2021 VIRTUAL EVENT GUIDE - cdn.ymaws.com
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2021 VIRTUAL EVENT GUIDE www.smta.org/smtai November 15 th - December 31 st Premiere Sponsors:
Transcript of 2021 VIRTUAL EVENT GUIDE - cdn.ymaws.com
2021 VIRTUAL EVENT GUIDE
WELCOME TO THE VIRTUAL SMTA INTERNATIONAL
Richard Coyle, Ph.D. VP Technical Programs
Nokia Bell Labs
Intel Corporation
The SMTA welcomes you to the virtual SMTA International. We have crafted another exceptional conference experience for our attendees.
The program contains useful and relevant information from subject matter experts covering a wide range of topics, including technical sessions on Advanced Packaging (APT); Flux, Solder, Adhesives (FSA); Harsh Environments (HE), Manufacturing Excellence (MFX), Lead-Free Soldering Technology with a strong emphasis on Low Temperature Solders (LTS), Second-Level Interconnect Reliability (SLIR), Substrates (SUB), Technical Innovations (TI), and the Women’s Leadership Program.
We also want to extend our personal thanks to the companies and individuals that continue to sponsor and support SMTA International in these uncertain times. This includes the exhibitors, speakers, authors, co-authors, volunteers and the SMTA staff, chapter officers and Board of Directors. Your support and commitment are what makes SMTA International such an exceptional event.
The Technical Advisory Committee, Expo Committee, staff, and Board of Directors sincerely hope that SMTA International remains a valuable and enjoyable experience for you. Thank you for your participation and support.
SMTAI Virtual Conference November 15 - December 31, 20213
The distinguished SMTA International Technical Advisory Committee includes electronics manufacturing and packaging experts representing all facets of the industry. The Committee designed the conference program to ensure that today's latest trends and developments are fully addressed. They are an important component of the SMTA Knowledge Base.
Mohammed Abueed Intel Corporation
Dudi Amir Intel Corporation
Rochester Institute of Technology
Nilesh Badwe, Ph.D. IIT Kanpur
Andy Behr Panasonic
Lars Boettcher Fraunhofer IZM Berlin
Rob Boguski Datest Corporation
Keith Bryant KB Consultancy
Creative Electron, Inc.
Track Director NXP Semiconductors
ESI Automotive
Priyanka Dobriyal, Ph.D. Women's Leadership Program
Track Director Intel Corporation
Trevor Galbraith Global SMT & Packaging
Jay Gorajia Siemens Digital Industries Software
Faramarz Hadian Binghamton University
Dave Hillman Collins Aerospace
ZESTRON Americas
Robert Kinyanjui, Ph.D. Harsh Environments Track Director John Deere Electronic Solutions, Inc.
Pradeep Lall, Ph.D. Auburn University
Dale Lee Plexus Corp.
Tanya Martin, CMP SMTA
Andrew Mawer NXP Semiconductor
Tim Pearson Flux, Solder, Adhesives Track Director
Collins Aerospace
Julie Silk Keysight Technologies
Greg Vance Rockwell Automation
Charles Woychik, Ph.D. SkyWater Technology
Raiyo Aspandiar, Ph.D. Conference Director
Intel Corporation
Nokia Bell Labs
TECHNICAL ADVISORY COMMITTEE
www.smta.org/smtai Due Date: May 2, 2022
Become a part of the industry’s strongest technical program addressing all aspects of electronics manufacturing. Plan to present in-person or virtually at the annual SMTA International Conference. Full technical paper is required for
inclusion in the published proceedings.
Proposals are also being solicited from individuals interested in teaching professional development courses related to surface mount technology, advanced packaging, and electronics manufacturing.
Conference: October 31 - November 3 Exposition: November 2 - 3
Minneapolis, Minnesota, USA
SMTA+ Corporate Keysight Technologies
Excellence in Leadership Debbie Carboni
KYZEN Corporation
Indium Corporation
Auburn University
2021 Education Awards
AWARD WINNERS
WINNER: Richard Coyle, Ph.D., Nokia Bell Labs "Enhancing Thermal Fatigue Reliability of Pb-Free Solder Alloys with Additions of Bismuth and Antimony" (Co-Authors: Charmaine Johnson, David Hillman, and Tim Pearson, Collins Aerospace; Michael Osterman, CALCE; Joe Smetana, Nokia; Keith Howell, Nihon Superior Co., Ltd.; Hongwen Zhang and Ji Geng, Indium Corp.; Julie Silk, Keysight Technologies; Derek Daily, Senju Comtek Corp.; Babak Arfaei, SUNY-Binghamton; Ranjit Pandher, Alpha Technologies; Andre Delhaise, Celestica; Stuart Longgood, Delphi Technologies; Andre Kleyner, Aptiv)
Honorable Mention: Andrew Mawer, NXP Semiconductors "Miniaturized Stacked Die QFN for Tire Pressure Monitoring System Applications" (Co-Authors: Mollie Benson, Dwight Daniels, A R Nazmus Sakib, and Vishrudh Sriramprasad, NXP Semiconductors N.V.)
Honorable Mention: Jennifer Bennet, P.E., IBM Corporation "CBGA and CCGA Field Reliability Predictions Confirmed" (Co-Authors: Jim Bielick, Marie Cole, IBM Corporation)
Honorable Mention: Karen Tellefsen, Ph.D., MacDermid Alpha Electronics Solutions "Advanced SIR Testing for Trapped Solder Paste Flux Residue" (Co-Authors: Aurkie Ray, Anna Lifton and Paul Salerno, MacDermid Alpha Electronics Solutions)
Honorable Mention: Keith Sweatman, Ph.D., Nihon Superior Company, Ltd. "Behaviour and Strengthening Effects of Sb in a Low-Bi Sn-Cu Solder Alloy" (Co-Authors: Tetsuro Nishimura, Nihon Superior Co., Ltd.; Sergey A. Belyakov and Christopher M. Gourlay, Imperial College London)
SMTAI Virtual Conference November 15 - December 31, 20217
MEDIA AND ASSOCIATION SPONSORS
HOW TO ACCESS
Accessing the virtual conference has never been easier!
You will receive instructions and credentials for accessing the on-demand conference via email. If you have not received it, please contact [email protected] or call +1-952-920-7682.
