110117_B4.1.1.7 ZXG10 iTC Product Description_ZTE

ZXG10 iTC Product Description



Version Date Author Approved By Remarks

V8.00 2008-02-12GSM&PCS Planning and System Dept.

Not open to the Third Party

V8.01 2010-02-05GSM&PCS Planning and System Dept.

Not open to the Third Party

ZTE Confidential Proprietary © 2010 ZTE Corporation. All rights reserved. I

© 2010 ZTE Corporation. All rights reserved.

ZTE CONFIDENTIAL: This document contains proprietary information of ZTE and is not to be disclosed or used without the prior written permission of ZTE.

Due to update and improvement of ZTE products and technologies, information in this document is subjected to change without notice.


TABLE OF CONTENTS

1 General Description..................................................................................................11.1 ZTE GSM BSS Family Introduction.............................................................................1

2 Highlights and Main Features..................................................................................22.1 Highlights.................................................................................................................... 22.1.1 All IP Hardware Platform.............................................................................................22.1.2 High Capacity.............................................................................................................22.1.3 Modularized Design....................................................................................................22.1.4 Flexible Access...........................................................................................................22.1.5 Universal Platform.......................................................................................................22.2 Advanced Features.....................................................................................................22.2.1 TC resource shared by multi-BSC..............................................................................22.2.2 Whole network sharing, dynamic distribution of TC resource.....................................32.2.3 1:8 Multiplexing of Ater interface at HR.......................................................................32.2.4 Flexible A.................................................................................................................... 32.2.5 Gb multiplexed in Ater interface..................................................................................32.2.6 TFO............................................................................................................................. 3

3 ZXG10 iTC System Structure....................................................................................43.1 Equipment Overview...................................................................................................43.2 Hardware Structure.....................................................................................................43.3 Software Structure......................................................................................................5

4 ZXG10 iTC Configuration..........................................................................................74.1 Typical Configuration for TC Pool in One rack............................................................74.2 Typical Configuration for TC Pool in Four racks.........................................................74.3 Typical Configuration for Far TC in One rack..............................................................84.4 Typical Configuration for Far TC in Four racks...........................................................9

5 Technical Specification...........................................................................................105.1 Mechanical Dimensions............................................................................................105.2 Weight....................................................................................................................... 105.3 Color......................................................................................................................... 105.4 Power Requirements................................................................................................115.4.1 Overview...................................................................................................................115.4.2 PWRD....................................................................................................................... 115.5 Power Consumption..................................................................................................115.6 Electromagnetic Compatibility(EMC)........................................................................125.7 Environment Requirements......................................................................................135.7.1 Working Environment................................................................................................135.7.2 Storage Environment................................................................................................135.7.3 Transportation...........................................................................................................135.7.4 Anti-Earthquake Level...............................................................................................135.7.5 Noise Level...............................................................................................................135.8 Performance Index....................................................................................................145.9 Others....................................................................................................................... 155.9.1 Redundancy..............................................................................................................155.9.2 Reliability..................................................................................................................15

6 System Interface......................................................................................................166.1 Overview...................................................................................................................166.2 A Interface................................................................................................................166.3 Ater Interface............................................................................................................17

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7 Abbreviations..........................................................................................................18

FIGURES

Figure 1 Outlook of ZXG10 iTC...................................................................................................1Figure 2 ZXG10 iTC Hardware Structure....................................................................................4Figure 3 ZXG10 iTC Software Structure.....................................................................................5Figure 4 One rack configuration of ZXG10 iTC for TC Pool........................................................7Figure 5 Four rack configuration of ZXG10 iTC for TC Pool.......................................................8Figure 6 One rack configuration of ZXG10 iTC for Far TC..........................................................8Figure 7 Three rack configuration of ZXG10 iTC for Far TC.......................................................9Figure 8 External View of ZXG iTC...........................................................................................10Figure 9 External interfaces of ZXG10-iTC...............................................................................16

TABLES

Table 1 Power consumption of ZXG10 iTC..............................................................................11Table 2 Conducted emission suppression of the power port...................................................12Table 3 Whole-system radiated emission suppression............................................................12Table 4 Main performance index of ZXG10 iTC for TC Pool....................................................14Table 5 Abbreviation List.........................................................................................................18

