF.Bead

CLKIN

BU8254KVT

TA0R4TA1R5TA2R6TA3R7TA4R8TA5R9TA6G4TB0G5TB1G6TB2G7TB3G8TB4G9TB5B4TB6B5TC0B6TC1B7TC2B8TC3B9TC4HSYNCTC5VSYNCTC6DETD0R2TD1R3TD2G2TD3G3TD4B2TD5B3TD6TE0R0TE1R1TE2G0TE3G1TE4B0TE5B1TE6

XRSTXRSTVDD

RS

R/F

(Note5)

LVDS GND

PLL VDD

PLL GND0.1uF

0.01uF

TAN

TAP

TBN

TBP

TCN

TCP

TCLKN

TCLKP

TDN

TDP

TEN

TEP

PCB(Transmitter) PCB(Receiver)

100Ω

100Ω

100Ω

100Ω

100Ω

100Ω

RA-

RA+

RB-

RB+

RC-

RC+

RCLK-

RCLK+

RD-

RD+

RE-

RE+

100Ωtwistpair Cable

or PCB trace

0.1uF

0.01uF

0.1uF

0.01uF

LVDD

LGND

PVDD

PGND

F.Bead

B90R104

VDD

GND 0.1uF0.01uF

VDD

CLKOUTR4R5R6R7R8R9G4G5G6G7G8G9B4B5B6B7B8B9HSYNCVSYNCDER2R3G2G3B2B3

R0R1G0G1B0B1

CLKOUTRA0RA1RA2RA3RA4RA5RA6RB0RB1RB2RB3RB4RB5RB6RC0RC1RC2RC3RC4RC5RC6RD0RD1RD2RD3RD4RD5RD6RE0RE1RE2RE3RE4RE5RE6

PD

DK

R/F

OPEN

OPEN

PDOE OE

0.1uF

(Note4) (Note4)

Datasheet

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Application Circuit (10bit Small Swing Input & LVCMOS Level Output) Example:

BU8254KVT : LVCMOS level input/Falling edge/LVDS normal(350mV) swing output BU90R104 : LVCMOS level output/Falling edge

(Note6) Recommended Parts:

F.Bead : BLM18A-Series (Murata Manufacturing Co.)

(Note7) RS pin acts as VREF input pin when input voltage is set to half of high level signal input.

We recommend to locate by-pass condenser near the RS pin.

Example for LVTTL(1.8V input):(R1,R2)=(15kΩ,5.6kΩ)

Figure 14. Application Circuit (10bit Small Swing Input & LVCMOS Level Output) Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority

VDD

GND

0.1uF

LVD S VDD

0.01uF

0.1uF0.01uF

CLKIN

VD D F.Bead

CLKIN

B U8254KVT

TA0R4TA1R5TA2R6TA3R7TA4R8TA5R9TA6G 4TB0G 5TB1G 6TB2G 7TB3G 8TB4G 9TB5B4TB6B5TC0B6TC1B7TC2B8TC3B9TC4HSYNCTC5VSYN CTC6DETD0R2TD1R3TD2G 2TD3G 3TD4B2TD5B3TD6TE0R0TE1R1TE2G 0TE3G 1TE4B0TE5B1TE6

XRSTXRST

*4RS

R/F

(Note7)

LVD S GND

PLL VDD

PLL GND0.1uF

0.01uF

TAN

TAP

TBN

TBP

TCN

TCP

TCLKN

TCLKP

TDN

TDP

TEN

TEP

PCB(Transm itter) PC B(Receiver)

100Ω

100Ω

100Ω

100Ω

100Ω

100Ω

RA-

RA+

RB-

RB+

RC-

RC+

RCLK-

RCLK+

RD-

RD+

RE-

RE+

100Ω tw ist

pair Cable or

PCB trace

0.1uF

0.01uF

0.1uF

0.01uF

LVDD

LGND

PVDD

PGND

F.Bead

BU90R104

VDD

GND 0.1uF

0.01uF

V D D

CLKOUTR4R5R6R7R8R9G4G5G6G7G8G9B4B5B6B7B8B9HSYNCVSYN CDER2R3G2G3B2B3

R0R1G0G1B0B1

PD

CLKOU TR A0R A1R A2R A3R A4R A5R A6R B0R B1R B2R B3R B4R B5R B6RC0RC1RC2RC3RC4RC5RC6RD0RD1RD2RD3RD4RD5RD6R E0R E1R E2R E3R E4R E5R E6

DK

R/F

OPEN

OPEN

PDOE OE

(Note6) (Note6)

RS pin.

15k

VDD

R1

R2 C1=0.1µF 5.6k

Datasheet

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Notes for use 1) This chip is not designed to protect from radioactivity. 2) The chip is made strictly for the specific application or equipment. Then it is necessary that the unit is measured as need. 3) This document may be used as strategic technical data which subjects to COCOM regulations.

Datasheet

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Ordering part number

B U 9 0 R 1 0 4 - E 2

Part No.

Part No. 90R104 Package TQFP64V

Packaging and forming specification E2: Embossed tape and reel

Marking Diagram

TQFP64 (TOP VIEW)

B U 9 0 R 1 0 4

Part Number Marking

LOT Number

1PIN MARK

Datasheet

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Physical Dimension, Tape and Reel Information

Package Name TQFP64V

Direction of feed

Reel∗ Order quantity needs to be multiple of the minimum quantity.

<Tape and Reel information>

Embossed carrier tape (with dry pack)Tape

Quantity

Direction

of feed The direction is the 1pin of product is at the upper left when you hold

reel on the left hand and you pull out the tape on the right hand

1000pcs

E2

( )

1pin

Notice-GE Rev.004© 2013 ROHM Co., Ltd. All rights reserved.

Notice

Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,

OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment

(Note 1), transport

equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications.

(Note1) Medical Equipment Classification of the Specific Applications

JAPAN USA EU CHINA

CLASS CLASS

CLASS b CLASS

CLASS CLASS

2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor

products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures:

[a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure

3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:

[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,

H2S, NH3, SO2, and NO2

[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of

flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering

[h] Use of the Products in places subject to dew condensation

4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,

confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability.

7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual

ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in

this document.

Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product

performance and reliability.

2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance.

For details, please refer to ROHM Mounting specification

Notice-GE Rev.004© 2013 ROHM Co., Ltd. All rights reserved.

Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the

characteristics of the Products and external components, including transient characteristics, as well as static characteristics.

2. You agree that application notes, reference designs, and associated data and information contained in this document

are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information.

Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).

Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:

[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic

2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period.

3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads

may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of

which storage time is exceeding the recommended storage time period.

Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only.

Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company.

Precaution for Foreign Exchange and Foreign Trade act Since our Products might fall under controlled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with ROHM representative in case of export.

Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference

only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. ROHM shall not be in any way responsible or liable for infringement of any intellectual property rights or other damages arising from use of such information or data.:

2. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any

third parties with respect to the information contained in this document.

Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written

consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the

Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons.

4. The proper names of companies or products described in this document are trademarks or registered trademarks of

ROHM, its affiliated companies or third parties.

DatasheetDatasheet

Notice – WE Rev.001© 2015 ROHM Co., Ltd. All rights reserved.

General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.

ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document.

2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior

notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative.

3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all

information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information.

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