Electroplating Solder Bumping Flip Chip Technology 电镀焊球凸点倒装焊技术.
0001403 对电建施工中焊接、金属专业常用标准某些技术问题的讨论
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Transcript of 0001403 对电建施工中焊接、金属专业常用标准某些技术问题的讨论
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12002(39)
Discusonsometechnicalquestionsinsomestandardsusingin
weldingandmetallographyworkingofpowerinstallation
DL500792DLT50691996DLZT5048
95ASME
DL50071992(
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1996
(DLT50481995
1DL50071992((
(
DL5007)
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101600MW
(DL500792B)
(
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ElectricPowerStandarization&Measurement I2002(39)
86
I
10050
12
1217021
7
7
68
6600MW
(SA335P91)(SA335P22)
()
100RT+100UT+200PT(
)
100UT+30RT
7
122
7023>20mm70mm
24
20mm--70mm
50mm--60rnmDLT50481995
K
50mm
(g)
(2660MW)
BK
>20mm70mm
123
7023(3)70mm20mm100
100
SA335P91600MW
70ram(5585702)
124
7023(4)I
2525
100
-
1100l(39)
25
25RT+25UT
125
7023
(SA213T91SA335P91)
(SA335P91)
126
702
(1)702I
981MPaI
981MPaI
5034MPa
25
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50
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85(3)(4)(5)DL6121996((49
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159mm20ram
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5(150
25
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ElectricPowerStandafization&Measurement '22(39)
300*(2)
300*(2450"C
(4)
DL50111992534(10)
100
DL503119946115
100
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(DL5069)
DLr50691997
21
4431
22
483
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26
TAx
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6mm
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T91(1
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K
X
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T
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(1)
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KTDK
69851189mm635
658ram
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12002(39)
T91
6mm
7Se75
23
7
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35mmSe75y
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Xx80
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24410
10mm
25
3DLT504895
812mm
(m321012mm)
110
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752
14mm9414mm
(3289mm)
932
814mm
GB11345893X40mm
JB47309493
CASKIIA
1JB4730948--14ram
CSKIIA
814(mm)
x4018dB
X4012dB
X404dB
752DL504895932
4
27
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() () ELECTRIC POWER STANDARDIZATION & MEASUREMENT() 2002,11(1)
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