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FIGURES

Figure 1 Outlook of ZXG10 iTC...................................................................................................1Figure 2 ZXG10 iTC Hardware Structure....................................................................................4Figure 3 ZXG10 iTC Software Structure.....................................................................................5Figure 4 One rack configuration of ZXG10 iTC for TC Pool........................................................7Figure 5 Four rack configuration of ZXG10 iTC for TC Pool.......................................................8Figure 6 One rack configuration of ZXG10 iTC for Far TC..........................................................8Figure 7 Three rack configuration of ZXG10 iTC for Far TC.......................................................9Figure 8 External View of ZXG iTC...........................................................................................10Figure 9 External interfaces of ZXG10-iTC...............................................................................15

TABLES

Table 1 Power consumption of ZXG10 iTC..............................................................................11Table 2 Conducted emission suppression of the power port...................................................11Table 3 Whole-system radiated emission suppression............................................................12Table 4 Main performance index of ZXG10 iTC for TC Pool....................................................13

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1 General Description

1.1 ZTE GSM BSS Family Introduction

ZTE GSM BSS family inherits the idea of 3G constructions, designing in all IP hardware

structure, modularized and distributed idea.

ZXG10 iTC is designed especially for high-speed integrated network. All IP hardware

structure, high integration and intelligent design are satisfied with mixed network

management and flat network requirement.

As a powerful TC network element, ZXG10 iTC can be configured as remote TC or TC

Pool (TransCoder Pool). Aggregations of TC channels which support all coding types to

implement dynamically distributed for TC resource in pool within entire network and

realize resource sharing.

Figure 1 Outlook of ZXG10 iTC

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2 Highlights and Main Features

2.1 Highlights

2.1.1 All IP Hardware Platform

ZXG10 iTC uses the same all-IP hardware platform as ZXG10 iBSC. The hardware

platform based on all-IP can easily realize TFO/TrFO functions, IP Ater and IP A

interface for all-IP evolution.

2.1.2 High Capacity

ZXG10 iTC used as TC pool, fully configured with 4 racks supports 68040 traffic

channels in Max.; and used as Far TC, supports 3072TRX with 100%HR. By high

integration and capacity design, equipment dimension is obviously reduced, and power

consumption is also decreased greatly.

2.1.3 Modularized Design

ZXG10 iTC can be flexible configured for modularized design. For different requirement

of capacity, ZXG10 iTC can be configured with dual-shelf, single rack to 4 racks for

convenient capacity expansion in future.

2.1.4 Flexible Access

ZXG10 iTC supports various access standards including E1/T1, STM-1, and FE.

Transmission solution can also be replaced with Microwave, WIMAX, BWA, satellite.

2.1.5 Universal Platform

The All-IP hardware is universal for ZXWN NE, ZXG10 iBSC, ZXWN RNC (WCDMA)

and ZXTR RNC (TD-SCDMA). ZXG10 iTC can be integrated with iBSC co-rack.

2.2 Advanced Features

2.2.1 TC resource shared by multi-BSC

One iTC can support multi-iBSC (up to 16 BSCs) which shares all TC resource.

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2.2.2 Whole network sharing, dynamic distribution of TC resource

iTC system supports whole network sharing for TC resource in all resource shelves. iTC

system can also distribute TC resource dynamically without binding with A interface TS.

Operators can calculate TC capacity by actual traffic requirement rather than distribute

TC resource by semi-permanent connections. Dynamic distribution of TC resource can

reduce 30% resource investment.

2.2.3 1:8 Multiplexing of Ater interface at HR

Ater interface supports 1:8 multiplexing at half rate.

2.2.4 Flexible A

Flexible A supports Disaster Tolerance of MSC (up to 16 MSCs).

2.2.5 Gb multiplexed in Ater interface

Gb data dynamic multiplexed in Ater interface increases utilization ratio of Ater interface

link, saving Gb links resource and decreasing operators’ transmission construction and

lease cost.

Gb data dynamic multiplexed in Ater interface can realize convergence of packet data

and voice data to save link resources.