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SMTAI Virtual Conference November 15 - December 31, 20219
Automotive Gate Driver Package with Galvanically Isolated Communication Linkage Burton Carpenter, NXP Semiconductors#150 VIEW ABSTRACT
(APT)
ADVANCED PACKAGING TECHNOLOGY
Cu Conductive Paste as Via Filling Materials for Through Silicon Via (TSV) and Through Glass Via (TGV) Yoshinori Ejiri, Showa Denko Materials Co., Ltd.#151 VIEW ABSTRACT
Emerging Processes & Assembly Challenges for Electronics Manufacturing Glenn Farris, Universal Instruments Corporation#152 VIEW ABSTRACT
No Bleed Die Attach to Roughened Leadframe Dan Hart, MacDermid Alpha Electronics Solutions#153 VIEW ABSTRACT
Ag Sintering Die Attach Solution for System in Package RF Module- Assembly, Process Challenges and Resin Bleed Out Optimization Md Hasnine, Qorvo#154 VIEW ABSTRACT
ADVANCED PACKAGING TECHNOLOGY (APT)
A Generic Approach for Automatic Design Rule Derivation for Assembly Design Kits (ADK) Andy Heinig, Fraunhofer IIS/EAS#155 VIEW ABSTRACT
Advances in Packaging for Future Technology Trends Kai Hollstein, Institute for Microelectronic Systems#156 VIEW ABSTRACT
Freeze Frame Reflow to Enhance Yields for Advanced Low Profile Bottom Terminated Packages Steven Kummerl, Texas Instruments#158 VIEW ABSTRACT
High Speed Data Transmission Characteristics On Glass Based Interposer Satoru Kuramochi, Dai Nippon Printing#159 VIEW ABSTRACT
Underfill Material and Interface Property Evolution in Underhood Automotive Temperatures over Period of 1-Year Pradeep Lall, Ph.D., Auburn University#160 VIEW ABSTRACT
Additive-Print Process-Performance Interaction for Ink-Jet and Direct-Write Circuits with Surface Mount Components Pradeep Lall, Ph.D., Auburn University#161 VIEW ABSTRACT
ADVANCED PACKAGING TECHNOLOGY (APT)
Micro Device Hot Solder Dip: Assessing the Validity of Self-Mitigation in Micro Components Phil Myers, Retronix Ltd#162 VIEW ABSTRACT
Reliability Assessment of Micro Via Stacking Configuration in FCPBGA using FEM Sandeep Shantaram, Ph.D., NXP Semiconductors#163 VIEW ABSTRACT
CPU Socket Interposer Component Level and Manufacturability Study, Part 1: Socket Contact vs. Direct-Solder-Attach Interconnection Paul Wang, Mitac International Corporation
#164 VIEW ABSTRACT
An Approach to Use Reduced Sample Sizes for Qualification Testing Based on Failures in Time (FITS) Analysis and the Poisson Exponential Binomial Distribution for Low Volume Custom Components Jacob Weber, Collins Aerospace
#165 VIEW ABSTRACT
Modeling of the Effect of Thermal Pad Voiding on Quad Flatpack No-Lead Components Ross Wilcoxon, Ph.D., Collins Aerospace#166 VIEW ABSTRACT
ADVANCED PACKAGING TECHNOLOGY (APT)
Innovative Indium and Silver-Tin Plating Processes for Connector Press-Fit Applications Frank Xu, Ph.D., MacDermid Alpha Electronics Solutions#167 VIEW ABSTRACT
Fundamental Study of Core Ball BGA Technology Through Assembly to Reliability Jimin Yao, Intel Corporation#168 VIEW ABSTRACT
(FSA)
Deliquescent Relative Humidity Measurement of No-Clean Flux Residues Eric Campbell, IBM Corporation#250 VIEW ABSTRACT
An Investigation into the Effects of Greases on Low-Load Gold-Plated Electrical Contacts Undergoing Fretting Rishabh Chaudhary, M.S., Center for Advanced Life Cycle Engineering (CALCE)#251 VIEW ABSTRACT
Dielectric Behavior of Solder Deborah Chung, Ph.D., University at Buffalo, The State University of New York#252 VIEW ABSTRACT
Development of Encapsulation Solutions for Flexible Hybrid Electronics Weifeng Liu, Ph.D., Flex#253 VIEW ABSTRACT
Materials Characterization and Correlation Study of Solder Paste using Electrochemical Impedance Spectroscopy (EIS) and Surface Insulation Resistance (SIR) Mark McMeen, STI Electronics
#254 VIEW ABSTRACT
FLUX, SOLDER, ADHESIVES (FSA)
A Correlation Study of Solder Cup Voiding Versus Solder Joint Integrity Timothy Pearson, Collins Aerospace#255 VIEW ABSTRACT
Lower Temperature Soldering Using Supercooled Liquid Metal Ian Tevis, SAFI-Tech#256 VIEW ABSTRACT
Edge Bonding as Viable Reinforcement for Solder Joints in High Reliability Applications Jimmy Shu, MacDermid Alpha Electronics Solutions#257 VIEW ABSTRACT
Test Methods to Differentiate Risk between Benign and Aggressive Wave Colder No-Clean Flux Residue Kevin Zhang, Cisco Systems, Inc.#258 VIEW ABSTRACT
(HE)
HARSH ENVIRONMENT APPLICATIONS
Use of Electrochemical Impedance Spectroscopy (EIS) as Test Method for Humidity Interaction with PCBA Rajan Ambat, Ph.D., Technical University of Denmark#350 VIEW ABSTRACT
SIR Glass Test Vehicle Designed to Characterize Process Materials Mike Bixenman, DBA, MBA, Magnalytix#351 VIEW ABSTRACT
Challenges of Interpreting and Applying New IPC J-STD-001 Cleanliness Standards in High-Rel Applications Bill Capen, Honeywell FM&T#352 VIEW ABSTRACT
Assessment Of Long-term Storage System Of Electronic Components Diganta Das, Ph.D., University of Maryland - CALCE#353 VIEW ABSTRACT
Electrical Performance Impact of Disinfecting Near and Around Electronic Systems Phil Isaacs, IBM Corporation and Terry Munson, Foresite, Inc.#354 VIEW ABSTRACT
SMTAI Virtual Conference November 15 - December 31, 202116
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[email protected]
kohyoung.com
SMTAI Virtual Conference November 15 - December 31, 202117
HARSH ENVIROMENT APPLICATIONS (HE)
Online Monitoring of Non-Ionic Impurities in Rinsing of Cleaned PCBA Vladimir Sitko, PBT Works s.r.o.#355 VIEW ABSTRACT
Effect of Temperature on the Mechanical Fatigue of Solder Joints in Ball Grid Array Assembly Xin Wei, Auburn University#356 VIEW ABSTRACT
(INS)
A New X-Ray Tube Technology to Revolutionise Electronics Inspection Keith Bryant, KB Consultancy#450 VIEW ABSTRACT
Head on Pillow Defect Detection Using AI Machine Learning Ajay Chaddha, Ph.D., Intel Corporation#451 VIEW ABSTRACT
New Paradigm in Additive Manufacturing: Utilization of Computed Tomography Chen Dai, Ph.D., VJ Technologies#452 VIEW ABSTRACT
Method of Traceability and Counterfeit Detection of Components Through the Resale Market Using IoT and Blockchain Curtis Grosskopf, IBM Corporation#453 VIEW ABSTRACT
Not Your Father's Flying Probe Technology: New, Advanced, and Lesser-Known Capabilities of Contemporary Flying Probe Test Systems Giovanni Noto, SPEA
#454 VIEW ABSTRACT
INSPECTION/COUNTERFEIT ELECTRONICS (INS)
Counterfeit Mitigation by In-Line Deep Visual Inspection Eyal Weiss, Ph.D., Cybord#455 VIEW ABSTRACT
Development of a Technique for Detecting Counterfeit Energy Storage Systems Thomas Yesufu, Ph.D., Obafemi Awolowo University#456 VIEW ABSTRACT
(LTS)
LOW TEMPERATURE SOLDER
Enabling Pin in Paste Through Hole Soldering Through SnBi Low Temperature Solder Sugadh Bakare, Intel Corporation#550 VIEW ABSTRACT
Evaluations of High Reliability Lead-Free Solder Paste Jasbir Bath, Koki Solder America Inc.#551 VIEW ABSTRACT
Mechanical Strength - Low Melting Temperature Alloys Test Lars Bruno, Ericsson AB#552 VIEW ABSTRACT
SAC-SnBi Solder Joint Failure Location vs. Acceleration Condition Kevin Byrd, Ph.D., Intel Corporation#553 VIEW ABSTRACT
Component Side Hot Tear Defect Root Causes And Control in Full LTS Solder Joints Kevin Byrd, Ph.D., Intel Corporation#554 VIEW ABSTRACT
Enroll Today in the SMTA Assembly Essentials Package
Courses Cover 7 Key Processes:
www.smta.org/training
• Selective Soldering • Cleaning • Rework
Courses Cover 7 Key Processes:
www.smta.org/training
• Selective Soldering • Cleaning • Rework
SMTAI Virtual Conference November 15 - December 31, 202122
LOW TEMPERATURE SOLDER (LTS)
Effect of Initial Volume Ratio, Reflow Temperature and Current Stressing on the Microstructure of SnBiAg-SAC Mixed Solder Joints Eric Cotts, Binghamton University#555 VIEW ABSTRACT
