1 The STAR Pixel Upgrade H. Wieman Heavy Quark Workshop LBNL 1-Nov-2007.
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Transcript of 1 The STAR Pixel Upgrade H. Wieman Heavy Quark Workshop LBNL 1-Nov-2007.
1
The STAR Pixel Upgrade
H. WiemanHeavy Quark WorkshopLBNL1-Nov-2007
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topics
Pixel silicon Readout
STAR telescope tests Mechanical Integration in STAR Pixel mechanical
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Some pixel features
Pointing resolution (13 12GeV/pc) m
Layers Layer 1 at 2.5 cm radiusLayer 2 at 8 cm radius
Pixel size 30 m X 30 m
Hit resolution 8.7 m
Position stability 10 m
Radiation thickness per layer
X/X0 = 0.28%
Beam pipe radiation thickness
X/X0 = 0.14%
Number of pixels 164 M
Integration time (affects pileup) 0.2 ms
Rapid installation and replacement
Reproducible positioning
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Silicon program
IReS/LEPSI IPHC (Strasburg)
M. Winter
C. HuC. ColledaniW. DulinskiA. HimmiA. ShabetaiM. SzelezniakI. Valin
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Grzegorz Deptuch
MIMOSTAR 2/3 technology
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IPHC Functional Sensor Development
Data Processing in RDO and on chip by generation of sensor.
The RDO system design evolves with the sensor generation.
•30 x 30 µm pixels•CMOS technology•Full Reticule = 640 x 640 pixel array
Mimostar 2 => full functionality 1/25 reticule, 1.7 µs integration time (1 frame@50 MHz clk), analog output. (in hand and tested)
All sensor families:
Phase-1 and Ultimate sensors => digital output (in development)
SensorPixels
AnalogSignals ADC /
Disc.CDS
DataSparsification
RDOto
DAQ
Mimostar sensors
Phase-1sensors - 640 us integration time
Ultimate sensors - < 200 us integration time
Leo Greiner
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Phase 1 / Ultimate technology (MIMOSA8/16/22)
forwardbias diode
Discriminator
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IHCP Marc Winter et al
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IHCP Marc Winter et al
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IHCP Marc Winter et al
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IHCP Marc Winter et al
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Silicon summary, development of STAR pixels
Understand MIMOSTAR 3 yield issues Fab Phase 1 based on MIMOSA16/22 technology (digital output,
no zero suppression) Fab Ulitimate based on MIMOSA16/22 and SUZE technology
(digital with zero suppression)
Issues Dead center MIMOSTAR 3
Pursue large area gate oxide hypotheses, change layout Radiation hardness (bulk damage)
Reduce temperature Investigate silicon improvements
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Readout program
LBNL
Leo Greiner
Xiangming SunMichal SzelezniakThorsten StezelbergerChinh VuHoward Matis
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Prototype 3 Sensor Telescope
Our goal was to test functionality of a prototype MIMOSTAR2 detector in the environment at STAR in the 2006-2007 run at STAR. We obtained information on:
Charged particle environment near the interaction region in STAR. Performance of our cluster finding algorithm. Performance of the MIMOSTAR2 sensors. Functionality of our tested interfaces to the other STAR subsystems. Performance of our hardware / firmware as a system. The noise environment in the area in which we expect to put the final PIXEL detector.
Stack of 3 MIMOSTAR2 pixel chips, Chip dimension: 4 mm X 4mm, 128 X 128 pixels
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Telescope Infrastructure at STAR
Magnet Pole Tip
Insertion tube
Electronics Box
Beam Pipe
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On the fly cluster finding first used with MIMOSTAR analog chips
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Telescope DAQ
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Distribution of track angles in Mimostar2 telescope
Xiangming SunMichal Szelezniak
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RDO Board(s)
New motherboard
Two board System – Virtex-5 Development board mated to a new HFT motherboard
Xilinx Virtex-5 Development Board
•Digital I/O LVDS Drivers•4 X >80 MHz ADCs•PMC connectors for SIU•Cypress USB chipset•SODIMM Memory slot•Serial interface•Trigger / Control input
•FF1760 Package•800 – 1200 I/O pins•4.6 – 10.4 Mb block RAM•550 MHz internal clock
Note – This board is designed for development and testing.Not all features will be loadedfor production.
