02072013 Webinar HDI DesignGuide 1 En

8/16/2019 02072013 Webinar HDI DesignGuide 1 En

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Webinar: Design recommendations HDI – HDI Design Guide

Würth Elektronik Circuit Board Technology

www.we-online.de Seite 1 02.07.2013


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Agenda

Nomenclature and definition

Why Microvia technology?

Possibilities

Costs

Route out a BGA



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HDI• High Density Interconnection

Microvia

• Smallest, laser drilled holes

Buried Via• Buried drills on the inner layers

Pitch• Middle of a pad to the middle of a pad


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Number of microvia layers Number of inner layersbetween the microvias

Number of microvia layers

Number of microvia layers Number of inner layers with

buried vias



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Number of inner layersbetween the microvias


Number of inner layers with buried vias


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High reliabilityRoute out thesmallest BGA

pitch


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t

h

h

Basic materialCTEz

Copper thickness t

Aspect Ratio AR= h / IPC-2221/2122

TCT i.d.R -45° / + 125° CSolder process

Expand! 010203040506070

25 50 75 100 125 150 175 200 225 250T [°C]

E x p a n d Z - a x i s

[ µ m ]

Standard-FR4 Z-Achse Cu


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Route out thesmallest BGA

pitch High reliability

Miniaturisationwith ‘Via in Pad’

technology

Cost-effectivegeneration ofhigh wiringdensity

Future-prooftechnology –

components aregetting smaller all

the time


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We will have a…

02.07.2013www.we-online.de Page 9

What's the reason that plated through holes / vias can not be

reduced to any small size?


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Possibilities – Standard Microvias


Standard - Microvia

Pad Ø 300µm

FinalØ 100µm

With 60-70µmdielectric


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Possibilities –Microvias with impedance


Standard - Microvia

Pad Ø 325µm

FinalØ 125µm

- 1 x pressed

- 1 x electroplated

With 85-110µmdielectric


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Possibilities – Staggered Microvias



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- 2 x pressed- 2 x electroplated

- Filling of the microvias and buried vias with epoxy


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Via Filling Process


Copper

FR4

Copper

Drilling

Metallization

Vacuum fillingprocess

Hardening

Polish


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Staggered Microvias

Pitch ≥ 300µm


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- 3 x pressed- 3 x electroplated

- Filling of the Micro- and buriedvias with epoxy


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Possibilities – Staggered Microvias and Buried Vias


Pitch ≥ 400µm

PadØ 550µm


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Possibilities – Staggered Microvias und Buried Vias


- 3 x pressed

- 3 x electroplated

- Filling of the buried vias with epoxy


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Possibilities – Stacked Microvias


Copper filled

Stacked microvia


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Possibilities – Stacked Microvias


- 3 x pressed

- Filling of Buried Vias with epoxy

- Filling of Microvias with epoxy

- 4 x electroplated, metallization of µVias have to be done seperated to the buried vias


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Possibilities – Stacked Microvias on Buried Vias


Stacked Microvia on

Buried Via

Buried Via filled andcapped


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We will have a…


With respect to the manufacturing costs, why is it preferable to use

staggered microvias in comparision with the stacked option?


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Via Filling Process


Copper

FR4

Copper

Drilling

Metallization

Vacuum fillingprocess

Hardening

Polish

Metallization


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Possibilities – Stacked Microvias on Buried Vias


- 3 x pressed

- Filling of Buried Vias with epoxy and capping

- Filling of Microvias with epoxy

- 4 x electroplated


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Complexity

C o s t s

1 + 6 + 1

1.

Microvias 1 to 2

8 to 7PTH 1 to 81 x pressed1 x electroplated1 x laserdrilled1 x mech. drilled

2 + 4 + 22.

1.

Microvias 1 to 2+ 1 to 38 to 68 to 7

PTH 1 to 82 x pressed1 x electroplated1 x laserdrilled1 x mech. drilledMicrovia Filling?

2 + 4 + 22.

1.

Microvias 1 to 22 to 37 to 68 to 7

PTH 1 to 82 x pressed

2 x electroplated2 x laserdrilled1 x mech. drilled

1 + 6b + 1

1.2.

Microvias 1 to 28 to 7

PTH 1 to 8Buried Via 2 to 72 x pressed2 x electroplated1 x laserdrilled2 x mech. drilled

2 + 4(6b) + 22.

1.


PTH 1 to 8Buried Via 2 to 72 x pressed2 x electroplated2 x laserdrilled2 x mech. drilled

2 + 4b + 2

2.1.3.


PTH 1 to 8

Buried Via 3 to 63 x pressed3 x electroplated2 x laserdrilled2 x mech. drilled

Laser drilling

1 to 3

Staggered

Microvias

buried Vias

extraburiedMicrovias

1 x pressed 2 x pressed3 x pressed

100 %

115 %

120 %

142 %

150 %

175 %

90 %

ML08ohneµ-Vías

Costs


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Route out


BGA Pitch 0,8mm

Route out with mech. vias


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Route out


BGA Pitch 0,8mm

Route out with Microvias, Dog bone


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Route out


BGA Pitch 0,8mm

Route out with Via in Pad


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Route out

www.we-online.de Page 29 02.07.2013


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Thank you for your attention!

Dominic BüchWÜRTH ELEKTRONIK GmbH & Co. KGProduct Management

LasercavityCircuit Board TechnologyP.: +49 7622 397 223M.:+49 151 7270 9888E. [email protected]. www.we-online.de

02072013 Webinar HDI DesignGuide 1 En

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