Swanson Center for Product Innovation (SCPI)

Schohn Shannon Howard Kuhn Andy Holmes

Swanson Center Mission

The John A. Swanson Center for Product Innovation (SCPI) is housed within the SSOE and has been assisting industry and education since 1999.

Clients connect with a high quality, one-stop job shop that provides efficient turnaround for product analysis and design, process design and development, rapid prototyping and reverse engineering, small-lot product manufacturing, and additive manufacturing.

Our mission is to give students, researchers, industry, and entrepreneurs access to state-of-the-art product development technology through its technical services.

Our True Mission…

“…is to help you get your stuff done...” – Andy Holmes

Swanson Center Facilities

SCPI is comprised of four facilities:

• W.M. Keck Rapid Prototyping and Reverse Engineering Laboratory

• Kresge Rapid Manufacturing Laboratory• SSOE Machine Shop• SSOE Electronics Shop

Swanson Center Administration

David Vorp –Assoc. Dean for Research

SCPI Rapid Prototyping & RapidManufacturing Facilities

Andy Holmes – Project Coordinator, Machinist, and SCPI Manager

Thorin Tobiassen – Engineer and Machinist

SSOE Machine ShopDan Lewis – Machinist

Scott Macpherson -- Machinist

Schohn Shannon –SCPI Director

SSOE Electronics ShopKeith Devine – Electronics Technician

Swanson Center Best Parts…Direct Student Involvement

Swanson Center Best Parts…Student Workers

Swanson Center Best Parts…Safety Training

Swanson Center Best Parts…On-Line Job Submission and Approval

http://scpi.engr.pitt.edu

• Users Create a New Account or Login to Existing Account

• Job Submitted On-line with Valid Account Number or Course Designation

• Job Quote Dispatched via E-mail• Job Approved by Faculty or

Responsible Staff Person• Job is Entered into Queue

Swanson Center Best Parts…On-Line Job Submission and Approval

• $50/hr for research projects including design time, set-up, machining, and clean-up.

• Users supply all major materials and off-the-shelf components.

• Additional charges for major consumable materials, e.g. resins for SLA.

• Users may pay for specialty tooling or high- wear of tooling.

• No charge for class-based student projects.• No charge for student use of the equipment.

Swanson Center Best Parts…Charges

• Senior Design Projects• BioE 1160 Senior Design• ME 1043 Senior Design• ENGR 1050 Product Realization

Swanson Center Course Support

Swanson Center Course and Research Student-Use Tracking

2010-11 2011-12 2012-13 Proj0

200

400

600

800

1000

1200

1400

1600

1800

SCPI STUDENT USAGE by DEPARTMENT

MEMSIEHS/UPMCECECIVCHEMBIO

YEAR

#

OF LOGINS

2010-11 2011-12 2012-13 Proj0

100

200

300

400

500

600

700

800

900

SCPI HOURS of BILLABLE RESEARCH WORK

MEMSIEHS/UPMCECECIVCHEMBIO

YEAR

HOURS

Current Location – G13 BEH

Swing Location – SB10 BEHJuly 2013 – Dec. 2013

New SCPI Coming Back to the Ground Floor – Jan. 2014!

Selective transformation of material having no form (liquid, powder, wire)

AdditiveManufacturing

Machine

Solid form prescribed by a CAD solid model

into a

ASTM F-42 committee definition: a process of joining materials to make objects from three-dimensional (3D) model data, usually layer upon layer, as opposed to subtractive manufacturing methodologies.