The Effect of Peak Reflow Temperature on Thermal Cycling Performance and Failure Mode of Hybrid Low Temperature Solder Joints Richard Coyle, Ph.D., Nokia Bell Labs#556 VIEW ABSTRACT
Interim Thermal Cycling Report on Hybrid and Homogeneous LTS Solder Joints Richard Coyle, Ph.D., Nokia Bell Labs#557 VIEW ABSTRACT
Microalloying Effects on Intermetallic Compound Growth and Mechanical Reliability of Sn-Bi Solder Joints Yaohui Fan, Ph.D., Purdue University#558 VIEW ABSTRACT
Using a Low Melting Point Solder in a Selective Soldering Process Eddie Groves and Jonathan Wol, Pillarhouse USA, Inc.#559 VIEW ABSTRACT
Effect of Heat Treatment and Current Stressing on the SnBi-Based Solder Joints Faramarz Hadian, Ph.D., Binghamton University#560 VIEW ABSTRACT
LOW TEMPERATURE SOLDER (LTS)
Bismuth Induced Phase Transformation: New Failure Mode for Tin-Based Solder Alloys with Bismuth, Copper and Nickel Timo Herberholz, Ph.D., Robert Bosch GmbH#561 VIEW ABSTRACT
The Influence of Element Lead (Pb) Content in Tin Plating on Tin Whisker Initiation/Growth David Hillman, Collins Aerospace#562 VIEW ABSTRACT
Manufacturing Cost Reductions Available When Using Low MP Solder Paste Mitchell Holtzer, Alpha Assembly Solutions#563 VIEW ABSTRACT
Challenges To Maintain High Electrical Reliability Of Low Temperature Solder Paste Ramakrishna Hosur Venkatagiriyappa, Ph.D., MacDermid Alpha Assembly Solutions#564 VIEW ABSTRACT
Unveiling a Total Solution for Soldering Through-hole Components using a Low Temperature Alloy Pritha Choudhury, MacDermid Alpha Electronics Solutions#565 VIEW ABSTRACT
Thermal Reliability of Mixing Bismuth Containing Solder Paste with SAC BGA's at Low Reflow Temperature- Part II Sahana Marur Kempaiah, Rochester Institute of Technology#566 VIEW ABSTRACT
LOW TEMPERATURE SOLDER (LTS)
Hybrid Assembly and Reliability of Conventional Pb-Free BGA’s Using Low Temperature Solder Paste for Temperature Sensitive IC Applications Andrew Mawer, NXP Semiconductors
#567 VIEW ABSTRACT
Criteria for Solder Alloy Adoption Michael Osterman, Ph.D., University of Maryland - CALCE#568 VIEW ABSTRACT
Mechanical Shock Testing And Failure Analysis On Mixed SnAgCu- BiSn And Full Stack BiSn Solder Joints Of CABGA192 Components Jagadeesh Radhakrishnan, Intel Corporation#569 VIEW ABSTRACT
Low Temperature Soldering Product Level Certification and Proliferation Kok Kwan Tang, Intel Corporation#570 VIEW ABSTRACT
The Characterization for Rework of Low Temperature Solder Joints Kok Kwan Tang, Intel Corporation#571 VIEW ABSTRACT
Solder Ball Drift Behavior of Hybrid SnAgCuLTS Solder Interconnects in Accelerated Thermal Cycling Luke Wentlent, Universal Instruments Corporation#572 VIEW ABSTRACT
For More Information:
[email protected] or www.zymet.com
© 2020 Zymet
LOW TEMPERATURE SOLDER (LTS)
Thermal Cycling Behaviors of Hybrid and Homogeneous Low Temperature Solder Interconnects Luke Wentlent, Universal Instruments Corporation#573 VIEW ABSTRACT
Intermetallic Compound Analyses Provide Interfacial Reliability for Solder Connections in Electronics Mike Wolverton, P.E., Raytheon Technologies#574 VIEW ABSTRACT
Solder Joint Separation During Second Reflow Induced by VIPPO Structures: Mechanism and Modeling Methodology Study Weidong Xie, Cisco Systems, Inc.#575 VIEW ABSTRACT
(MFX)
The Evolution of Material Handling Practices and Processes Michael Adamson, Inovaxe Corporation#650 VIEW ABSTRACT
Process and Design Guidelines for Large and Complex RF and EMI Shields for Board Level Assembly Mohammed Alam, Intel Corporation#651 VIEW ABSTRACT
Site-Specific Ionic Contamination Process Control Monitoring Plan Method Mike Bixenman, DBA, MBA, Magnalytix#652 VIEW ABSTRACT
Identifying Cleaning Compatibility Issues with Electronic Components Claire Brennan, Ph.D., Collins Aerospace#653 VIEW ABSTRACT
Engineered Aqueous Cleaning It All Comes Down To Performance Debbie Carboni, KYZEN Corporation#654 VIEW ABSTRACT
MANUFACTURING EXCELLENCE (MFX)
Evolution and Applications of Fine-Feature Solder Paste Printing for Heterogeneous Integration Evan Griffith, Indium Corporation#656 VIEW ABSTRACT
The Relationship Between Reflow Profiles and Contamination Mike Konrad, Aqueous Technologies#657 VIEW ABSTRACT
Statistical Analysis of Transfer Efficiency in the Age of Very Large Sample Sizes Ron Lasky, P.E., Ph.D., Indium Corporation#658 VIEW ABSTRACT
What Do You Want on Your Tombstone? Tony Lentz, FCT Assembly#659 VIEW ABSTRACT
Cleanliness Detection and Resistance of Solvent Extract, A Critical Evaluation David Lober, KYZEN Corporation#660 VIEW ABSTRACT
MANUFACTURING EXCELLENCE (MFX)
Robotic Soldering Process Implementation and Optimization in Electronics Manufacturing Sanmaher Mashaareh, P.E., Binghamton University#661 VIEW ABSTRACT
Impact Of The Surface Finish On IMC And Solder Joint Reliability With Low-Temperature Solder Paste Britta Schafsteller, Atotech USA, LLC#662 VIEW ABSTRACT
Correlation of Solder Paste Electrochemical Impedance Spectroscopy (EIS) Measurements to Solder Paste Inspection (SPI) Performance Morgan Miller, Insituware
#663 VIEW ABSTRACT
Designing Of Rheology Tests To Develop New Solder Pastes Formulation Charlotte Morin, Inventec Performance Chemicals#664 VIEW ABSTRACT
The Effect of Grain Size Distribution on the Defect Generation Mechanism of 0201 Passives Swagatika Patra, Binghamton University-SUNY #665 VIEW ABSTRACT
Modern Electronics Defluxing – Meeting the Low VOC Challenge Naveen Ravindran, M.S.Ch.E., ZESTRON Corporation#666 VIEW ABSTRACT
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MANUFACTURING EXCELLENCE (MFX)
Detailed Study Of Condensate Residues In The Soldering Process - Analysis Of The Responsible Reaction Partners As Well As Reasons For Condensate Polymerization And Growth Of Crystalline Structures Viktoria Rawinski, Rawinski GmbH
#667 VIEW ABSTRACT
Root Cause of Dye Stain Observed on Server Motherboard Sockets BGA Solder Joints and its Impact on Their Solder Joint Quality and Reliability Hemant Shah, Ph.D., Intel Corporation
#668 VIEW ABSTRACT
Thin Foil Printing in Today’s Miniaturized World: Do Printing Rules Change? Chrys Shea, Shea Engineering Services#669 VIEW ABSTRACT
Importancy of Good Design for Cleaning PCBA Vladimir Sitko, PBT Works s.r.o.#670 VIEW ABSTRACT
Validation of Changes and Monitoring Cleaning Process Stability According to J-STD 001H Chapter 8 Vladimir Sitko, PBT Works s.r.o.#671 VIEW ABSTRACT
New Device Validates Printer Accuracy and Squeegee Force Capability During Singular Test Michael Sivigny, CeTaQ Americas#672 VIEW ABSTRACT
Lessons learned with Large and Heavy Copper Boards, a Review of Quality and Productivity Improvements Paul Wilson, Rockwell Automation#673 VIEW ABSTRACT
(SLIR)
SECOND-LEVEL INTERCONNECT RELIABILITY
Effects of Matching Lead-Free Solder Joints Compared to SnPb on BGA Reliability in Thermal Cycling Mohammed Belhadi, Auburn University#750 VIEW ABSTRACT
A Modified Coffin-Manson Methodology for Predicting Solder Joint Life in Eutectic Tin-Lead and Lead-Free Assemblies Jean-Paul Clech, Ph.D., EPSI Inc.#751 VIEW ABSTRACT
A Novel Bismuth and Antimony Containing Lead-Free Solder with Enhanced Thermal Reliability for Automotive and LED Applications Jie Geng, Indium Corporation
#752 VIEW ABSTRACT
Perspectives and Considerations for the Implementation of Pb-Free Solders into Aerospace, Defense, and High Performance Products and Systems Part 1 David Hillman, Collins Aerospace
#753 VIEW ABSTRACT
An Investigation on the Influence of Nickel Contamination of Plated Through Hole (PTH) Solder Joint Integrity David Hillman, Collins Aerospace#754 VIEW ABSTRACT
Reducing Solder Scrap by Replacing Solder Paste with Solder Preforms When Appropriate Mitchell Holtzer, MacDermid Alpha Assembly Solutions#755 VIEW ABSTRACT