2.2.6 TFO

TFO （ Tandem Free Operation ） is accomplished after call setting up by in-band

negotiation of two TC to its CODEC. TFO avoids unnecessary voice CODEC

conversion between transmitter and receiver among mobile subscribers to improve the

voice quality.



3 ZXG10 iTC System Structure

3.1 Equipment Overview

ZXG10 iTC is hardware platform based on the same 3G platform as ZXG10 iBSC.

According to the requirement of design, iTC can support various interfaces such as E1

(TDM or IPoverE1), STM-1, FE and is also compatible with SIGTRAN. ZXG10 iTC

System is based on IP switch..

3.2 Hardware Structure

Figure 2 ZXG10 iTC Hardware

Structure

ZXG10 iTC hardware structure consists of the following 5 units:

O&M Unit

O&M Unit controls entire system, supports processing of control protocols/signals and

implements the operation and maintenance function.

Ater Interface Access Unit: FSMU



FSMU offers physical interfaces including Ater E1 、 STM-1 、 FE and their protocol

processing.

IP Switch Unit

FSMU and TC resource are connected by IP switch..

TC Resource Pool

TC Resource Pool is used to realize conversion and rate adaptation between voice code

(such as Enhanced Full rate, Full rate, Half rate, AMR andAMR HR etc.) and PCM 64K

code.

A Interface Unit: AIU

A interface currently mainly uses E1/STM-1, IP-borne signaling to realize SIGTRAN.

3.3 Software Structure

ZXG10 iTC software structure is complicated, supporting multi-BSC access and dynamic

distribution of TC resource. Software structure mainly includes BSP&DRIVERS, OSS,

BRS, PP, SCS, DBS, OMS, SS,TCC,TCSS and TCU.

Figure 3 ZXG10 iTC Software

Structure BSP&Driver: BSP sub-system offers driver for hardware, screen hardware function

and mapping of logical functions to upper software.



OSS: Operation Supporting System, which works between BSP and other sub-

system. Task of OSS includes process communication, file management,

equipment driving, schedule work, etc.

BRS: Bearer Sub-system works based on OSS to offer ATM, IP, TDM bearer

services for service sub-system, signaling sub-system, O&M sub-system. The

function of BRS can be divided as link layer function, network transmission function,

dynamic router function, ATM function, flux-controlling function.

PP: Primary Peripheral sub-system. PP sub-system mainly has five functions: digital

interface management, switch network management, offering system clock,

monitoring environment and power management.

SCS: System Control sub-system, works on OSS and Database sub-system,

responsible for monitoring whole system, downloading software and upgrading

system.

DBS: Database Sub-system, which works on OSS sub-system, responsible for

management of network element and information of services, signaling, protocol.

OMS: Operation and Maintenance Sub-system, which works on DBS and OSS,

manages network elements including BTS and BSC.

SS: Signaling Sub-system, which work on OSS,DBS,BRS, deals with narrow band

No.7 signaling, WB No.7 signaling, calling signaling, IP signaling and network gate

control signaling.

TCC ： TC Control, manages the control panel protocol of Ater A including TC

resource distribution, A interface circuit checking and occupying, Ater interface

circuit application and distribution, controlling accomplishment of connection

process.

TCU：TC User parts in iTC includes conversion among TCU frame data and inner

Ethernet data.

TCSS ：TC Support Sub-system. TCSS supports control panel and user panel to

fulfill whole iTC functions including signaling trace, load control, access control, TC

resource distribution, performance measurement etc.



4 ZXG10 iTC Configuration

ZXG10 iTC has modularized design and distributed management system. Configuration

of iTC is so flexible and has high integration and big capacity; only four racks of ZXG iTC

can support up to 68040 TCHs.

For different functional units, ZXG10 iTC designs corresponding shelves, which are:

BPSN, BUSN, BCSN.

Four typical types of iTC configuration is shown below.

