Individuals, driven to exceedMarket demands….The New…

COBRA Culture !!

SMT Assemblies Why Solder Paste Inspection?

The majority of SMT defects occurs during the solder paste printing process. According to data from SMTA (The Surface Mount Technology Association), 74% of defects in PCB manufacturing process are related to solder paste.

Assembly Process Defect Chart

Why??Is Printing so Important

1. Production must be more FLEXIBLE.

2. Mixed technologies, on the same board.

3. Limited space, Assembly density 4. Budget reductions

5. Quality demand6. No rework permitted

Processes continue to be challenged

If that werent enough…….

Miniaturization

The concept is

clear….The SMT

printer Process needs

excellent Mechanical

Seal and Paste

Release!!!

2013 Q1Intelectual

Property filed in Mexico

2013 Q1File USA Patent for COBRA

2010 Q4Project outlined

2012 Q1Cobra HD Released

2012 Q2Initial Sales efforts

2012 Q3Revised Process to focus on Adhesion Properties

2013 Q1Cobra “TX” Developed

2013 Q2NEW

Development

2011 Q2Registered LOGO

2013 Q1 InterLatin Recieves Award

CONACYT- Estimulos a La INOVACIONInnovation Project-COBRA

COBRA 3.0 y TX

Since Q32013 Sales Started

• ALL TopLINE Nanos, “Cobra HD” vs “COBRA 3.0 y TX”– Sensative to stencil wash– Wearing of the “COATING”– Aplication type “Coating”– On time Delivery– Componentes– “Nano” waste management– Outperforms any Nano, Eform, Ni stencil

– COBRA will Last the life of the Stencil!!!!

Out Perfo

rms !!

Product Comparison

Guaranteed !!

REX Customer

“COBRA, BGA “.35”, AR .49, Paste type 3 mesh,Over 17000 assemblies, zero fail.Mechanical or Electrical.”

Customer Feedback

NEW Cobra SS

Standard SS Stencil

GDL Site Increased ICT Yield 60% to 75%. Excellent paste release After Introdcing COBRA

GDL Site We compared COBRA with E-Fab stencil. COBRA had a

better release of solder paste,we reduced problems in our printing process

Customer Feedback

Automotive Customer Requirement: Use Eform Std as minimum requirmentsThey had 3D SPI inline

Volume MeasurementsCpK >/= 1.6

Std Dev </= 816 mil pitch QFP

EFab

COBRA 3.0

This denotes an effect caused by the USC while using EF but did not affect COBRA print quality

The SPC sine wave is representative only

Final results: Efab 100% of established SPI volume

Cpk: 1.56Std Dev= 11

COBRA 115% Volume compared to EfabCpK: 2

Std Dev= 6

Note: NOT even the underscreen cleaners elements interfered with the COBRA print quality

Customer Feedback

We further Challenged COBRA

We Needed to Push COBRA….here is our story

Note: We have more customer feedback

What we Did, June 2014

• Created a test vehicle, representing current assembly challenges, for our customers

• Setup an SMT printer, Fully automated• Programmed Solder Paste Inspection system,

fully automated• Made one common stencil design, IAW

industry standards…..NO special designs

We further Challenged COBRA

We further Challenged COBRA

Call us for the detailed results

+52 1 899 163 84331-915 298 5452JV@Interlatin.com.mxDirector COBRA Developement

• Reduction in Cost– Lasts the Life of the Stencil– Helps reduce Consumible

consumption• Improves AR Performance

– More productivity• Stencil Life Warranty

– COBRA will NOT come off, Under Standard SMT Process Practices

• Improved OTD– Made in Local sites

• Local design Support….over 20 years

• Local Eng Printing Support…..over 20 years

• We will work with all customers to support their process.

Conclusions

COBRA CSG

We will Continue to Challenge COBRAThank youGracias

Merci

Obrigado

Danke

Lets discuss how we can show you the COBRA performance….

BECOME PART OF THE NEW

“COBRA CULTURE”