Post on 28-Dec-2015
CIRCUITS WEST
INCORPORATED
World Class Manufacturer of Printed Circuit Boards
Capabilities 1-18 Layer Rigid PCB’s Same day quick-turn delivery
service Ten day standard delivery. Blind & Buried Vias. FR-4 through most exotic
laminates. HASL, Gold, Immersion Tin,
Immersion Silver. Via in pad.
Resources 24/7 Engineering Support ODB++ Compliant DRC & DFM FAE’s for Customer Site Support Online Order Placement ISO 9001:2000 certified ITAR certified
20,000 sq ft Facility
US Manufacturing (up to 100 panels/day) (with high volume agreements with off
shore qualified sources) 410 South Sunset Street Suite D
Longmont, CO 80501 (877) 650-5321 www.circuitswest.com Send RFQs to
sales@circuitswest.com
AOI True Artwork and Circuitry Verification
DrillsUtilize the latest in air bearing spindles, fortrue small hole capability
Inline DES (Develop, Etch, Strip)
Flying ProbeAutomated Electrical Test
Technology RoadmapFacility Tolerance Production Standard Advanced EmergingMaximum Number of Layers 14 16 18 >20Minimum Outer Line Width 0.005 0.005 0.004 0.003Minimum Inner Line Width 0.005 0.005 0.004 0.003Maximum Board Outer Dimension 16.00" X 22.00" 16.50" X 22.50" 21.00" x 24.00" 24.00" x 30.00"
Finished Hole Size 0.008 0.008 0.006 <.006Finished Copper Thickness .5oz - 8oz .0oz - 8oz 10oz 12ozMaximum Drilling Aspect Ration 8:01 10:01 12.5:1 >14:1Impedance Tolerances +/- 10% +/- 10% +/- 8% +/- 6%# Of Lamination Cycles (Blind/Buried) 3 4 6 >7
MaterialsMaterials Available Production Standard Tg DkFR-4 Standard Multifunctional yes yes 140 3.9-4.4
FR-4 High Tg yes yes 170-180 3.9-4.4
Getek yes yes 170 3.9-4.1
Nelco 4000-13 yes yes 180 3.7-3.9
FR-408 yes yes 180 3.7-3.8
Polyimide yes yes 230-260 4.2-4.6
BT Epoxy yes yes 180 3.6-4.1
Teflon yes yesCall for
InformationCall for
InformationFlex and Other Materials yes yes
Call for Information
Call for Information
Typical Process FlowLaminate Receive Flash Route
Inner Layer Imaging Drilling
Develop Etch Strip Deburr / Desmear
AOI Electroless Copper
Inner Layer Stack Imaging
Multilayer Prep Develop
Multilayer Pressing Copper Plate - Tin Plate
AQL Shipping
Etching / Tin Stripping
Final Inspection
Electrical Testing
Final Fab/Route, Score, Bevel
Silkscreen Legend
Final Surface Finish
LPI Solder Mask