1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED...

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1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1 ladder2 15.86 mm 13.62 mm Pixel chip Pixel chip Michel Morel EP/ED 09/200 32 x 425µ 256 x 50µ Decoupling capacitors 16.8 mm 70.72 mm 70.72 mm Power supplies connector 13.92mm 1000mm Flexible Extender Bonding wires MCM MCM - pilot - GOL - Serializer - Laser drivers - Analogue part Pilot & link drivers Data Controls Clk Note: the drawing is not to scale 50 mm 12mm copper Aluminium Pull up network resistors

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Transcript of 1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED...

Page 1: 1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED 09/2000 32 x 425µ 256 x 50µ Decoupling capacitors 16. 8.

1

CARRIER BUS LAYOUT(a)± 193 mm

ladder1ladder2

15.8

6 m

m

13.62 mm

Pixel chipPixel chip

Michel Morel EP/ED 09/2000

32 x 425µ

256

x 50

µ

Decoupling capacitors

16.8

mm

70.72 mm70.72 mm

Power supplies connector

13

.92

mm

1000mm

Flexible Extender

Bonding wires

MCMMCM- pilot- GOL- Serializer- Laser drivers- Analogue part

Pilot &link drivers

Data

Controls

Clk

Note: the drawing is not to scale

50 mm

12m

m

copperAluminium

Pull upnetworkresistors

Page 2: 1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED 09/2000 32 x 425µ 256 x 50µ Decoupling capacitors 16. 8.

2

CARRIER BUS LAYOUT (b)± 193 mm

ladder1ladder2

70.72 mm70.72 mm

Power supplies connector

1000mm

Flexible Extender

Bonding wires

MCMMCM- pilot- GOL- Serializer- Laser drivers- Analogue part

Data

Controls

Clk

50 mm

12 m

m

Michel Morel EP/ED 09/2000Note: the drawing is not to scale copperAluminium

Pilot &link drivers

RC

12.8

Page 3: 1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED 09/2000 32 x 425µ 256 x 50µ Decoupling capacitors 16. 8.

3

1

2

3

4

5

6

READOUT CHIP

PIXEL DETECTOR

200µ

600µ

13.92mm

AluminiumPolyimide

6 ANALOG_GND 25µ5 ANALOG_POWER 25µ4 VERTICAL LINES 5µ3 HORIZONTAL LINES 10µ2 DIGITAL_POWER 25µ1 DIGITAL_GND 25µ

Via between horizontal and vertical lines

Michel Morel EP/ED 05/00Michel Morel EP/E

CARRIER BUS + DETECTOR AND READOUT CHIPCROSS SECTION (solution A)

BONDIND WIRES

15.86mm

CARBON FIBER SUPPORT

COOLING TUBE

1mm

Note: the drawing is not to scale

Page 4: 1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED 09/2000 32 x 425µ 256 x 50µ Decoupling capacitors 16. 8.

4

1

2

3

4

5

6

READOUT CHIP

PIXEL DETECTOR

AluminiumPolyimide

CARBON FIBER SUPPORT

PIXEL BUS + DETECTOR AND READOUT CHIPCROSS SECTION (solution B)

1 ANALOG_GND 25µ2 ANALOG_ POWER 25µ3 HORIZONTAL LINES 10µ4 VERTICAL LINES 5µ5 DIGITAL_POWER 25µ6 DIGITAL_GND 25µ

1

2

5

6

Glue

COOLING TUBE

11.92mm2mm

0.6

0.2

?

Michel Morel EP/ED 09/2000

PIXEL_BUS

Page 5: 1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED 09/2000 32 x 425µ 256 x 50µ Decoupling capacitors 16. 8.

5

200µ

AluminiumPolyimide Michel Morel EP/ED 09/2000

CARRIER BUS + EXTENDER & MCMCROSS SECTION

Note: the drawing is not to scale CopperGlue

12mm

1.15mm

Carrier bus

MCMPilot & GOL

400µ MCM Carrier

250µ extender

Opt.Link

Opt.Link

Opt.Link

Page 6: 1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED 09/2000 32 x 425µ 256 x 50µ Decoupling capacitors 16. 8.

6

CARRIER BUS CROSS SECTION(solution A)

Glue 5µ

Polyimide 15µ

Aluminium 25µ

Liquid Polyimide 5µ

200µ

Aluminium 10µAluminium 5µ

Michel Morel EP/ED 09/00Michel Morel EP/ED 0

1) Digital ground

2) Digital power supply

3) Horizontal lines4) vertical lines

5) Analogue power

6) Analogue ground

Page 7: 1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED 09/2000 32 x 425µ 256 x 50µ Decoupling capacitors 16. 8.

7

CARRIER BUS CROSS SECTION(solution B)

Glue 5µ

Polyimide 15µ

Aluminium 25µ

Liquid Polyimide 5µ

200µ

Aluminium 10µAluminium 5µ

6) Digital ground

5) Digital power supply

4) Horizontal lines3) vertical lines

2) Analogue power

1) Analogue ground

Page 8: 1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED 09/2000 32 x 425µ 256 x 50µ Decoupling capacitors 16. 8.

8

Copper

Kapton

EXTENDER CROSS SECTION

1 - Analogue GND2 - Analogue Power (3A)3 - Digital GND4 - Digital Power (3A)5 - MCM power

Michel Morel EP/ED 09/00

6 - Detector power

150µ

250µ

12mm

Note: the drawing is not to scale

2mm

1 2 3 4 5 6 65

Page 9: 1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED 09/2000 32 x 425µ 256 x 50µ Decoupling capacitors 16. 8.

9

Bonding wire

Vertical lines

Analogue power

Analogue ground

Pixel_chip

EXAMPLES OF BONDING CONNECTIONS(solution A)

Michel Morel EP/ED 09/00

400µ

Page 10: 1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED 09/2000 32 x 425µ 256 x 50µ Decoupling capacitors 16. 8.

10

Vertical linesAnalogue power

Analogue ground

EXAMPLES OF BONDING CONNECTIONS(solution B)

400µ

digital powerDigital ground

Pixel readout chip

Pixel detector

Michel Morel EP/ED 09/00

Page 11: 1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED 09/2000 32 x 425µ 256 x 50µ Decoupling capacitors 16. 8.

11

CARRIER BUS PROTOTYPE MADE AT CERN

200mm x 17mm4 aluminium layersbus = 81 lines 100µ

Aluminium: 15µKapton: 50µGlue: 10µTotal thickness:300µ

Michel Morel EP/ED 09/00

Page 12: 1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder2 15.86 mm 13.62 mm Pixel chip Michel Morel EP/ED 09/2000 32 x 425µ 256 x 50µ Decoupling capacitors 16. 8.

12

ladder

Pixel_chip

Pilot & Optical link

Extender

carrier bus

Michel Morel EP/ED 09/00

TOP VIEW OF ALICE PIXEL DETECTORONE SECTOR REPRESENTED (SOLUTION A)


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