SUPER SPEED USB3.0

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Made by :Shirish O.

Bhrade

Guided By :Ms. Dipti Umalkar

INTRODUCTION

• The USB 3.0 Promoter Group announced on November 17, 2008, version 3.0 and submitted to USB-IF

• The first certified USB 3.0 consumer products were announced January 5, 2010

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UNIVERSAL SERIAL BUS

• Designed to allow many peripherals to be connected using a single standardized interface socket.

• Consists of a host, USB ports, and peripheral devices connected in a tiered-star topology

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How Communication

• Endpoint built into device by manufacturer• Endpoint addressable by (device address ,

endpoint number)as specified in packet sent by host

• If data from host to endpoint an OUT packet sent

• If data from device to an IN packet sent by host

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How Communication Established

Device Connected

Enumeration starts by sending reset signal

Data rate of device determined Device Assigned a unique address

If host supports device, driver loaded

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Past----->Present1 USB-IF formed

2 USB 1.0 specification 12 Mbit/s

3 USB 2.0 specification 480 Mbit/s

4 USB 3.0 specification 5 Gbit/s

2010 USB 3.0 devices in market

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WHY USB 3.0

• Popularity• Transfers HD data in short time• Superior than its competitors

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FEATURES

• Dual bus architecture• Cable sructure supporting full duplex

transmission• Connector supporting cable structure • Power • Link level power management• Asynchronous notify

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DUAL BUS ARCHITECTURE• USB 3.0 is a

physical SuperSpeed bus combined in parallel with a physical USB 2.0 bus

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CABLE STRUCTURE

• One power pair• One twisted signal pair for USB 2.0 data path• Two twisted signal pairs for the SuperSpeed

data path.• Supports full duplex mode

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CONNECTOR PINS

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Power

• 50% more power provided(100-150mA)for unconfigured device.• 80%more power provided(500-900mA)for configured device.• Link level power management• Continous device polling eliminated

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SUPER SPEED ARCHITECTURE

Physical layer

Link layer

Protocol layer

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PHYSICAL LAYER

• Physical connection between downstream port and upstream port

• If connected reciever termination enabled• No signalling occurs generates LFPS• 8 bit data scrambled and encoded to 10

bit,sends to link layer• Link layer to physical

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LINK LAYER• Link level power management• Insertion of packet delimiters• Receive and manage packets• Interface between protocol layer

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PROTOCOL LAYER

• End to end communication• Deals with protocols• Reliable delivery

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SUPER SPEED CONNECTION

Device notifies it is connected

Host makes request

Device ready notifies this with ERDY

Else tells host unavailable to process by sending NRDY

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SUPER SPEED TRANSFER• Two channels • No propagation delay• Data bursting• OUT-data packet contains address information• IN-sends packet with sequence number that

host tells

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USB 3.0 vs USB2.0

USB 3.0 USB 2.0• Super speed High speed• Asynchronous notify Polling• Link level power management No such properties• 900 mA power 500 mA• Full duplex Half duplex

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ADVANTAGES

• Super speed• Power efficiency• Efficient when compared to its competitors• Backward compatibility

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DRAWBACK

• Intel at present not supporting• Cable length limited to 3m

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FUTURE

• Twisted pair cable replaced by optical fibre

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CONCLUSION

• USB 3.0 wil also be popular like earlier versions.

• Will replaces firewire etc• As it is backward compatible it will be used in

the new computers and devices

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QUESTIONS??

THANK YOU

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