SECOND-LEVEL INTERCONNECT RELIABILITY (SLIR)
Reliability of Solder Joints on Flexible Aluminum PC Boards Divyakant Kadiwala, Averatek Corporation#756 VIEW ABSTRACT
Mechanical Characterization of SAC305 and SnPb36Ag2 BGA Assemblies Under Static Flexural Loading Jean-Baptiste Libot, Ph.D., Safran Electronics & Defense#757 VIEW ABSTRACT
Perspectives and Considerations for the Implementation of Pb-Free Solders into Aerospace, Defense, and High Performance Products and Systems Part 2 Anthony Rafanelli, Ph.D., Raytheon Technologies
#758 VIEW ABSTRACT
Low-Temperature Solders SMT Process Optimization for Enhanced Reliability Morgana Ribas, Ph.D., MacDermid Alpha Electronics Solutions#760 VIEW ABSTRACT
SECOND-LEVEL INTERCONNECT RELIABILITY (SLIR)
The Effects of Surface Finish on the Microstructure of TLPS Paste Joints Catherine Shearer, EMD Electronics#761 VIEW ABSTRACT
Role of Conformal Coating and Its Strategies for Tin Whisker Mitigation Preeth Sivakumar, Binghamton University#762 VIEW ABSTRACT
Solderability of Additive Cu Surfaces Rebecca Wheeling, Ph.D., Sandia National Laboratories#763 VIEW ABSTRACT
(SUB)
SUBSTRATES/PCB TECHNOLOGY
Identifying Causes of Wire Bond Pad Metal Lift-Off Failures in ENEPIG Deposits Patrick Valentine, Uyemura USA#850 VIEW ABSTRACT
Microstructure of Weak-Micro-Via and its Failure Prevention Ming-Chun Hsieh, Osaka University#851 VIEW ABSTRACT
Improving Immersion Silver Performance for 5G Applications Denis Jacques, Technic Inc#852 VIEW ABSTRACT
Investigation of Pd-Ge Alloy in ENEPIG Process as Better Barrier Layer Yohei Kaneko, C. Uyemura & Co., Ltd.#853 VIEW ABSTRACT
Varying Requirements, same Inkjet Solder Mask Coating Tool - The case of Inkjet Adaptability by Printing Strategies Bas Le Grand, Luca Gavtero and Don Veri, SUSS MicroTec NL#854 VIEW ABSTRACT
(TI)
TECHNICAL INNOVATIONS
Leveraging CFX-QPL to Integrate Equipment and Create a Smart Factory Ivan Aduna, Koh Young America, Inc.#950 VIEW ABSTRACT
Photonic Soldering Temperature Sensitive Components with High Temperature Solder Alloys Vahid Akhavan, NovaCentrix#951 VIEW ABSTRACT
The Effects of the Cleaning of Populated Circuits Boards on the Performance of Conformal Coating in Thermal Shock Testing Chris Brightwell, Huiseal Europe#952 VIEW ABSTRACT
Getting Real In The Digital World Michael Ford, Aegis Software#953 VIEW ABSTRACT
New IPC-1783 Component Level Authentication (CLA) Standard Michael Ford, Aegis Software#954 VIEW ABSTRACT
TECHNICAL INNOVATIONS (TI)
Aerosol Jet Printed Interconnects For Millimeter-wave Components Bryan Germann, Optomec, Inc.#955 VIEW ABSTRACT
An Automated PCB Design Constraint Extraction and Verification from the SOC Platform Design Collateral Alan Hatfield, Intel Corporation#956 VIEW ABSTRACT
An Investigation into Alternative Methods of Drying Moisture Sensitive Devices in Storage and in Re-Work Applications Dan Jenkins, Steel Camel#957 VIEW ABSTRACT
High Performance Liquid Metal Thermal Interface Materials Ron Lasky, P.E., Ph.D., Indium Corporation#958 VIEW ABSTRACT
GaIn Based Liquid Metals as TIMs: Challenges and Considerations Peter McClure, Universal Instruments’ Advanced Process Laboratory#959 VIEW ABSTRACT
Systems Analysis and Axiomatic Design Using Discrete Event Simulation Zohair Mehkri, Flex#960 VIEW ABSTRACT
TECHNICAL INNOVATIONS (TI)
Liquid Dispensed Thermal Materials – Product Formats, Properties and Manufacturing Sanjay Misra, Henkel Corporation#961 VIEW ABSTRACT
Thermal Interface Material for Advance Electronics Applications Rita Mohanty, Ph.D., Henkel#962 VIEW ABSTRACT
Comparative Study Of Thermal Conductive Adhesive And Die Attach Material For Heatsink Assembly Raghabendra Rout, Binghamton University-SUNY#963 VIEW ABSTRACT
SMT Performance Analytics - Golden Cycle Time and Automated Loss Reason Inference Andrew Scheuerman, Ph.D., Arch Systems#964 VIEW ABSTRACT
A Digital Solution to Manage In-Circuit Testing Zhipeng (Grady) Wang, IBM Corporation#965 VIEW ABSTRACT
(PDC’S)
PROFESSIONAL DEVELOPMENT COURSES
Half day (3.5 hours) educational courses are led by internationally respected professionals with extensive experience in the subject area.
Course instructors deliver focused, in-depth presentations on topics of current importance to the industry, based on their research and industry experience. Professional Development Courses are application oriented and structured to combine field experience with scientific research to solve everyday problems.
All courses will be held from 10:00am-1:30pm US Central
Solder Joint Reliability – Principle and Practice Jennie Hwang, Ph.D., H-Technologies GroupPDC 3 November 15, 2021 | View Course Description
Reliability of Electronics – Role of Intermetallic Compounds Jennie Hwang, Ph.D., H-Technologies GroupPDC 8 November 16, 2021 | View Course Description
Assembly and Reliability of Flip Chip and 6-Side Molded WLCSP John Lau, UnimicronPDC 16 November 18, 2021 | View Course Description
Principles and Practice of Developing Soldering Profiles Ray Prasad, Ray Prasad ConsultancyPDC 17 November 30, 2021 | View Course Description
PROFESSIONAL DEVELOPMENT COURSES (PDC’S)
Ball Grid Array: Design and Assembly of BGAs with Emphasis on Backward Compatibility Ray Prasad, Ray Prasad ConsultancyPDC 18 December 2, 2021 | View Course Description
Design and Assembly Process Challenges for Bottom Termination Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World Ray Prasad, Ray Prasad ConsultancyPDC 19 December 7, 2021 | View Course Description
LTS 101: Manufacturing Process Guidance for Implementation of SnBi Base Low Temperature Soldering for Consumer Products Kok Kwan Tang, Intel CorporationPDC 20 December 9, 2021 | View Course Description
Robotic Soldering Process, Design, Quality Control & Defects – Causes & Cures Bob Willis, bobwillis.co.ukPDC 21 December 14, 2021 | View Course Description
Practical Use of Low Temperature Solder, Assembly, Reflow & Inspection Bob Willis, bobwillis.co.ukPDC 22 December 16, 2021 | View Course Description
Assembly: Best Practices for Improving Manufacturing Productivity - Part 1 Jim Hall and Phil Zarrow, ITM ConsultingPDC 6 January 12, 2022 | View Course Description
PROFESSIONAL DEVELOPMENT COURSES (PDC’S)
Assembly: Best Practices for Improving Manufacturing Productivity - Part 2 Jim Hall and Phil Zarrow, ITM ConsultingPDC 11 January 19, 2022 | View Course Description
Flexible and Rigid Flex Circuit Design Principles Vern Solberg, Solberg Technical ConsultingPDC 1 February 2, 2022 | View Course Description
Cleaning and Cleanliness Quantification Boot Camp Mike Konrad, Aqueous TechnologiesPDC 2 March 2, 2022 | View Course Description
Uncommon Leadership: Developing Influence, Increasing Impact Jason Hunt, Eye Squared LeadershipPDC 13 March 16, 2022 | View Course Description
PCB Design for Implementing 3D and High Density Semiconductor Package Technologies Vern Solberg, Solberg Technical ConsultingPDC 9 March 30, 2022 | View Course Description
PROFESSIONAL DEVELOPMENT COURSES (PDC’S)
Cost Conscious Test Strategies for Electrical Cost Products Robert Hanson, Robert Hanson ConsultingPDC 15 April 6, 2022 | View Course Description
Selection Criteria of Surface Finish for Next Generation PCB Technologies: HDI, High Frequency, RF-Microwave, 5G Kunal Shah, LiloTreePDC 12 April 20, 2022 | View Course Description
Cost Modeling Your Assembly Line or Factory to Reduce Costs and Improve Profitability Ron Lasky, Ph.D., PE., Indium CorporationPDC 4 May 4, 2022 | View Course Description
WELCOME TO THE VIRTUAL SMTA INTERNATIONAL
Richard Coyle, Ph.D. VP Technical Programs
Nokia Bell Labs
Intel Corporation
The SMTA welcomes you to the virtual SMTA International. We have crafted another exceptional conference experience for our attendees.