Leo Greiner
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1 m – Low mass twisted pair
3 m - twisted pair
System Design – Physical Layout
Sensors, Ladders, Carriers(interaction point)
LU Protected Regulators,Mass cable termination
RDO Boards DAQ PCs
Magnet Pole Face(Low Rad Area ?)
DAQ Room
PowerSupplies
Platform
30 m
100 m - Fiber optic cables
Leo Greiner
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Data Rates - Parameters
Rates as per Jim Thomas, L = 3 x 1027 for Phase-1, L = 8 x 1027 for Ultimate.
2.5 hits / cluster. 1 kHz average event rate. 10 inner ladders, 30 outer ladders. Factor of 1.6 for event format overhead (can be lowered). No run length encoding.
61.5 6.0
157.0 15.0
R = 2.5 R = 8.0
200 us
640 us
Hits / Sensor at L = 8 x 1027.
IntegrationTime
Radius
Leo Greiner
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Data Rates
Ultimate => 49.7 MB / s raw addresses. => 79.5 MB / s data rate.
Phase–1 => 59.6 MB / s raw addresses => 95.4 MB / s data rate.
The dead-time is primarily limited by the number of externally allocated readout buffers!
Leo Greiner
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Mechanical Program
Eric Anderssen, LBNL engineer working on ATLAS pixels is phasing into our pixel program – full time in January 2008 (carbon composite expert)
Contracted ARES company for analysis on cooling, precision mount design and refinement of ladder stability. Phone meetings weekly First results –
we will need a sub ambient cooling system simplified precision mount
First stage report due in January
Addressing two items: Cylinder modifications for integration of GEMS, IST and Pixels Pixel mechanical design
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Cut Apart Current Cones August 2009
Old East Cone and most of Beams to be reused to support New West Cone
Old West cone refurbished into New East Cone in Berkeley Cut Carbon Elliptical Beams avoiding Al Insert
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Send to BerkeleyKeep at Brookhaven
Eric Anderssen
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Modified East Cone and Install with New West Cylinder
View as Temporary Fix—Should be ACAP (as cheap as possible) Supports end of New West Cone/FGT Replicates Old Beam Pipe Interfaces Includes SSD if required Only for summer ’09 to ‘10
Wholly Machined/Bonded Solution Tooling to locate Buck Plate while bonding is
required…Buck Plate aimed forEasy Swap of replacement
Some Tooling Required…
~1.5m
Eric Anderssen
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Goal—Swap-in Replacement and Install pixels – summer 2010
Should BeSame Length
New East Cone with Cylindrical Shell made from Old West Cone
Swap in by matching Bolted Interface to New West Cone…
ModificationWill Take UpLength…
Include SSD interface On Shell
Eric Anderssen
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ISC fits inside and is supported by the cone
ISC supports IST on outsideISC ISC supports pixel and beam pipe inside
Inner Support Cylinder (ISC)
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Pixel support structure – changes and progress
2.5 cm radius
8 cm radius
Inner layer
Outer layer
End view
ALICE style carbon support beams (green)
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cable bundle
connection type number of pairs allocated pair diameter
Analog power 1 6mm
Digital power 1 6mm
signal 40 .64mm
sync 1 .64mm
clk 1 .64mm
marker 1 .64mm
Jtage (5 conductors) 3 .64mm
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Conceptual mechanical design
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Pixel placement concept
Detector assembly slides in on rails Parallelogram hinges support the two detector halves while sliding Cam and follower controls the opening of the hinges during insertion
and extraction Detector support transfers to kinematic dock when positioned at the
operating locationpixel support hinges
spring loaded cam followers and linear cam
slide rails
sliding carriage
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Hinge analysis
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Two sector patch installation – summer 2010
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Final installation, complete cylinders Aug 2011
End
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yearly dose numbers
Au + Au RHIC II luminosity: 7X1027 1/(cm2 sec) Weeks per year operation: 25 Fraction of up time: 60% radius: 2.5 cm
pion dose: 73 kRad UPC electron dose: 82 kRad Total dose: 155 kRad TLD measured projection: 300 kRad
radius: 8 cm pion dose: 7 kRad UPC electron dose: 2 kRad Total dose: 9 kRad TLD measured projection: 29 kRad
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Grzegorz Deptuch
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MIMOSA8, Yavuz Degerli et al IRes/LEPSI DAPNIA/SEDI