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Six-Core AMD Opteron™ Processor with AMD Chipset Announcement | Sept 2009EMBARGOED UNTIL September 21st at 12:01 a.m. EST
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Six-Core AMD Opteron™ Processor with AMD Chipset Platform
• Unified server platforms with AMD on AMD – benefits of processor + chipset
• Enhanced platforms with chipset choices and key technologies
Ultra power efficient platform designed for cloud and dense deployments (using AMD Opteron™ EE processor and S5650 chipset)
First 4P x86 Platform with PCI Express® 2.0 for HPC applications
Three chipset solutions to optimize workloads
• Extends AMD Virtualization™ (AMD-V™) technology and AMD-P suite of features
• Wide availability from ODMs; OEMs are expected to introduce new chipsets as part of AMD’s 2010 processor lineup
SR56x0I/O Hub
SR56x0I/O Hub
AMD-V™AMD-V™
SP5100South Bridge
Six-Core AMD Opteron™ Processor with AMD Chipset Announcement | Sept 2009EMBARGOED UNTIL September 21st at 12:01 a.m. EST
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Range and flexibilityof chipsets
(from high bandwidth to power efficient)
to meet the demandsof your workloads
Power efficiency beyond the processor
Key Benefits
Choice ofChipsets
Exceptional Virtualization capabilities
Only 4P x86 solution with Tagged TLB, RVI and I/O Virtualization
Increased performance and
throughput
(up to 2x for PCI Express® 2.0 vs. PCI
Express® 1.0)
Benefits
KeyTechnologies
Consistent Feature Set
AMD-P
AMD-V™
PCI Express® 2.0
HyperTransport™ 3.0 Technology
SR5690 SR5650SR5670
Six-Core AMD Opteron™ Processor with AMD Chipset Announcement | Sept 2009EMBARGOED UNTIL September 21st at 12:01 a.m. EST
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TYAN S8208: Energy Efficient Server Platform
TYAN S8208 Overview
AMD and TYAN CollaborationTYAN S8208 = Six-Core AMD
Opteron™ EE + new AMD SR5650 & SP5100 server chipset
Ultra power efficient twin form-factor platform
designed for cloud and density deployments
Energy Efficient• Designed for the
Cloud
• Optimized for HE& EE
• Energy Efficient AMD Chipset
• AMD-P Technology
• Platform-level power management support
• Expected Nov. 09
Six-Core AMD Opteron™ Processor with AMD Chipset Announcement | Sept 2009EMBARGOED UNTIL September 21st at 12:01 a.m. EST
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HPC University Implementation with PRACE
Customer: Swedish National Infrastructure for
Computing (SNIC), Royal Institute of Technology (KTH), Sweden, jointly with the Partnership for Advanced Computing in Europe (PRACE)
Need: A general purpose HPC cluster for energy efficiency and compute density using standard components
Buying Criteria: Superior performance/watt/density and ability
to control energy consumption depending on workload and performance based on flop/s and GB/s
x86 Platform Latest technology chipset supporting PCI
Express® 2.0
Collaborative effort between Supermicro UK office and AMD
AMD product: Six-Core AMD Opteron™ HE processor with new AMD SR5670 chipset using HyperTransport™ 3 technology and HT assist
Infrastructure: SuperMicro Highly dense 7U enclosure (with
10x 4P Blade Model) BHQIE QDR Switch incorporated inside the blade
enclosure Management per node including KVM/IP Redundant PSU’s capable of operating at ultra
high power efficiency
Quantity: 720 processors; 4320 cores
Challenge Solution
Six-Core AMD Opteron™ Processor with AMD Chipset Announcement | Sept 2009EMBARGOED UNTIL September 21st at 12:01 a.m. EST
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OTOY and AMD Fusion Render Cloud
Customer: OTOY
Need: The ability to deliver large scale computational power to service the needs of many end users who rely on central computing in lieu of graphics cards in their own devices.