The program contains useful and relevant information from subject matter experts covering a wide range of topics, including technical sessions on Advanced Packaging (APT); Flux, Solder, Adhesives (FSA); Harsh Environments (HE), Manufacturing Excellence (MFX), Lead-Free Soldering Technology with a strong emphasis on Low Temperature Solders (LTS), Second-Level Interconnect Reliability (SLIR), Substrates (SUB), Technical Innovations (TI), and the Women’s Leadership Program.
We also want to extend our personal thanks to the companies and individuals that continue to sponsor and support SMTA International in these uncertain times. This includes the exhibitors, speakers, authors, co-authors, volunteers and the SMTA staff, chapter officers and Board of Directors. Your support and commitment are what makes SMTA International such an exceptional event.
The Technical Advisory Committee, Expo Committee, staff, and Board of Directors sincerely hope that SMTA International remains a valuable and enjoyable experience for you. Thank you for your participation and support.
SMTAI Virtual Conference November 15 - December 31, 20213
The distinguished SMTA International Technical Advisory Committee includes electronics manufacturing and packaging experts representing all facets of the industry. The Committee designed the conference program to ensure that today's latest trends and developments are fully addressed. They are an important component of the SMTA Knowledge Base.
Mohammed Abueed Intel Corporation
Dudi Amir Intel Corporation
Rochester Institute of Technology
Nilesh Badwe, Ph.D. IIT Kanpur
Andy Behr Panasonic
Lars Boettcher Fraunhofer IZM Berlin
Rob Boguski Datest Corporation
Keith Bryant KB Consultancy
Creative Electron, Inc.
Track Director NXP Semiconductors
ESI Automotive
Priyanka Dobriyal, Ph.D. Women's Leadership Program
Track Director Intel Corporation
Trevor Galbraith Global SMT & Packaging
Jay Gorajia Siemens Digital Industries Software
Faramarz Hadian Binghamton University
Dave Hillman Collins Aerospace
ZESTRON Americas
Robert Kinyanjui, Ph.D. Harsh Environments Track Director John Deere Electronic Solutions, Inc.
Pradeep Lall, Ph.D. Auburn University
Dale Lee Plexus Corp.
Tanya Martin, CMP SMTA
Andrew Mawer NXP Semiconductor
Tim Pearson Flux, Solder, Adhesives Track Director
Collins Aerospace
Julie Silk Keysight Technologies
Greg Vance Rockwell Automation
Charles Woychik, Ph.D. SkyWater Technology
Raiyo Aspandiar, Ph.D. Conference Director
Intel Corporation
Nokia Bell Labs
TECHNICAL ADVISORY COMMITTEE
www.smta.org/smtai Due Date: May 2, 2022
Become a part of the industry’s strongest technical program addressing all aspects of electronics manufacturing. Plan to present in-person or virtually at the annual SMTA International Conference. Full technical paper is required for
inclusion in the published proceedings.
Proposals are also being solicited from individuals interested in teaching professional development courses related to surface mount technology, advanced packaging, and electronics manufacturing.
Conference: October 31 - November 3 Exposition: November 2 - 3
Minneapolis, Minnesota, USA
SMTA+ Corporate Keysight Technologies
Excellence in Leadership Debbie Carboni
KYZEN Corporation
Indium Corporation
Auburn University
2021 Education Awards
AWARD WINNERS
WINNER: Richard Coyle, Ph.D., Nokia Bell Labs "Enhancing Thermal Fatigue Reliability of Pb-Free Solder Alloys with Additions of Bismuth and Antimony" (Co-Authors: Charmaine Johnson, David Hillman, and Tim Pearson, Collins Aerospace; Michael Osterman, CALCE; Joe Smetana, Nokia; Keith Howell, Nihon Superior Co., Ltd.; Hongwen Zhang and Ji Geng, Indium Corp.; Julie Silk, Keysight Technologies; Derek Daily, Senju Comtek Corp.; Babak Arfaei, SUNY-Binghamton; Ranjit Pandher, Alpha Technologies; Andre Delhaise, Celestica; Stuart Longgood, Delphi Technologies; Andre Kleyner, Aptiv)
Honorable Mention: Andrew Mawer, NXP Semiconductors "Miniaturized Stacked Die QFN for Tire Pressure Monitoring System Applications" (Co-Authors: Mollie Benson, Dwight Daniels, A R Nazmus Sakib, and Vishrudh Sriramprasad, NXP Semiconductors N.V.)
Honorable Mention: Jennifer Bennet, P.E., IBM Corporation "CBGA and CCGA Field Reliability Predictions Confirmed" (Co-Authors: Jim Bielick, Marie Cole, IBM Corporation)
Honorable Mention: Karen Tellefsen, Ph.D., MacDermid Alpha Electronics Solutions "Advanced SIR Testing for Trapped Solder Paste Flux Residue" (Co-Authors: Aurkie Ray, Anna Lifton and Paul Salerno, MacDermid Alpha Electronics Solutions)
Honorable Mention: Keith Sweatman, Ph.D., Nihon Superior Company, Ltd. "Behaviour and Strengthening Effects of Sb in a Low-Bi Sn-Cu Solder Alloy" (Co-Authors: Tetsuro Nishimura, Nihon Superior Co., Ltd.; Sergey A. Belyakov and Christopher M. Gourlay, Imperial College London)
SMTAI Virtual Conference November 15 - December 31, 20217
MEDIA AND ASSOCIATION SPONSORS
HOW TO ACCESS
Accessing the virtual conference has never been easier!
You will receive instructions and credentials for accessing the on-demand conference via email. If you have not received it, please contact [email protected] or call +1-952-920-7682.
