2017/H2 Roadmap - advantechfiles.blob.core.windows.net · Certified Memory Modules 2017/H2 Roadmap...
Transcript of 2017/H2 Roadmap - advantechfiles.blob.core.windows.net · Certified Memory Modules 2017/H2 Roadmap...
Certified Memory Modules
2017/H2 Roadmap
PAPS Product Management
Lindsay Chou
2017 DRAM Market Trend The new, higher-speed DDR4 DRAM generation gained significant
market share in 2016, representing 45% of total DRAM sales.
Previously, DDR3 DRAM, including low power versions used in tablets,
smartphones, and notebook PCs, accounted for 84% of total DRAM
sales in 2014 and 76% in 2015, but in 2016, DDR4 price premiums
evaporated and prices fell to nearly the same ASP as DDR3 DRAMs.
A growing number of
microprocessors, like Intel’s
newest 14nm x86 Core
processors, now contain DDR4
controllers and interfaces. As
a result, DDR4 to become the
dominant DRAM generation in
2017 with 58% market share
versus 39% for DDR3
QUALITY RELIABILITY LONGEVITY LIFE-TIME
WARRANTY
Advantech Qualified DIMM
COMPABILITY
AQD Product Feature
PCB 30μ gold finger All AQD DRAM applies IPC-2221,using 30u Golden plated
connector to ensure DRAM’s stability in any given
circumstances
Best Quality Component AQD only use best quality and most durable components for industrial applications. Original IC: Samsung/Micron/Hynix
Rigorous Reliability Tests 100% Module On Board Testing
Shock & Vibration Test
Chamber Test
Functional Test
Minimum 3 years Longevity Stability and longevity for industrial applications
with extensive design-in or requalification requirements.
Warranty Life Cycle Warranty
Design for industrial application
Quality assurance
Long term support
Ideal solution for Transportation ,Energy, Military and Outdoor system
-40~85℃ Wide Temperature
PCB: 30μ gold finger
Industrial 4.0 , Machine Automation Solutions , Power & Energy Solutions Intelligent Video Solutions , Industrial Computers , Transportation Solutions
AQD wide temperature memory module designed for extreme environment. AQD wide temperature module use Anti-sulfur resistor and all of wide temp. products will process rigorous test ensure that all devices can be operated under even the harshest conditions.
Anti-sulfur
AQD Wide Temperature Module
DRAM Module Product Portfolio
General DRAM modules meant to be used as standard products (80% of demands)
Designed to detect and correct single-bit errors that occur during data storage and transmission.
Designed to ensure data integrity at both the device-level and system-level of the server.
Designed for industrial systems in extreme environments, -40°C to 85°C.
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DDR3 Roadmap AQD-DDR3
• DDR3 240PIN 0~70C • 1600Mhz / 1866Mhz • Standard Height / Very Low Profile • 1G/2G/4G/8G • Samsung / Micron / Hynix Chips
AQD-SO-DDR3 • DDR3 204PIN 0~70C • 1600Mhz / 1866Mhz • Standard Height • 1G/2G/4G/8G • Samsung / Micron / Hynix Chips
• DDR3 240PIN 0~70C • 1600Mhz • Standard Height • 2G/4G/8G • Samsung Chips
AQD-DDR3-ECC AQD-SO-DDR3-ECC • DDR3 204PIN 0~70C • 1600Mhz • Standard Height • 4G/8G • Samsung / Micron Chips
AQD-SO-DDR3-Ind. • DDR3 204PIN -40~85C • 1600Mhz Standard Height • 2G/4G/8G • Anti-Sulfur Chip Resistors • Micron Chips
AQD-DDR3-Reg. • DDR3 240PIN 0~70C • 1600Mhz • Standard Height / Very Low Profile • 4G/8G/16G • Samsung Chips
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M/P
Developing Planning Available
DDR4 Roadmap AQD-DDR4
• DDR4 288PIN 0~70C • 2400Mhz • Standard Height • 4G/8G/16G • Samsung / Hynix Chips
AQD-SO-DDR4 • DDR4 260PIN 0~70C • 2400Mhz • Standard Height • 4G/8G/16G • Samsung / Hynix Chips
AQD-DDR4-ECC • DDR4 288PIN 0~70C • 2400Mhz • Standard Height • 4G/8G/16G • Samsung / Hynix Chips
AQD-SO-DDR4-ECC • DDR4 260PIN 0~70C • 2400Mhz • Standard Height • 4G/8G/16G • Samsung / Hynix Chips
AQD-SO-DDR4-Ind. • DDR4 260PIN -40~85C • 2400Mhz Standard Height • 4G/8G • Anti-Sulfur Chip Resistors • Hynix Chips
AQD-DDR4-Reg. • DDR4 288PIN 0~70C • 2133Mhz/2400Mhz • Standard Height / Very Low Profile • 4G/8G/16G • Samsung / Hynix Chips
AQD-DDR4-Reg. • DDR4 288PIN 0~70C • 2666Mhz • Standard Height / Very Low Profile • 8G/16G/32G • Samsung / Hynix Chips
AQD-DDR4-Reg. • DDR4 288PIN 0~70C • 2400Mhz • Standard Height • 32G • Samsung Q3 ’17
Developing Planning Available
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M/P 2018/H1