Buying Criteria: • FLOP/S capabilities in a small server
form factor• PCI Express® 2.0 chipset to drive high
end graphics• Maximum number of GPU's in a single
server• Highly dense solution of servers and
GPU's
AMD product: Six-Core AMD Opteron™ processor with Dual AMD 5690 chipsets and 4 AMD FireStream™ cards per node
Infrastructure: : Supermicro 2P with dual 5690’s and 2 HyperTransport™ technology links per socket
Quantity: 5 Racks; 120 nodes; 240 CPU’s and 480 GPU’s
Challenge Solution
Six-Core AMD Opteron™ Processor with AMD Chipset Announcement | Sept 2009EMBARGOED UNTIL September 21st at 12:01 a.m. EST
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Tyan Planned Availability
Form FactorOptimal
Usage ModelPlanned
AvailabilityBarebone
Model
1U Dense Infrastructure/ SMB Sept 2009 GT24 B8212
1U Web/cloud Oct 2009 GT14 B8005
1U Web/cloud Nov 2009 YR190 B8208
Form FactorOptimal
Usage ModelPlanned
AvailabilityMotherboard
Model
MEB Dense Infrastructure/ SMB Sept 2009 S8212
ATX Web/cloud Oct 2009 S8005
Custom Web/cloud Nov 2009 S8208
Six-Core AMD Opteron™ Processor with AMD Chipset Announcement | Sept 2009EMBARGOED UNTIL September 21st at 12:01 a.m. EST
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Supermicro Planned Availability
Form FactorOptimal
Usage ModelPlanned
AvailabilityBarebone
Model
2U Expandable Infrastructure Sept 2009 AS-2021A-32 R+F+
Blade HPC /dense environments Sept 2009 SBA-7141i-T
4URendering/ Technical
computingOct 2009 AS-4021GA-62R+F
1UHPC / Database /Virtualization
Oct 2009 AS-1041A-T2F
Form FactorOptimal
Usage ModelPlanned
AvailabilityMotherboard
Models
EATXExpandable Infrastructure Sept 2009 H8DI3+/i+
EATX Rendering/ Technical computing
Oct 2009 H8DA6+/i+
SWTX HPC / Database /Virtualization
Oct 2009 H8QI6/i(+)
Six-Core AMD Opteron™ Processor with AMD Chipset Announcement | Sept 2009EMBARGOED UNTIL September 21st at 12:01 a.m. EST
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AMD Server Platforms: A Look Ahead
Virtualizationdrives the need for
more cores and greater scalability
Cloud computing and dense deployments
drivethe need for greater
energy efficiency
Performance/Expandability
Power/ Cost Efficiency
AMD Opteron™ 6000 series platform
Driving performance, consistency and value to the market
Six-Core AMD Opteron™ Processor
Quad-Core AMD Opteron™ Processor AMD Opteron™
4000 series platform
Six-Core AMD Opteron™ Processor with AMD Chipset Announcement | Sept 2009EMBARGOED UNTIL September 21st at 12:01 a.m. EST
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AMD continues to execute the strategy to provide enhanced platforms to the market
Six-Core AMD Opteron™ processor with AMD chipset furthers AMD’s goal to drive performance, consistency and value in the market
Unified server platforms with AMD on AMD – benefits of processor and chipset
Platform Benefits
Range and flexibility of chipsets to meet varied demands of key workloads
Six-Core AMD Opteron™ Processor with AMD Chipset Announcement | Sept 2009EMBARGOED UNTIL September 21st at 12:01 a.m. EST
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Disclaimer & AttributionDISCLAIMERThe information presented in this document is for informational purposes only and may contain technical inaccuracies, omissions and typographical errors.
The information contained herein is subject to change and may be rendered inaccurate for many reasons, including but not limited to product and roadmap changes, component and motherboard version changes, new model and/or product releases, product differences between differing manufacturers, software changes, BIOS flashes, firmware upgrades, or the like. AMD assumes no obligation to update or otherwise correct or revise this information. However, AMD reserves the right to revise this information and to make changes from time to time to the content hereof without obligation of AMD to notify any person of such revisions or changes.
AMD MAKES NO REPRESENTATIONS OR WARRANTIES WITH RESPECT TO THE CONTENTS HEREOF AND ASSUMES NO RESPONSIBILITY FOR ANY INACCURACIES, ERRORS OR OMISSIONS THAT MAY APPEAR IN THIS INFORMATION.
AMD SPECIFICALLY DISCLAIMS ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. IN NO EVENT WILL AMD BE LIABLE TO ANY PERSON FOR ANY DIRECT, INDIRECT, SPECIAL OR OTHER CONSEQUENTIAL DAMAGES ARISING FROM THE USE OF ANY INFORMATION CONTAINED HEREIN, EVEN IF AMD IS EXPRESSLY ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.
ATTRIBUTION
© 2009 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD Arrow logo, ATI, the ATI logo, AMD Opteron, AMD Virtualization, AMD-V, FireStream, and combinations thereof are trademarks of Advanced Micro Devices, Inc. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium. Microsoft, Windows, and Windows Vista are registered trademarks of Microsoft Corporation in the United States and/or other jurisdictions. OpenCL is a trademark of Apple Inc. used under license to the Khronos Group Inc. Other names are for informational purposes only and may be trademarks of their respective owners.