Subtitle or main author’s name Materials of Engineering Lecture 1 - Introduction to MS&E -...

Subtitle or main author’s name

Materials of EngineeringMaterials of EngineeringLecture 1Lecture 1

- - Introduction Introduction to MS&Eto MS&E - -

Engineering 45Engineering 45

Carlos Casillas, PE 19-Jan-12Licensed Chemical Engineer Spring 2012CCasillas@ChabotCollege.edu Hayward, CA

Engineering 45- Materials of Engineering Carlos Casillas, PE CCasillas@ChabotCollege.edu E45_Sp12_Lec01_Introduction2

Engr 45 - Materials of Engineering

• Course No: Engineering 45• Instructor: Mr. Casillas• Email: ccasillas@chabotcollege.edu• Lecture No: 1• Lecture Title: Chp1: Introduction to MS&E• Date: 19-Jan-12

Lecture Notes

Engineering 45Engineering 45 Materials of Materials of EngineeringEngineering - Outline -

• R1: Background

• Roll Call

• Course Syllabus– Goals– Labs, Field Trips– VSME

• R2: Course Overview – Materials Science & Engineering

• Next Week: Chp 2: Atomic Structure & Bonding

– C&R Chp 3: Structure of Crystalline Solids

Instructor’s Background

School Major Degree Year

Engineering A. A. 1981

B. S. 1983

M. S. 1985

Certificate Year

Engineer-in-Training (EIT) 1983

Licensed Professional Engineer (PE), State of CA 1996

Summer Internship Year

Dow Chemical Co. 1982

Mobil Chemical Co. 1983

Chemical Engineering

Stanford University

General Engineering

Jr. Engineer

Summer Engineer

Chemical Engineering

Position

Instructor’s Background, con’t

Employer#

PeopleIndustry Position

# Years

70 Nanotechnology StartupProcess Engineer/ Materials Scientist

>8,000 Magnetic Data StorageManufacturing Engineer, Thin-Film Head Process

Novellus Systems, Inc. >5,000Semiconductor Process Equipment Manufacturer

Process Engineer 4

60Polymer Membrane Separations Startup

Research Engineer ~5

Watkins-Johnson Co. >2,000Semiconductor Process Equipment Manufacturer

Process Engineer/ Member of Technical Staff

>8,000Semiconductor Manufacturer

Project Engineer ~1

30LED Manufacturer

StartupProcess Engineer 1.5

(Engr-45 day-1 roll-call/class distribution)

Welcome to the Wide World of MS&E!

• ALL of Engineering is impacted by Materials!

Instructor’s Background, con’t

Some items for show and tell (later on):Nanostructured Materials

Au Nanoparticles, Si Nanowires (Gecko effect)

II-VI Nanocrystals (Fluorescent), Flat-Panel LCDs

Flash-Memory (Nano), Nano-TransistorNano-Aerogels (JPL/NASA)

Semiconductor Thin Film – Si, III-VMagnetic Data Storage, Thin-Film R/W Head, HDDAdvanced Thermal Insulators & Conductors

Cu Heat Pins – PECVD Al ShowerheadSpecialty Ceramics, Ferromagnetic Fluids

Polymer Membranes Gas SeparationSpiral-wound, hollow-fiber modules

Smart Materials – Shape Memory NiTinol Wire

Engr 45 Course Logistics- Syllabus Review

• Text:• “Materials Science and Engineering

–An Introduction” 8th Edition, William D. Callister and David G. Rethwisch, John Wiley & Sons (2010)

• PreReq’s:• Chemistry 1A• Physics 4A• Engineering 25

• 3.0 Units:• 2-hr Lec (Th 1-2:50pm), Rm 3902• 3-hr Lab/Field Trip (M 4:30-7:20pm),

Rm 1612• Lab teams 2-3 students, switch teams

every two labs, switch roles every lab

Engr 45 Course Syllabus Review, con’t

• Lecture notes, homework solutions, etc will be sent by email and posted at the Chabot Engineering webpage: http://www.chabotcollege.edu/faculty/bmayer/

• Communication will be mainly by e-mail, through the CLPCCD GroupWise/Novell Web Access e-mail system.