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SMTAI Virtual Conference November 15 - December 31, 20219
Automotive Gate Driver Package with Galvanically Isolated Communication Linkage Burton Carpenter, NXP Semiconductors#150 VIEW ABSTRACT
(APT)
ADVANCED PACKAGING TECHNOLOGY
Cu Conductive Paste as Via Filling Materials for Through Silicon Via (TSV) and Through Glass Via (TGV) Yoshinori Ejiri, Showa Denko Materials Co., Ltd.#151 VIEW ABSTRACT
Emerging Processes & Assembly Challenges for Electronics Manufacturing Glenn Farris, Universal Instruments Corporation#152 VIEW ABSTRACT
No Bleed Die Attach to Roughened Leadframe Dan Hart, MacDermid Alpha Electronics Solutions#153 VIEW ABSTRACT
Ag Sintering Die Attach Solution for System in Package RF Module- Assembly, Process Challenges and Resin Bleed Out Optimization Md Hasnine, Qorvo#154 VIEW ABSTRACT
ADVANCED PACKAGING TECHNOLOGY (APT)
A Generic Approach for Automatic Design Rule Derivation for Assembly Design Kits (ADK) Andy Heinig, Fraunhofer IIS/EAS#155 VIEW ABSTRACT
Advances in Packaging for Future Technology Trends Kai Hollstein, Institute for Microelectronic Systems#156 VIEW ABSTRACT
Freeze Frame Reflow to Enhance Yields for Advanced Low Profile Bottom Terminated Packages Steven Kummerl, Texas Instruments#158 VIEW ABSTRACT
High Speed Data Transmission Characteristics On Glass Based Interposer Satoru Kuramochi, Dai Nippon Printing#159 VIEW ABSTRACT
Underfill Material and Interface Property Evolution in Underhood Automotive Temperatures over Period of 1-Year Pradeep Lall, Ph.D., Auburn University#160 VIEW ABSTRACT
Additive-Print Process-Performance Interaction for Ink-Jet and Direct-Write Circuits with Surface Mount Components Pradeep Lall, Ph.D., Auburn University#161 VIEW ABSTRACT
ADVANCED PACKAGING TECHNOLOGY (APT)
Micro Device Hot Solder Dip: Assessing the Validity of Self-Mitigation in Micro Components Phil Myers, Retronix Ltd#162 VIEW ABSTRACT
Reliability Assessment of Micro Via Stacking Configuration in FCPBGA using FEM Sandeep Shantaram, Ph.D., NXP Semiconductors#163 VIEW ABSTRACT
CPU Socket Interposer Component Level and Manufacturability Study, Part 1: Socket Contact vs. Direct-Solder-Attach Interconnection Paul Wang, Mitac International Corporation
#164 VIEW ABSTRACT
An Approach to Use Reduced Sample Sizes for Qualification Testing Based on Failures in Time (FITS) Analysis and the Poisson Exponential Binomial Distribution for Low Volume Custom Components Jacob Weber, Collins Aerospace
#165 VIEW ABSTRACT
Modeling of the Effect of Thermal Pad Voiding on Quad Flatpack No-Lead Components Ross Wilcoxon, Ph.D., Collins Aerospace#166 VIEW ABSTRACT
ADVANCED PACKAGING TECHNOLOGY (APT)
Innovative Indium and Silver-Tin Plating Processes for Connector Press-Fit Applications Frank Xu, Ph.D., MacDermid Alpha Electronics Solutions#167 VIEW ABSTRACT
Fundamental Study of Core Ball BGA Technology Through Assembly to Reliability Jimin Yao, Intel Corporation#168 VIEW ABSTRACT
(FSA)
Deliquescent Relative Humidity Measurement of No-Clean Flux Residues Eric Campbell, IBM Corporation#250 VIEW ABSTRACT
An Investigation into the Effects of Greases on Low-Load Gold-Plated Electrical Contacts Undergoing Fretting Rishabh Chaudhary, M.S., Center for Advanced Life Cycle Engineering (CALCE)#251 VIEW ABSTRACT
Dielectric Behavior of Solder Deborah Chung, Ph.D., University at Buffalo, The State University of New York#252 VIEW ABSTRACT
Development of Encapsulation Solutions for Flexible Hybrid Electronics Weifeng Liu, Ph.D., Flex#253 VIEW ABSTRACT
Materials Characterization and Correlation Study of Solder Paste using Electrochemical Impedance Spectroscopy (EIS) and Surface Insulation Resistance (SIR) Mark McMeen, STI Electronics
#254 VIEW ABSTRACT
FLUX, SOLDER, ADHESIVES (FSA)
A Correlation Study of Solder Cup Voiding Versus Solder Joint Integrity Timothy Pearson, Collins Aerospace#255 VIEW ABSTRACT
Lower Temperature Soldering Using Supercooled Liquid Metal Ian Tevis, SAFI-Tech#256 VIEW ABSTRACT
Edge Bonding as Viable Reinforcement for Solder Joints in High Reliability Applications Jimmy Shu, MacDermid Alpha Electronics Solutions#257 VIEW ABSTRACT
Test Methods to Differentiate Risk between Benign and Aggressive Wave Colder No-Clean Flux Residue Kevin Zhang, Cisco Systems, Inc.#258 VIEW ABSTRACT
(HE)
HARSH ENVIRONMENT APPLICATIONS
Use of Electrochemical Impedance Spectroscopy (EIS) as Test Method for Humidity Interaction with PCBA Rajan Ambat, Ph.D., Technical University of Denmark#350 VIEW ABSTRACT
SIR Glass Test Vehicle Designed to Characterize Process Materials Mike Bixenman, DBA, MBA, Magnalytix#351 VIEW ABSTRACT
Challenges of Interpreting and Applying New IPC J-STD-001 Cleanliness Standards in High-Rel Applications Bill Capen, Honeywell FM&T#352 VIEW ABSTRACT
Assessment Of Long-term Storage System Of Electronic Components Diganta Das, Ph.D., University of Maryland - CALCE#353 VIEW ABSTRACT
Electrical Performance Impact of Disinfecting Near and Around Electronic Systems Phil Isaacs, IBM Corporation and Terry Munson, Foresite, Inc.#354 VIEW ABSTRACT
SMTAI Virtual Conference November 15 - December 31, 202116
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[email protected]
kohyoung.com
SMTAI Virtual Conference November 15 - December 31, 202117
HARSH ENVIROMENT APPLICATIONS (HE)
Online Monitoring of Non-Ionic Impurities in Rinsing of Cleaned PCBA Vladimir Sitko, PBT Works s.r.o.#355 VIEW ABSTRACT
Effect of Temperature on the Mechanical Fatigue of Solder Joints in Ball Grid Array Assembly Xin Wei, Auburn University#356 VIEW ABSTRACT
(INS)
A New X-Ray Tube Technology to Revolutionise Electronics Inspection Keith Bryant, KB Consultancy#450 VIEW ABSTRACT
Head on Pillow Defect Detection Using AI Machine Learning Ajay Chaddha, Ph.D., Intel Corporation#451 VIEW ABSTRACT
New Paradigm in Additive Manufacturing: Utilization of Computed Tomography Chen Dai, Ph.D., VJ Technologies#452 VIEW ABSTRACT
Method of Traceability and Counterfeit Detection of Components Through the Resale Market Using IoT and Blockchain Curtis Grosskopf, IBM Corporation#453 VIEW ABSTRACT
Not Your Father's Flying Probe Technology: New, Advanced, and Lesser-Known Capabilities of Contemporary Flying Probe Test Systems Giovanni Noto, SPEA
#454 VIEW ABSTRACT
INSPECTION/COUNTERFEIT ELECTRONICS (INS)
Counterfeit Mitigation by In-Line Deep Visual Inspection Eyal Weiss, Ph.D., Cybord#455 VIEW ABSTRACT
Development of a Technique for Detecting Counterfeit Energy Storage Systems Thomas Yesufu, Ph.D., Obafemi Awolowo University#456 VIEW ABSTRACT
(LTS)
LOW TEMPERATURE SOLDER
Enabling Pin in Paste Through Hole Soldering Through SnBi Low Temperature Solder Sugadh Bakare, Intel Corporation#550 VIEW ABSTRACT
Evaluations of High Reliability Lead-Free Solder Paste Jasbir Bath, Koki Solder America Inc.#551 VIEW ABSTRACT
Mechanical Strength - Low Melting Temperature Alloys Test Lars Bruno, Ericsson AB#552 VIEW ABSTRACT
SAC-SnBi Solder Joint Failure Location vs. Acceleration Condition Kevin Byrd, Ph.D., Intel Corporation#553 VIEW ABSTRACT
Component Side Hot Tear Defect Root Causes And Control in Full LTS Solder Joints Kevin Byrd, Ph.D., Intel Corporation#554 VIEW ABSTRACT
Enroll Today in the SMTA Assembly Essentials Package
Courses Cover 7 Key Processes:
www.smta.org/training
• Selective Soldering • Cleaning • Rework
Courses Cover 7 Key Processes:
www.smta.org/training
• Selective Soldering • Cleaning • Rework
SMTAI Virtual Conference November 15 - December 31, 202122
LOW TEMPERATURE SOLDER (LTS)
Effect of Initial Volume Ratio, Reflow Temperature and Current Stressing on the Microstructure of SnBiAg-SAC Mixed Solder Joints Eric Cotts, Binghamton University#555 VIEW ABSTRACT
