现在的世界 就是一颗一颗芯片 芯片需要封装 所以...

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现在的世界 就是一颗一颗芯片 芯片需要封装 所以 世界正在被一颗一颗的封装. 请随我走入封装世界 成为 封装高手 Puman. Wafer Manufacturing. Front End. Wafer Test. Back End. 封装在 IC 制造产业链中之位置. 探针台测试. 背磨. 氧化. 长 晶. 切 片. 倒 角. 抛 光. 划片. 扩散. 封装. 硅片检测. 成品测试. 光 刻. 沉 积. 刻 蚀. 植 入. C M P. - PowerPoint PPT Presentation

Transcript of 现在的世界 就是一颗一颗芯片 芯片需要封装 所以...

  • Puman

  • ICWafer ManufacturingFront End

    WaferTestBackEnd

    CMP

  • (QFP)Wafer back grindingWafer mountWafer saw & cleanDie attachEpoxy curePlasma cleanWire bondMoldingMarkingPost mold cureDeflash & TrimSolder platingForming&singulationFVIPacking

  • : BT EpoxyPTFEPolyimidecompound UBMPSVAPPESolder maskP.R 95 Pb/5 Sn 37 Pb/63 Sn (,183 )No Lead AllySn 3.9/Ag 0.6/Cu 5.5 ,235 Low- Ally

    : Au bondAlly bond Lead Frame:

    Substrate: (tape) HiTCETM BCBTMTAPE: Blue TapeUV TapeHeat Sink :

  • Polishing machine & CMPUV tape attach machineDicing machineUV irradiation machineTape remover machinePick & Place machinePackage machine(F/T):trim & form

  • DIPDual in-line package80SOPSmall outline package80QFPQuad Flat Package1995~1997TABTape Automated bonding1995~1997COBChip on board1996~1998CSPChip scale package1998~2000Fc Flip-chip1999-2001MCMMulti chip model2000~nowWLCSPWafer level CSP2000~now

  • IC IC,chipsystem.ICICchip sizeICchipchipICDIP DIP(DualInline Package)(IC)100DIPCPUDIPDIP

  • DIP 1.PCB() 2. DIPbody thickness155milPKG thickness: 350milLead width: 18.1milLead pitch: 100milDIPPDIPPlastic DIPCDIPCeramic DIPSPDIPShrink plastic DIP

  • SOP/SOJ 1980SMTSurface Mounting TechnologySMTSOPSmall Out-Line Package/SOJ Small Out-Line J-Lead packageICSOP/SOJ 1. SOP/SOJ is a lead frame based package with "Gull wing "form lead suitable for low pin count devices. 2. Body width ranges from 330 to 496 mils with pitch 50 mils available. 3. Markets include consumer ( audio/ video/ entertainment ), telecom (pagers/ cordless phones), RF, CATV, telemetry, office appliances (fax/copiers/printers/PC peripherals) and automotive industries.

  • SOP (Small Out-Line Package)body thickness:87~106mil PKG thickness:104~118mil Lead width: 16 milLead pitch: 50 mil SOJ ( Small Out-Line J-Lead package)body thickness:100 mil PKG thickness:130~150mil Lead width: 17~20 mil Lead pitch: 50 mil

  • SOP 1.SSOP(Shrink SOP)body thickness70~90 milPKG thickness: 80~110milLead width: 10~15 milLead pitch: 25 mil 2.TSOP(Thin SOP)body thickness1.0 mmPKG thickness: 1.2mmLead width: 0.38~0.52 mmLead pitch: 0.5 mm

  • 3.TSSOP(Thin Shrink SOP)

    body thickness0.90 mmPKG thickness: 1.0mmLead width:0.1~0.2mmLead pitch: 0.4~0.65mm4.TSOP() : Thin SOP 5.TSOP( ) : Thin SOP 6.QSOP : Quarter Size Outline Package7.QVSOP : Quarter Size Very Small Outline Package

  • QFPPFP

    QFPPlastic Quad Flat Package100 256SMDSMD PFPPlastic Flat PackageQFPQFPPFPQFP/PFP 1.SMDPCB 2. 3. 4.