• Office hours will preferably be right after lecture or lab. Other times can also be arranged if needed.

Syllabus Review, con’t

• Grading - Weight Function & Policy *Class/ Field Trip Participation

MiniQuizzes 3%Labs/ Field Trip Reports

HW Assignments 16.5%MidTerm Exam-1 21%MidTerm Exam-2 21%Final Exam 23%

• Exams: During class, dates shown in schedule in Syllabus

• Open-text & single, hand-written SRS allowed, TB turned in

• Academic honesty is expected (assigned seating)

90%-100% A- to A+80%-89.99% B- to B+70%-79.99% C- to C+60%-69.99% D- to D+<60% F

* Instructor reserves prerogative to adjust based solely on his professional judgment of class performance

Engr-45 Lecture Tentative ScheduleMtg Day Date Textbook Reading Assignment

1 R2 19-Jan-12 Chp1: Intro to Materials2 MLb 23-Jan-12 Chp2: Atomic Bonding; Chp3 p-1: Xtal Structure3 R1, R2 26-Jan-12 Chp3 p-2: Crystallography; Ch4-4.9-4.11 Microscopy5 R1, R2 2-Feb-12 Chp4: Solid Imperfections7 R1, R2 9-Feb-12 Chp5: Diffusion9 R1, R2 16-Feb-12 Chp18: Electrical Properties; Metals, Semiconductors

10 R1, R2 23-Feb-12 Chp18: Dielectric Properties; Chp19: Thermal properties12 R1, R2 1-Mar-12 Chp20: Magnetic Properties; Chp21: Optical Properties14 R1, R2 8-Mar-12 Chp6: Metal Mechanical Properties - 1 & 216 R1, R2 15-Mar-12 Chp6: Metal Mech Props - 3; Chp7: Dislocations & Strengthening - 118 R1, R2 22-Mar-12 Chp7: Dislocations & Strengthening - 2; Chp8: Mech Failure - Fracture20 R1, R2 29-Mar-12 Chp8: Mech Failure - Fatigue/Creep; Chp9: Phase Diagrams - 122 R1, R2 5-Apr-12 Chp9: Phase Diagrams - 2; Chp10: Phase Xforms - 124 R1, R2 19-Apr-12 Chp10: Phase Xforms - 2; Chp11: Metals Applications - 128 R1, R2 3-May-12 Chp11: Metals Applications - 2; Chp12: Ceramics30 R1, R2 10-May-12 Chp13: Ceramic Applications; Chp14: Polymers32 R1, R2 17-May-12 Chp15: Polymer Applications; Chp16: Composites

Note: Read Chapter Assignments BEFORE class

• HW Assignments are due at the beginning of class on due date in Syllabus

• Lowest-score two HWs will be thrown out. All problems will be graded.

Engr-45 Labs & Field Trips Tentative Schedule

Mtg Day Date Lab Reading & Field Trip Assignments

4 MLb 30-Jan-12 Lab1: Metallurgical Microscope 6 MLb 6-Feb-12 Lab-L2: Prep for R(T) Lab at SJSU8 MLb 13-Feb-12 FT1: Tour of GE Nuclear (Reactor Training Center SJ)