The Effect of Peak Reflow Temperature on Thermal Cycling Performance and Failure Mode of Hybrid Low Temperature Solder Joints Richard Coyle, Ph.D., Nokia Bell Labs#556 VIEW ABSTRACT
Interim Thermal Cycling Report on Hybrid and Homogeneous LTS Solder Joints Richard Coyle, Ph.D., Nokia Bell Labs#557 VIEW ABSTRACT
Microalloying Effects on Intermetallic Compound Growth and Mechanical Reliability of Sn-Bi Solder Joints Yaohui Fan, Ph.D., Purdue University#558 VIEW ABSTRACT
Using a Low Melting Point Solder in a Selective Soldering Process Eddie Groves and Jonathan Wol, Pillarhouse USA, Inc.#559 VIEW ABSTRACT
Effect of Heat Treatment and Current Stressing on the SnBi-Based Solder Joints Faramarz Hadian, Ph.D., Binghamton University#560 VIEW ABSTRACT
LOW TEMPERATURE SOLDER (LTS)
Bismuth Induced Phase Transformation: New Failure Mode for Tin-Based Solder Alloys with Bismuth, Copper and Nickel Timo Herberholz, Ph.D., Robert Bosch GmbH#561 VIEW ABSTRACT
The Influence of Element Lead (Pb) Content in Tin Plating on Tin Whisker Initiation/Growth David Hillman, Collins Aerospace#562 VIEW ABSTRACT
Manufacturing Cost Reductions Available When Using Low MP Solder Paste Mitchell Holtzer, Alpha Assembly Solutions#563 VIEW ABSTRACT
Challenges To Maintain High Electrical Reliability Of Low Temperature Solder Paste Ramakrishna Hosur Venkatagiriyappa, Ph.D., MacDermid Alpha Assembly Solutions#564 VIEW ABSTRACT
Unveiling a Total Solution for Soldering Through-hole Components using a Low Temperature Alloy Pritha Choudhury, MacDermid Alpha Electronics Solutions#565 VIEW ABSTRACT
Thermal Reliability of Mixing Bismuth Containing Solder Paste with SAC BGA's at Low Reflow Temperature- Part II Sahana Marur Kempaiah, Rochester Institute of Technology#566 VIEW ABSTRACT
LOW TEMPERATURE SOLDER (LTS)
Hybrid Assembly and Reliability of Conventional Pb-Free BGA’s Using Low Temperature Solder Paste for Temperature Sensitive IC Applications Andrew Mawer, NXP Semiconductors
#567 VIEW ABSTRACT
Criteria for Solder Alloy Adoption Michael Osterman, Ph.D., University of Maryland - CALCE#568 VIEW ABSTRACT
Mechanical Shock Testing And Failure Analysis On Mixed SnAgCu- BiSn And Full Stack BiSn Solder Joints Of CABGA192 Components Jagadeesh Radhakrishnan, Intel Corporation#569 VIEW ABSTRACT
Low Temperature Soldering Product Level Certification and Proliferation Kok Kwan Tang, Intel Corporation#570 VIEW ABSTRACT
The Characterization for Rework of Low Temperature Solder Joints Kok Kwan Tang, Intel Corporation#571 VIEW ABSTRACT
Solder Ball Drift Behavior of Hybrid SnAgCuLTS Solder Interconnects in Accelerated Thermal Cycling Luke Wentlent, Universal Instruments Corporation#572 VIEW ABSTRACT
For More Information:
[email protected] or www.zymet.com
© 2020 Zymet
LOW TEMPERATURE SOLDER (LTS)
Thermal Cycling Behaviors of Hybrid and Homogeneous Low Temperature Solder Interconnects Luke Wentlent, Universal Instruments Corporation#573 VIEW ABSTRACT
Intermetallic Compound Analyses Provide Interfacial Reliability for Solder Connections in Electronics Mike Wolverton, P.E., Raytheon Technologies#574 VIEW ABSTRACT
Solder Joint Separation During Second Reflow Induced by VIPPO Structures: Mechanism and Modeling Methodology Study Weidong Xie, Cisco Systems, Inc.#575 VIEW ABSTRACT
(MFX)
The Evolution of Material Handling Practices and Processes Michael Adamson, Inovaxe Corporation#650 VIEW ABSTRACT
Process and Design Guidelines for Large and Complex RF and EMI Shields for Board Level Assembly Mohammed Alam, Intel Corporation#651 VIEW ABSTRACT
Site-Specific Ionic Contamination Process Control Monitoring Plan Method Mike Bixenman, DBA, MBA, Magnalytix#652 VIEW ABSTRACT
Identifying Cleaning Compatibility Issues with Electronic Components Claire Brennan, Ph.D., Collins Aerospace#653 VIEW ABSTRACT
Engineered Aqueous Cleaning It All Comes Down To Performance Debbie Carboni, KYZEN Corporation#654 VIEW ABSTRACT
MANUFACTURING EXCELLENCE (MFX)
Evolution and Applications of Fine-Feature Solder Paste Printing for Heterogeneous Integration Evan Griffith, Indium Corporation#656 VIEW ABSTRACT
The Relationship Between Reflow Profiles and Contamination Mike Konrad, Aqueous Technologies#657 VIEW ABSTRACT
Statistical Analysis of Transfer Efficiency in the Age of Very Large Sample Sizes Ron Lasky, P.E., Ph.D., Indium Corporation#658 VIEW ABSTRACT
What Do You Want on Your Tombstone? Tony Lentz, FCT Assembly#659 VIEW ABSTRACT
Cleanliness Detection and Resistance of Solvent Extract, A Critical Evaluation David Lober, KYZEN Corporation#660 VIEW ABSTRACT
MANUFACTURING EXCELLENCE (MFX)
Robotic Soldering Process Implementation and Optimization in Electronics Manufacturing Sanmaher Mashaareh, P.E., Binghamton University#661 VIEW ABSTRACT
Impact Of The Surface Finish On IMC And Solder Joint Reliability With Low-Temperature Solder Paste Britta Schafsteller, Atotech USA, LLC#662 VIEW ABSTRACT
Correlation of Solder Paste Electrochemical Impedance Spectroscopy (EIS) Measurements to Solder Paste Inspection (SPI) Performance Morgan Miller, Insituware
#663 VIEW ABSTRACT
Designing Of Rheology Tests To Develop New Solder Pastes Formulation Charlotte Morin, Inventec Performance Chemicals#664 VIEW ABSTRACT
The Effect of Grain Size Distribution on the Defect Generation Mechanism of 0201 Passives Swagatika Patra, Binghamton University-SUNY #665 VIEW ABSTRACT
Modern Electronics Defluxing – Meeting the Low VOC Challenge Naveen Ravindran, M.S.Ch.E., ZESTRON Corporation#666 VIEW ABSTRACT
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MANUFACTURING EXCELLENCE (MFX)
Detailed Study Of Condensate Residues In The Soldering Process - Analysis Of The Responsible Reaction Partners As Well As Reasons For Condensate Polymerization And Growth Of Crystalline Structures Viktoria Rawinski, Rawinski GmbH
#667 VIEW ABSTRACT
Root Cause of Dye Stain Observed on Server Motherboard Sockets BGA Solder Joints and its Impact on Their Solder Joint Quality and Reliability Hemant Shah, Ph.D., Intel Corporation
#668 VIEW ABSTRACT
Thin Foil Printing in Today’s Miniaturized World: Do Printing Rules Change? Chrys Shea, Shea Engineering Services#669 VIEW ABSTRACT
Importancy of Good Design for Cleaning PCBA Vladimir Sitko, PBT Works s.r.o.#670 VIEW ABSTRACT
Validation of Changes and Monitoring Cleaning Process Stability According to J-STD 001H Chapter 8 Vladimir Sitko, PBT Works s.r.o.#671 VIEW ABSTRACT
New Device Validates Printer Accuracy and Squeegee Force Capability During Singular Test Michael Sivigny, CeTaQ Americas#672 VIEW ABSTRACT
Lessons learned with Large and Heavy Copper Boards, a Review of Quality and Productivity Improvements Paul Wilson, Rockwell Automation#673 VIEW ABSTRACT
(SLIR)
SECOND-LEVEL INTERCONNECT RELIABILITY
Effects of Matching Lead-Free Solder Joints Compared to SnPb on BGA Reliability in Thermal Cycling Mohammed Belhadi, Auburn University#750 VIEW ABSTRACT
A Modified Coffin-Manson Methodology for Predicting Solder Joint Life in Eutectic Tin-Lead and Lead-Free Assemblies Jean-Paul Clech, Ph.D., EPSI Inc.#751 VIEW ABSTRACT
A Novel Bismuth and Antimony Containing Lead-Free Solder with Enhanced Thermal Reliability for Automotive and LED Applications Jie Geng, Indium Corporation
#752 VIEW ABSTRACT
Perspectives and Considerations for the Implementation of Pb-Free Solders into Aerospace, Defense, and High Performance Products and Systems Part 1 David Hillman, Collins Aerospace
#753 VIEW ABSTRACT
An Investigation on the Influence of Nickel Contamination of Plated Through Hole (PTH) Solder Joint Integrity David Hillman, Collins Aerospace#754 VIEW ABSTRACT