  • QFPPFPbody thickness>2.8 mmPKG thickness: >3.3 mmLead width: 0.18~0.35mmLead pitch: 0.40~1.0 mm

    QFP 1.LQFP(Low profile QFP)body thickness1.4mmPKG thickness: 1.6mmLead width: 0.22~0.37mmLead pitch: 0.40~0.80mm

  • 2.TQFP(Thin QFP): body thickness1.0 mmPKG thickness: 1.2 mmLead width: 0.18~0.37 mmLead pitch: 0.40~0.80 mm

    3.DPH-QFP(Die Pad Heat Sink QFP)body thickness2.8 mmPKG thickness: 3.3 mmLead width: 0.2~0.3 mmLead pitch: 0.5 mm

  • 4.DPH-LQFP(Die-pad Heat Sink Low-profile QFP)body thickness1.4 mmPKG thickness: 1.6 mmLead width: 0.22 mmLead pitch: 0.5 mm

    5.DHS-QFP(Drop-in Heat sink QFP)body thickness1.4 mmPKG thickness: 1.6 mmLead width: 0.22 mmLead pitch: 0.5 mm

  • 6.EDHS-QFP(Exposed Drop-in Heat sink QFP)body thickness>3.2 mmPKG thickness: >3.6 mmLead width: 0.18~0.3 mmLead pitch: 0.4~0.65 mm

    7.E-Pad TQFP(Exposed-Pad TQFP)body thickness1.0 mmPKG thickness: 1.2 mmLead width: 0.22 mmLead pitch: 0.50 mm

  • 8.VFPQFP(Very Fine Pitch QFP)9.S2QFP(Spacer Stacked QFP)11.Stacked E-PAD LQFP

  • 10.MCM-LQFP(Multi-chip module Low-profile QFP)12.PLCC (Plastic Leaded Chip Carrier Package )

  • PGA PGA(Pin Grid Array Package)2-5PGACPU486ZIF(Zero Insertion Force Socket) CPUPGACPU PGA 1. 2.IntelCPU80486PentiumPentium Pro

  • PGA

  • BGA IC100MHzCross TalkIC208 PinQFPBGA(Ball Grid Array Package) BGA 1.I/OQFP 2.BGA 3. 4.

  • BGA:Substrate BGAIC(Wire Bonding)(Tape Automated)(Flip Chip)Area ArrayICBGABGABGA2/3BGABGA BGA: 1.CBGA (Ceramic BGA) 2.PBGA (Plastic BGA) 3.TBGA (Tape BGA) 4.MBGA (Metal BGA)

  • BGA: 1. PBGAPlastic 2-4 2. CBGACeramic FlipChip FC 3. FCBGARigid 4. TBGATape 1-2PCB 5. CDPBGACavity Down Plastic

  • 1. PBGA(Pastic BGA)ball :0.55~0.75mmball count:100~1000ball pitch: 1.0~1.7mmsubstrate Thk:0.56mmbody Thk:1.56~1.73mmPKG Thk:2.16~2.33mm2. LBGA(Low-profile BGA)ball :0.30~0.60mmball count:100~1000ball pitch: 0.8~1.0mmsubstrate Thk:0.36mmbody Thk:0.90mmPKG Thk:1.30~1.60mm

  • 3. LTBGA(Low-profile Tape BGA)ball :0.45mmball count:100~1000ball pitch: 0.80mmsubstrate Thk:0.1mmbody Thk:0.80mmPKG Thk:1.20mm4. TFBGA(Thin & Fine pitch BGA)ball :0.30~0.60mmball count:100~1000ball pitch: 0.50~1.0mmsubstrate Thk:0.36mmbody Thk:0.89mmPKG Thk:1.20~1.60mm

  • 5. TFTBGA(Thin & Fine-pitch Tape BGA)ball :0.40mmball count:100~1000ball pitch: 0.75mmsubstrate Thk:0.10mmbody Thk:0.75mmPKG Thk:1.10mm