4.1 Typical Configuration for TC Pool in One rack

Application scene: in moderate capacity (0-7560TCH)

Capacity: 7560TCH

Ater: 64E1/1STM-1(1+1 standby)

A interface: 256E1/4 STM-1(1+1 standby)



Figure 4 One rack configuration of

ZXG10 iTC for TC Pool

4.2 Typical Configuration for TC Pool in Four racks

Application scene: in huge capacity (up to 68040TCH)

Capacity: 68040TCH



Figure 5 Four rack configuration of

ZXG10 iTC for TC Pool

4.3 Typical Configuration for Far TC in One rack

Application scene: in moderate capacity (0-8400TCH)

Capacity: 8400TCH





Figure 6 One rack configuration of

ZXG10 iTC for Far TC

4.4 Typical Configuration for Far TC in Four racks

Application scene: in huge capacity (up to 48720TCH, 3072TRX with 100% HR)

Capacity: 48720TCH, 3072TRX with 100% HR





Figure 7 Three rack configuration of

ZXG10 iTC for Far TC



5 Technical Specification

5.1 Mechanical Dimensions

Figure 8 External View of ZXG iTC

Rack dimensions: 2000mm (H)×800mm (D)×600mm (W)

5.2 Weight

The weight of full configuration rack is less than 350Kg.

5.3 Color

Rack Color: Navy Blue



Front Panel Color: Black

5.4 Power Requirements

5.4.1 Overview

Requirement for the primary DC by ZXG10 iTC:

The nominal value of voltage provided by the power equipment in the equipment room is

-48V, with an acceptable range from -57V to -40V.

The noise level in the power voltage should be in compliance with the general technical

specifications of the former MPT.

Power supply has over-current protection and indication.

Grounding resistance: <1 ohm.

5.4.2 PWRD

PWRD is located on top of the rack, and it serves mainly to connect the primary power

supply into the rack, distribute power to the rack, and directly supply power to the

scavenger fans. It is capable of providing over/under -48V alarm and anti-lightening

protection.

5.5 Power Consumption

The power consumption of each machine frame with maximum configuration is shown

below:

Table 1 Power consumption of ZXG10 iTC

No. Machine Frame Name Power Consumption (W)

1 BPSN 450W

2 BUSN 800W

3 BCSN 260W

4 Fan (one rack) 200W

The power consumption of ZXG10 iTC rack is based on the calculation according to the

actual configuration.



5.6 Electromagnetic Compatibility(EMC)

Anti-static capability.

In compliance with Detailed Rules for Network-Access Detection of Mobile Switches, i.e.,

the anti-static capability satisfies the following specifications:

Contact discharging: ±6kV; air discharging: ±8kV.

In full-load working (i.e., ZXG10 iBSC rack is configured to full capacity), the conducted

emission on the power cable conforms to the level-A standard of GB9254-1998, as

shown in Table 2.

Table 2 Conducted emission suppression of the power port

Frequency range Quasi-peak detector Average detector

0.15kHz~500kHz 79 dBuV 66 dBuV

500kHz~30MHz 73 dBuV 60 dBuV

Whole-system radiated emission suppression

In full-load working (i.e., ZXG10 iBSC rack is configured to full capacity), the radiated

emission on the whole system conforms to the level-B standard of GB9254-1998, as

shown in Table 3.

Table 3 Whole-system radiated emission suppression

Frequency range Limits of value (quasi-peak detector)

30MHz~230MHz 30 dBuV/m

230MHz~1000MHz 37 dBuV/m

Whole-system anti-radiation interference

IEC1000-4-3, level 2, 3V/m.

Anti-lightning interference of A/Abis/Gb interface

IEC1000-4-5, level 2, ±500V.

Anti-pulse series interference



The anti-burst interference of the power port. IEC1000-4-4, level 2, ±1kV.

The anti-burst interference of the A/Abis/Gb interface. IEC1000-4-4, level 2, ±500V.

Anti-RF conduction interference

The anti-RF conduction interference of the power port. IEC1000-4-6, level 2, ±3V.

The anti-RF conduction interference of the A/Abis/Gb port. IEC1000-4-6, level 2, ±3V.

5.7 Environment Requirements

5.7.1 Working Environment

1 1. Working temperature

Long-term working temperature: 0°C~40°C.

Short-term working temperature: -5°C~45°C

2 2. Relative humidity

Long-term work relative humidity: 20%~90%.

Short-term work relative humidity: 5%~95%.

5.7.2 Storage Environment

It should be packed and stored indoors.