Reducing Solder Scrap by Replacing Solder Paste with Solder Preforms When Appropriate Mitchell Holtzer, MacDermid Alpha Assembly Solutions#755 VIEW ABSTRACT
SECOND-LEVEL INTERCONNECT RELIABILITY (SLIR)
Reliability of Solder Joints on Flexible Aluminum PC Boards Divyakant Kadiwala, Averatek Corporation#756 VIEW ABSTRACT
Mechanical Characterization of SAC305 and SnPb36Ag2 BGA Assemblies Under Static Flexural Loading Jean-Baptiste Libot, Ph.D., Safran Electronics & Defense#757 VIEW ABSTRACT
Perspectives and Considerations for the Implementation of Pb-Free Solders into Aerospace, Defense, and High Performance Products and Systems Part 2 Anthony Rafanelli, Ph.D., Raytheon Technologies
#758 VIEW ABSTRACT
Low-Temperature Solders SMT Process Optimization for Enhanced Reliability Morgana Ribas, Ph.D., MacDermid Alpha Electronics Solutions#760 VIEW ABSTRACT
SECOND-LEVEL INTERCONNECT RELIABILITY (SLIR)
The Effects of Surface Finish on the Microstructure of TLPS Paste Joints Catherine Shearer, EMD Electronics#761 VIEW ABSTRACT
Role of Conformal Coating and Its Strategies for Tin Whisker Mitigation Preeth Sivakumar, Binghamton University#762 VIEW ABSTRACT
Solderability of Additive Cu Surfaces Rebecca Wheeling, Ph.D., Sandia National Laboratories#763 VIEW ABSTRACT
(SUB)
SUBSTRATES/PCB TECHNOLOGY
Identifying Causes of Wire Bond Pad Metal Lift-Off Failures in ENEPIG Deposits Patrick Valentine, Uyemura USA#850 VIEW ABSTRACT
Microstructure of Weak-Micro-Via and its Failure Prevention Ming-Chun Hsieh, Osaka University#851 VIEW ABSTRACT
Improving Immersion Silver Performance for 5G Applications Denis Jacques, Technic Inc#852 VIEW ABSTRACT
Investigation of Pd-Ge Alloy in ENEPIG Process as Better Barrier Layer Yohei Kaneko, C. Uyemura & Co., Ltd.#853 VIEW ABSTRACT
Varying Requirements, same Inkjet Solder Mask Coating Tool - The case of Inkjet Adaptability by Printing Strategies Bas Le Grand, Luca Gavtero and Don Veri, SUSS MicroTec NL#854 VIEW ABSTRACT
(TI)
TECHNICAL INNOVATIONS
Leveraging CFX-QPL to Integrate Equipment and Create a Smart Factory Ivan Aduna, Koh Young America, Inc.#950 VIEW ABSTRACT
Photonic Soldering Temperature Sensitive Components with High Temperature Solder Alloys Vahid Akhavan, NovaCentrix#951 VIEW ABSTRACT
The Effects of the Cleaning of Populated Circuits Boards on the Performance of Conformal Coating in Thermal Shock Testing Chris Brightwell, Huiseal Europe#952 VIEW ABSTRACT
Getting Real In The Digital World Michael Ford, Aegis Software#953 VIEW ABSTRACT
New IPC-1783 Component Level Authentication (CLA) Standard Michael Ford, Aegis Software#954 VIEW ABSTRACT
TECHNICAL INNOVATIONS (TI)
Aerosol Jet Printed Interconnects For Millimeter-wave Components Bryan Germann, Optomec, Inc.#955 VIEW ABSTRACT
An Automated PCB Design Constraint Extraction and Verification from the SOC Platform Design Collateral Alan Hatfield, Intel Corporation#956 VIEW ABSTRACT
An Investigation into Alternative Methods of Drying Moisture Sensitive Devices in Storage and in Re-Work Applications Dan Jenkins, Steel Camel#957 VIEW ABSTRACT
High Performance Liquid Metal Thermal Interface Materials Ron Lasky, P.E., Ph.D., Indium Corporation#958 VIEW ABSTRACT
GaIn Based Liquid Metals as TIMs: Challenges and Considerations Peter McClure, Universal Instruments’ Advanced Process Laboratory#959 VIEW ABSTRACT
Systems Analysis and Axiomatic Design Using Discrete Event Simulation Zohair Mehkri, Flex#960 VIEW ABSTRACT
TECHNICAL INNOVATIONS (TI)
Liquid Dispensed Thermal Materials – Product Formats, Properties and Manufacturing Sanjay Misra, Henkel Corporation#961 VIEW ABSTRACT
Thermal Interface Material for Advance Electronics Applications Rita Mohanty, Ph.D., Henkel#962 VIEW ABSTRACT
Comparative Study Of Thermal Conductive Adhesive And Die Attach Material For Heatsink Assembly Raghabendra Rout, Binghamton University-SUNY#963 VIEW ABSTRACT
SMT Performance Analytics - Golden Cycle Time and Automated Loss Reason Inference Andrew Scheuerman, Ph.D., Arch Systems#964 VIEW ABSTRACT
A Digital Solution to Manage In-Circuit Testing Zhipeng (Grady) Wang, IBM Corporation#965 VIEW ABSTRACT
(PDC’S)
PROFESSIONAL DEVELOPMENT COURSES
Half day (3.5 hours) educational courses are led by internationally respected professionals with extensive experience in the subject area.
Course instructors deliver focused, in-depth presentations on topics of current importance to the industry, based on their research and industry experience. Professional Development Courses are application oriented and structured to combine field experience with scientific research to solve everyday problems.
All courses will be held from 10:00am-1:30pm US Central
Solder Joint Reliability – Principle and Practice Jennie Hwang, Ph.D., H-Technologies GroupPDC 3 November 15, 2021 | View Course Description
Reliability of Electronics – Role of Intermetallic Compounds Jennie Hwang, Ph.D., H-Technologies GroupPDC 8 November 16, 2021 | View Course Description
Assembly and Reliability of Flip Chip and 6-Side Molded WLCSP John Lau, UnimicronPDC 16 November 18, 2021 | View Course Description
Principles and Practice of Developing Soldering Profiles Ray Prasad, Ray Prasad ConsultancyPDC 17 November 30, 2021 | View Course Description
PROFESSIONAL DEVELOPMENT COURSES (PDC’S)
Ball Grid Array: Design and Assembly of BGAs with Emphasis on Backward Compatibility Ray Prasad, Ray Prasad ConsultancyPDC 18 December 2, 2021 | View Course Description
Design and Assembly Process Challenges for Bottom Termination Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World Ray Prasad, Ray Prasad ConsultancyPDC 19 December 7, 2021 | View Course Description
LTS 101: Manufacturing Process Guidance for Implementation of SnBi Base Low Temperature Soldering for Consumer Products Kok Kwan Tang, Intel CorporationPDC 20 December 9, 2021 | View Course Description
Robotic Soldering Process, Design, Quality Control & Defects – Causes & Cures Bob Willis, bobwillis.co.ukPDC 21 December 14, 2021 | View Course Description
Practical Use of Low Temperature Solder, Assembly, Reflow & Inspection Bob Willis, bobwillis.co.ukPDC 22 December 16, 2021 | View Course Description
Assembly: Best Practices for Improving Manufacturing Productivity - Part 1 Jim Hall and Phil Zarrow, ITM ConsultingPDC 6 January 12, 2022 | View Course Description
PROFESSIONAL DEVELOPMENT COURSES (PDC’S)
Assembly: Best Practices for Improving Manufacturing Productivity - Part 2 Jim Hall and Phil Zarrow, ITM ConsultingPDC 11 January 19, 2022 | View Course Description
Flexible and Rigid Flex Circuit Design Principles Vern Solberg, Solberg Technical ConsultingPDC 1 February 2, 2022 | View Course Description
Cleaning and Cleanliness Quantification Boot Camp Mike Konrad, Aqueous TechnologiesPDC 2 March 2, 2022 | View Course Description
Uncommon Leadership: Developing Influence, Increasing Impact Jason Hunt, Eye Squared LeadershipPDC 13 March 16, 2022 | View Course Description
PCB Design for Implementing 3D and High Density Semiconductor Package Technologies Vern Solberg, Solberg Technical ConsultingPDC 9 March 30, 2022 | View Course Description
PROFESSIONAL DEVELOPMENT COURSES (PDC’S)
Cost Conscious Test Strategies for Electrical Cost Products Robert Hanson, Robert Hanson ConsultingPDC 15 April 6, 2022 | View Course Description
Selection Criteria of Surface Finish for Next Generation PCB Technologies: HDI, High Frequency, RF-Microwave, 5G Kunal Shah, LiloTreePDC 12 April 20, 2022 | View Course Description
Cost Modeling Your Assembly Line or Factory to Reduce Costs and Improve Profitability Ron Lasky, Ph.D., PE., Indium CorporationPDC 4 May 4, 2022 | View Course Description