    6. EDHSBGA(Exposed Drop-in Heat Sink BGA)ball :0.75mmball count:100~1000ball pitch: 1.27mmsubstrate Thk:0.56mmbody Thk:1.73mmPKG Thk:2.33mm

  • 6. STFBGA(Stacked Thin & Fine-pitch BGA)ball :0.80~1.0mmball count:100~1000ball pitch: 0.40mmsubstrate Thk:0.26mmbody Thk:0.96mmPKG Thk:1.40mm

    7. CDTBGA(Cavity Down Tape BGA)

    ball :0.60~0.75mmball count:100~1000ball pitch: 1.0~1.27mmsubstrate Thk:1.0~1.2mmbody Thk: 1.0~1.2mmPKG Thk:1.60mm

  • 8. L2BGA/EBGA(Laser laminate BGA/Enhanced BGA) Laser laminate BGA/Enhanced BGA are cavity down,thermally enhanced BGA with laminated substrate .They are suitable for solutions for high power dissipation applications(>6w). L2BGA with laser drilled via enhances circuitry EBGA uses BTlaminated with multiple layers at a very competitive cost. Superior electrical performance is achieved by multiple metal layer laminate based construction.ball :0.60~0.75mmball count:100~1000ball pitch: 1.0~1.27mmsubstrate Thk:1.0~1.2mmbody Thk:1.0~1.2mmPKG Thk:1.60mm

  • 9. MCMBGA(Multi-chip Module BGA)ball :0.60~0.75mmball count:100~1000ball pitch: 1.27mmsubstrate Thk:0.56mm body Thk:1.56~1.73mmPKG Thk:2.16~2.33mm 10. FCBGA(Flip Chip BGA)ball :0.60~0.75mmball count:100~2000ball pitch: 1.0~1.27mmsubstrate Thk:1.0~2.0mmbody Thk:3.0mmPKG Thk:3.5mm

  • BGA

    HPBGA(High Performance BGA) chip array BGA

    Tape Array BGA Tape super BGA:Micro BGAViper BGA

  • BGA

  • MCM(Multi Chip Module) 1. 2./ 3.

  • MCM:

  • MCM:

  • SiP ( System in Package ) Semiconductor industry demands for higher levels of integration, lower costs, and a growing awareness of complete system configuration have continued to drive System in Package (SiP) solutions. SiP:

  • CSP(Chip Scale Package) CSP(Chip Size Package)IC1.2ICDie1.4CSP 1.I/O 2. 3. CSP 1.Lead Frame Type() 2. Rigid Interposer Type() 3. Flexible Interposer Type() 4. Wafer Level Package()

  • CSP:Flip Chip Flip Chip( ):1960IBMC4 (Controlled Collapse Chip Connection)I/O pad(wire bonding) (metal bump)(tape-automated bonding) I/O IC(flip chip on boardFCOB)I/OIC(flip chip in packageFCIP)FCOB(direct chip attachmentDCA)

  • CSP:bumping

  • CSPArea array bumping & Peripheral bumping1 Peripheral bumpingbumppadbump bump2 Area array bumping bumppadbump

  • CSPRedistribution Process Result

  • ETCSP Extremely Thin CSP

  • FCCSPChip Scale CSP ball :0.30mm ball count:100~200 ball pitch: 0.75mm substrate Thk:0.5mm body Thk:1.0mm PKG Thk:1.2mmQFNQuad Flat No-leadLead width :0.18~0.30mmLead count:10~200Lead pitch: 0.4~0.8mm body Thk:0.65mmPKG Thk:0.85mm

  • WLCSP(Wafer Level CSP) WLCSP():.:WAFERWAFER BackgrindWAFER monut/SawVisual InspectPick & Place to trayPack & Ship DieWAFER Bumping WAFER Probe Laser Mark SiP/Lead frame/laminate pack shipWAFER monut/Saw

  • CSP

  • :1121 /100%168PCT2150 1000HTSL385 /85%1000RHTHBT41000-55 +125 5130 /85%168

  • PCSOCBGA 60-70%BGABGA