Top QFN and BGA rework challenges

6 Top Rework Challenges of BTC and BGA Packageswww.solder.netinfo@solder.net

Rework TechniqueIPC 7711 3.11

Step #1

Align and apply stencil to device. Roll solder paste through apertures.

Part Bumping Using a PolyimidePeel-n-Stick Stencil(s)IPC 7711 5.8.1.2.

Step #2

Reflow per solder mfr’s profile recommendations

Part Bumping Using a PolyimidePeel-n-Stick Stencil(s)

Step #3

Remove stencil and clean. Surface now is “bumped”

Inspection of “bumped” device

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BGA Rework-Pad Damage #2

BGA Rework-Pad Damage

BGA Rework-Pad Repair

BGA Rework-Mask Damage #3

BGA Rework-Mask Damage

BGA Rework-Mask Repair

BGA Rework-Warped BGA #4

BGA Rework-Warped BGA

BGA Rework-Warped PCB

BGA Rework-How to Mitigate Warpage

BGA Rework-MSD Handling #5

BGA Rework-MSD Handling

BGA Rework-A Primer

BGA Rework-Shielding #6

BGA Rework-Shielding

Cap Discoloration

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Top QFN and BGA rework challenges

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Transcript of Top QFN and BGA rework challenges

BGA-QFP Rework Systems

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LED, BGA, and QFN assembly and inspection case studies

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BGA & CSP Rework System - Mouser Electronics - … · BGA & CSP Rework System BGA-3590 Series CSP-3500 Series USER GUIDE Precision Systems for the Electronics Bench P/N 7000-1251,

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The most powerful BGA rework sy - 烙鐵無鉛焊台 ... · R The most powerful BGA rework system BGA Engine MaFi-710... Desoldering a BGA or CSP... Removing old solder and residue...