11 MLb 27-Feb-12 Lab2: Electrical Resistivity (Rm 1616 or 1612)

15 MLb 12-Mar-12 Lab3: Thermal Specific Heat (Rm 1616 or 1612)

17 MLb 19-Mar-12 FT2: @SJSU - MATE-153 SJSU-L619 MLb 26-Mar-12 FT3: Lab Tour at Testing Engineers, Inc. 21 MLb 2-Apr-12 Lab4: Mech Properties - Brinell Hardness23 MLb 16-Apr-12 FT4: Lab Tour at Anamet, Inc.25 MLb 23-Apr-12 Lab5: Composite Beam, Pure Material27 MLb 30-Apr-12 FT5: Tour of Union Sanitation Treatment Plant29 MLb 7-May-12 FT6: Tour of ThermoFusion Heat Treating31 MLb 14-May-12 Lab6: Composite Beam, Sandwich Material

Note: Read Lab Assignments and Research the FT Organization BEFORE the dates shown• Sixth Lab Report and Sixth Field Trip Report are both extra-credit

• Attendance to all Labs and Field Trips is mandatory

• Understand the fundamental concept of Materials Science & Engineering:

– “There is a direct relationship between a material’s synthesis & processing (post-manufacture), and its internal microstructure and observable physical properties and engineering performance”

Engr-45 Course Goals

• Materials are ENGINEERED Structures• NOT Black Boxes

• Class Q: Materials Engineering & Technology → What is it?

• Investigating the Structures & Properties of Materials and Correlating these with the Design or Engineering or Technology Objectives

Basic Material Structure Has Many Dimensions

Structural Feature Dimension (m)Atomic Bonding <10-10

Missing/Extra Atoms 10-10

Crystals (Ordered Atoms) 10-10 - 10-1

Second Phase Particles 10-8 - 10-4

Crystal Texturing >10-6

Classes of MaterialsClasses of Materials

• From Chem1A Recall The Periodic Table of Elements

Metals

CeramicsPolymersSemiConductors

MetalsMetals

• May be Pure or Compounds (Alloys)– Along with Polymers The Most Common

Everyday Material– Typically from the 1st Row of Transition Metals in

Periodic Table (Fe, Cu, Ni, etc.)– Have LARGE Numbers of NonBound Electrons

• Makes them Good Electrical & Thermal CONDUCTORS

– Strong but Deformable (Ductile)

Ceramics cont.Ceramics cont.

• Some Typical Properties– HARD & BRITTLE– HIGHEST Temperature Resistance

• Thoria (Thorium Oxide) Max Temp 3000 K

– Llttle Temperature-SHOCK Resistance – Corrosion Resistant– Electrically Resistive (Insulative)– Difficult to Join

• Do Not Weld

Ceramics cont.Ceramics cont.

• Some Typical Properties– HARD & BRITTLE– HIGHEST Temperature Resistance

• Thoria (Thorium Oxide) Max Temp 3000 K

– Llttle Temperature-SHOCK Resistance – Corrosion Resistant– Electrically Resistive (Insulative)– Difficult to Join

• Do Not Weld

Polymers cont.Polymers cont.

• Some Typical Properties– Very LightWeight– Very Corrosion Resistant

• Best of ANY Class of Material

– Little, if any, Hi/Lo Temperature Resistance– Little Structural Strength– Very Deformable (ductile/flexible)– Lowest $-Cost:Volume Ratio for Any

Class of Material

SemiConductorsSemiConductors

• May be made CONDUCTIVE or INSULATIVE (or Something in-between) by the Addition of Miniscule Amounts of IMPURITIES– Current Techniques Allow Precise Control

over the AMOUNT and LOCATION of the Impurities

• Semiconductors are Very Important Electronic Device Materials

Semiconductors cont.Semiconductors cont.

