300UV_Product_Overview

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PRODUCT OVERVIEW he KLA-Tencor 300 UV Series is the first reticle inspection family using UV illumination for the inspec- tion of DUV reticles. With the higher resolution UV wavelength and new defect detection technology, the 300UV systems can inspect reticles with advanced design rules, critical OPC structures, and many phase shift types, all common elements of advanced inte- grated circuit technology. The UV systems are built on KLA- Tencor ' s field-proven 300 Series reticle inspection platform, adding advanced UV optics, defect detection algorithms, and review tools. Whether providing die-to-die, die-to-database, or KLA-Tencor ' s patented STARlight TM contamination inspection, the new 300UV Series enables the industry's highest quality of advanced reticles. Captures new defect classes Resolution enhancement techniques are being used successfully to push the limits of optical lithography creating new challenges for reticle fabrication and quality assurance. While low k, printing, sub-resolution OPC structures, and new phase-shifting materials improve lithography performance, they have also generated new classes of critical reticle defects that can cause wafer yield loss — UV-opaque stains and transmission defects, as well as small defects on and near OPC structures. KLA-Tencor ' s 300UV Series can capture these new, T KLA-Tencor 300UV Series UV Wavelength Reticle Inspection System

Transcript of 300UV_Product_Overview

Page 1: 300UV_Product_Overview

PRODUCT OVERVIEW

he KLA-Tencor 300 UV Series is

the first reticle inspection family

using UV illumination for the inspec-

tion of DUV reticles. With the higher

resolution UV wavelength and new defect detection technology, the 300UV

systems can inspect reticles with

advanced design rules, critical OPC

structures, and many phase shift types,

all common elements of advanced inte-

grated circuit technology.

The UV systems are built on KLA-

Tencor's field-proven 300 Series reticle

inspection platform, adding advanced UV

optics, defect detection algorithms, and

review tools. Whether providing die-to-die,

die-to-database, or KLA-Tencor's patented

STARlightTM

contamination inspection, the new

300UV Series enables the industry's

highest quality of advanced reticles. Captures new defect classes

Resolution enhancement techniques are

being used successfully to push the limits

of optical lithography creating new

challenges for reticle fabrication and

quality assurance. While low k, printing,

sub-resolution OPC structures, and new

phase-shifting materials improve

lithography performance, they have also

generated new classes of critical reticle

defects that can cause wafer yield loss —

UV-opaque stains and transmission

defects, as well as small defects on and

near OPC structures. KLA-Tencor's

300UV Series can capture these new,

T

KLA-Tencor 300UV Series

UV Wavelength

Reticle

Inspection

System

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300UV Series

difficult to detect defects, providing critical reticle quality assurance to eliminate yield killing reticle defects.

UV inspection for DUV lithography As lithography has shifted to shorter exposure wavelengths, many more organic materials which contaminate reticles are opaque and can cause yield reductions. Unlike the previous visible light systems, the 300UV Series can detect UV-wavelength defects, such as stains and particles, both with transmitted light pattern inspection mode (die-to-die and die-to-database) as well as with STARlight mode. The UV-wavelength is also important for inspecting phase

UV inspection illumination enables

superior detection of UV-sensitive

contaminants. I t also lowers EAPSM

coating transmittance, resulting in

higher contrast imaging and better

defect sensitivity.

shift masks that are used in both I-line

and DUV lithography. The image

contrast of many phase shifting materials

improves significantly with UV

illumination, leading to greater

sensitivity. This means that even older

generation EPSM reticles can benefit

from UV-wavelength inspection.

Conquering complex OPC structures On today's advanced reticles, lithography

engineers commonly use OPC technology

to improve lithography performance. This is done by selectively adding small

amounts of bias as well as sub-resolution

edge jogs, serifs, hammerheads, and assist

lots to the reticle pattern. Although these

sub-resolution features do not print

directly, small defects on or near a struc-

ture can cause serious wafer problems.

The UV system's advanced OPC defect

detection algorithm offers unparalleled

sensitivity to defects on and near small

OPC structures. This algorithm surpasses

current generation algorithms which will

often miss these types of defects. The

OPC algorithm employs new data-base

image processing techniques that

carefully model the input database to

match the intricacies of the geometry.