Temperature: -45°C~70°C

Relative humidity: 10%~90%

5.7.3 Transportation

Load 2K4P/2B2/2C3/2S3/2M3，time of transportation should not exceed 30 days.

5.7.4 Anti-Earthquake Level

For the anti-earthquake level, ZXG10 iTC can withstand Dietmar-Lee 8 levels of

earthquake damage.

5.7.5 Noise Level

Less than 60dB.



5.8 Performance Index

The performance index of ZXG10 iTC is shown in Table 4 and 5.

Table 4 Main performance index of ZXG10 iTC for TC Pool

Capacity Maximum capacity 68040TCH

InterfaceAter interface 448E1/7STM-1(1+1 standby)

A interface 2176E1/34 STM-1(1+1 standby)

functions

AMR Supports

TFO Supports

MSC No. in Flex A 16

BSC No. in Flex Ater 16

PerformanceMTBF value ≥100,000 hours

System restart time <10 minutes

Clocking3rd Level

Support: BITS, Line 8k, GPS

Table 5 main performance index of ZXG10 iTC for Far TC

Capacity Maximum capacity 48720TCH

InterfaceAter interface 320E1/5STM-1(1+1 standby)

A interface 1536E1/24 STM-1(1+1 standby)

functions

AMR Supports

TFO Supports

MSC No. in Flex A 16

BSC No. in Flex Ater 16

PerformanceMTBF value ≥100,000 hours

System restart time <10 minutes

Clocking3rd Level

Support: BITS, Line 8k, GPS



5.9 Others

5.9.1 Redundancy

The modularized design ensures the whole system with high stable performance, and

failure of one module will not cause service interruption.

Furthermore, ZXG10 iTC has taken chipset and components reliability into

consideration, for the key modules ZXG10 iTC uses 1+1 backup and TC resource load

division to maintain the system availability

5.9.2 Reliability

In ZXG10 iTC, the algorithm of system reliability is based on the national military

GJB/Z299B Electronic Equipment Reliability Estimation Manual and US military

handbook MIL-HDBK-217F Electronic Equipment Reliability Estimation.

Under detail calculation and proven by strict environment tests, ZXG10 iTC can ensure

reliability of MTBF is more than 100,000 hours and MTTR is less than 0.5 hour.



6 System Interface

6.1 Overview

The external interfaces of the ZXG10 iTC are shown in Follow

Figure 9 External interfaces of

ZXG10-iTC

In GSM system, TC POOL is mainly equipped with the following physical interfaces:

A interface connected to the MSC；

Ater interface connected to BSC;

SMIPS fore/back ground interface connected to OMM;

6.2 A Interface

A interface is the interface between BSC and MSS/CN, that is between TC and

MSS/CN.



ZXG10 iTC supports E1/T1, STM-1 for A interface.

6.3 Ater Interface

Ater interface is system internal interface between iBSC and TC.

ZXG10 iTC supports E1/T1, STM-1, FE for Ater interface.



7 Abbreviations

Table 5 Abbreviation List

Abbreviations Full names

AIU A Interface UnitA

BCSN Backplane of Circuit Switch Network

BCTC Backplane of ConTrol Center

BPSN Backplane of Packet Switch Network

BRS Barer Sub-system

BSC Base Station Controller

BSS Base Station System

BTS Base Transceiver Station

BUSN Backplane of Universal Switch Network

CMP Service Main Processor

DBS Database Sub-system

DTB Digital Trunk Board

EMC Electro-Magnetic Compatibility

FSMU Far Sub-Multiplexing Unit

MP Main Processor

MSC Mobile services Switching Center

OMC Operation and Maintenance Center

OMP Operation Main Processor

OMS Operating Maintenance Subsystem

OSS Operating & Support Subsystem

PWRD POWeR Distributor

PP Primary Peripheral

PRCBU Pool Resources board Configuration Basal Unit iTC

QoS Quality of Service

SCM System Control Module

SCS System Control Sub-system

SCU System Control Unit

SPB Signaling Process Board

SMIPS Small Interactive Image Processing System

SS Signaling Sub-system

TC TransCoder

TCU TransCoder Unit



TFO Tandem Free Operaton

UIM Universal Interface Module


110117_B4.1.1.7 ZXG10 iTC Product Description_ZTE

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