• Most SOLID STATE (no moving parts) Electronic Devices are Semiconductors

• Major applications for Semi Transistors– Voltage Amplifiers– On/Off switches

• Additional Advantage: Semiconductor Electronic Devices can be constructed at Extremely SMALL Scales

• SILICON is the Most Widely Used

CompositesComposites

• Materials that Consist of More than One Material Type– Goal is to Combine the Best

Features of Multiple Materials• Some Examples

– FiberGlass = Glass (ceramic) + Polymer• Strength + Flexibilty

– ReInforced Concrete = Steel + Concrete• Tension-Strength +

Compression-Strength

BioMaterialsBioMaterials

• Defined as Those Materials Which Are compatible with Human Tissue– Classic Example = Stainless Steels

used For Bone repair (Screws, Staples, Plates, Hip-Joints)

• At least a few of ALL other Classes of Materials are BioCompatible– Including Silicon

Smart MaterialsSmart Materials

• Smart Materials Materials That Can Sense Changes in the Environment and Respond with a Material Shape/Property Change– Example: "smart" materials that can be

attached to, or embedded in, structural systems • enable the structure to sense disturbances,

process the information and through commands to actuators, to accomplish some beneficial reaction

CeramicsCeramics

• Basic Composition is the MINERAL Form of a Metal– Very Few Metals Exist in

PURE Form in Nature• Most That Do are Very Rare, e.g., Gold

• Ceramics are Compounds of Metals and– Oxygen → Oxides (most Ceramics)– Carbon → Carbides– Nitrogen → Nitrides

Basic Material Properties

General

Weight: Density , kg/m3

Expense: Cost/kg Cm, $/kg

Mechanical

Stiffness: Young’s modulus E, GPa

Strength: Elastic limit y , MPa

Fracture strength: Tensile strength ts , MPa

Brittleness: Fracture toughness KIc , MPa·m1/2

Thermal

Expansion: Expansion coeff. , 1/K

Conduction: Thermal conductivity , W/m·K

Specific Heat (Capacity), cp or cv, J/kg·K

Electrical

Conductor? Insulator? Conductivity σ, S/m

Dielectric Capacity, F/m

Young’s modulus, E

Elastic limit, y

Strain

Ductile materials

Brittle materials

Young’s modulus, E

Tensile (fracture) strength, ts

Strain

Thermal expansion

Expansion coefficient,

Temperature, T

xT1 To

Q joules/secArea A

Thermal conduction

Mechanical properties

Thermal conductivity,

(T1 -T0)/x

Material Properties

Mechanical load deformation, stress, strain

“structural matls” modulus/stiffness, strength, toughness

Envt./Chemical chemicals, temp (aqueous solution)

corrosion passivity, pollution

Electrical electrical field conductivity “electronic matl.s” semiconductors, resistivity, dielectric

Magnetic magnetic field magnetism magnets, hysteresis, moments

Thermal heat conductivity heat capacity, thermal expansion

Optical radiation (em, light)

color, transparency

index of refraction, reflectivity

Property Stimulus Result Terms

• Material performance depends on material properties

Material Properties

• Density (g/cm3)

Mechanical Properties, con’t

• Tensile Strength (MPa)

• Stiffness or Elastic Modulus E (GPa)

• Fracture Toughness [MPa*(m)E0.5]

Electrical Properties

• Conductivity (1/Ohm-m)

Electrical Properties

Increase resistivity of Cu

• by adding impurities • by mechanical deformation

Processing Structure Properties (con’t)

• PROPERTIES depend on STRUCTURE – e.g.; The HARDNESS vs STRUCTURE of Steel

Cooling Rate (C/s)

0.01 0.1 1 10 100 1000

30m(c)

Ferrite +Cementite

G10380 +w/ Pearlite

TemperedMartensite

UNtemperedMartensite

PROCESSING can change STRUCTURE– e.g., STRUCTURE

vs Cooling-Rate for Steel

Processing Structure Properties

• Recrystallization

Strength versus Structure of Brass

and changes in microstructure

• Thermal Properties

• low from ceramic oxide (structure and conduction properties)• changes due to alloying in metals (even though same structure)

Processing Structure Properties (con’t)

• Optical Properties

Effect of Temperature

Course Goals, con’t

• Materials are ENGINEERED Structures• NOT Black Boxes

Subtitle or main author’s name Materials of Engineering Lecture 1 - Introduction to MS&E -...

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