Based on the 300 Series, the UV systems

provide new state-of-the-art technology

for laser scanning image acquisition, and

defect detection algorithms.

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Through this advanced technology, it is

now possible to properly inspect critical

OPC reticles and find defects that are

missed by older technology equipment.

OPC Older Technology With advanced database modeling technology, the OPC algori thm accurately matches OPC structures and detects cr i t ical OPC defects, w i th low false detect ions.

STARlight UV — Superior performance on reticle contamination In addition to high performance pattern inspection, the 300UV Series can also be configured with KLA-Tencor's patented STARlight technology to provide the industry's most sophisticated and advanced reticle contamination inspection. With STARlight UV, it is now possible to detect smaller contaminants on smaller linewidth reticles than ever before in addition to detecting UV wavelength stains and particles. All are critical to assuring a high quality reticle.

STARlight UV uses simultaneous transmitted and reflected UV illumina-tion and KLA-Tencor's STARlight defect detection algorithm to locate all sizes of particles, stains, thin-chrome, ESD, etc, both in the clear areas and on the chrome, all without the complication of die-to-die or die-to-database inspection. STARlight UV accomplishes this with an easy to use inspection mode which maintains a high degree of immunity to false detections, even on fine design rules and OPC structures.

Multiple review features ensure proper defect classification For advanced reticles, it is essential for

the inspection system to find all defects

within specification. However, if the

operator mis-classifies a defect it can be

just as problematic as not finding it.

Several new views and tools have been

developed to further enhance the

operator's ability to correctly classify

difficult-to-recognize defects such as

CD and OPC defects. These new views

and tools are added to the already

impressive list of review features such

as high quality reflected light imaging,

pseudo-color, defect bounding box,

defective pixel markers, and size grid.

Sharpen Edge removes the "fuzzy

edge" look of the standard view and

makes it much easier for an operator to

identify small extension type defects.

Displacement Image shows a type of

overlay image in which the matching

geometry is suppressed and non-matching

defective geometry is enhanced. This

makes it much easier for an operator to

identify small corner, truncation, CD,

and OPC shape type defects.

Assisted Sizing improvements give

the operator the ability to determine the

approximate size of a defect beyond the

standard "grid". One function is a box

(with a dimension readout) that can be

sized, moved, and rotated to overlay a

defect, while a second is a moveable

"arrow" which closely approximates the

CD difference between the test and

reference geometry in four different

directions; this is especially useful when

dispositioning CD type defects.

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Flexible and upgradable platform to protect your investment The 300UV Series platform provides

exceptional flexibility and upgradability.

This unique platform has numerous

configurations and options to allow each

user to select a system for their current

needs, with the assurance of upgrade

paths to meet future requirements. One

can choose among die-to-die, die-to-

database, or STARlight inspection modes

or any combination; and any system in

the field can be converted to any other

configuration. There are a selection of

defect detection algorithms to choose

from to provide high quality inspection of

a variety of reticle types from OPC to

PSM. To optimize throughput, there are a

selection of pixel sizes, image compare

processing

modules, and database rendering

modules. Multiple pixels can be installed

to allow the fastest throughput possible

for each defect specification level required

to maximize overall productivity. The

300UV Series offers unparalleled con-

figuration flexibility and upgradability to

protect your investment.

Enabling capability for 0.15 pm technology and beyond While KLA-Tencor's 300UV Series of

Reticle Inspection Systems offer class-

leading performance and features to meet

the critical requirements of the 0.18 pm

generation, the system also has sufficient

performance and enhancement

opportunities to extend it into the 0.15

pm generation to further protect your

investment.

The 300UV Series platform provides the flexibility to configure a system that is best suited for your reticle

inspection requirements.

KLA-Tencor Corporation 160 Rio Robles San Jose, CA 95134-1809 Tel 408-875-3000 Fax 408-875-4144 www.kla-tencor.com

STARlight is a trademark of KLA-Tencor Corporation. Printed in USA 9/98 R-RI-3012