Additive Manufacturing (3DPrinting, Direct Digital Manufacturing)

Powder Bed Fusion Laser Processes

Selective Laser Melting (SLM)Selective Laser Sintering (SLS)Selective Mask Sintering (SMS)

Electron Beam Melting (EBM)Binder Jetting

3DPrintingDirected Energy Deposition

Powder Feed (LENS)Wire Feed (Sciaky)

PolymerizationStereolithography (SLA)Flash CuringFilm Transfer Imaging (FTI)

ExtrusionFused Deposition Modeling (FDM)

Material JettingDrop-on-Demand (DoD)Multijet Modeling

LaminationSolidicaUltrasonic Consolidation (UC)

ASTM F-42 Classification of AM Processes

Metal Powder

Polymer

Powder Bed

Powder Bed Fusion Laser Processes

Selective Laser Melting (SLM)**Selective Laser Sintering (SLS)Selective Mask Sintering (SMS)

Electron Beam Melting (EBM)Binder Jetting

3DPrinting*(2)Directed Energy Deposition

Powder Feed (LENS)Wire Feed (Sciaky)

PolymerizationStereolithography (SLA)*Flash CuringFilm Transfer Imaging (FTI)

ExtrusionFused Deposition Modeling (FDM)*(2)

Material JettingDrop-on-Demand (DoD)Multijet Modeling

LaminationSolidicaUltrasonic Consolidation (UC)

ASTM F-42 Classification of AM Processes

Metal Powder

Polymer

Powder Bed

* at SCPI** proposed

Student use of SLA

SLA prototype of a new bus shelter designproduced on Viper SLA

Pitt CL model via MakerBot FDM

Mg scaffold prototypes

Fe-Mn scaffold prototypes

ERC-RMB Applications

Mg bone plates

Knotted GearOskar van Deventer

Mathematical Puzzle

3DP Metal

Collaboration withBathsheba Grossman

Expanding the Limits of Artistic CreativityBathsheba Grossman

3DP Metal

3DP Glass

Geometry Stress Analysis Fluid Flow Analysis

Digital Casting Production: No Patterns, No Core MoldsIntegration of process simulation and 3DPrinting of molds

Part concept Mold Design Mold Package

t = 0 t = 2 days t = 4 days

t = 6 days

Process Simulation 3DPrint

Finished Part

Pour

New design approachcombining AM and FEA/ topological optimization

Machined 0.8 kg

SLM lattice structure 0.31 kg

SLM optimized structure 0.37 kg

ChocALM(chocolate additive layered manufacturing)

Contour Crafting

Lunar Base via Contour Crafting

Swanson Center Rapid Prototyping & Reverse

Engineering Laboratory(Resources)

Andy Holmesjholmes@pitt.edu

412-624-8878Thorin Tobiassen

ttobiassen@gmail.com

Benedum Hall

CAD - COMPUTER AIDED DESIGN (NEED THIS TO DO THAT)AM - ADDITIVE MANUFACTURINGSLA - STEREO LITHOGRAPHY APPARATUS (VIPER)FDM - FUSED DEPOSITION MODELING (DIMENSION 1200EX) (BFB)3DP - 3 DIMENSIONAL PRINTING (ZCORP 310) (EXONE)CAM – COMPUTER AIDED MANUFACTURINGCNC – COMPUTER NUMERICAL CONTROLRE – REVERSE ENGINEERNGDLM – DIRECT LASER MELTDDM – DIRECT DIGITAL MANUFACTURING

WHAT’S IN AN ACRONYM?

PDQ OR A.S.A.P. - HOW FAST EVERYONE WANTS THEIR “STUFF”!

Objective:• Lab Equipment and Processes• Overview of Rapid Prototyping Methods• Overview of Reverse Engineering Methods• In-house fabrication capabilities• Swanson Center Work Request• Questions/Answers maybe…

Manufacturing conventionsTHREE MAIN CATEGORIES

Subtractive manufacturing

Additive manufacturing

Forming

Swanson Center Lab CapabilitiesHaas TL-1 CNC lathe

Hardinge English/Metric Toolroom LatheHaas TM1-P 4 Axis CNC Machining Center

2 axis Bridgeport milling machineKern HSE 25 Metal Cutting Laser

Brown and Sharpe CMMFaro Arm

Minolta scanning cameraRenishaw Clylone Scanner

Viper SLAStratasys Dimension 1200 EX FDM

BFB3000 FDMZcorp 3D printers

MCP vacuum casting system15 ton Morgan injection molding machine

What is Rapid Prototyping?

• A term used to describe the technologies that produce models or prototypes with less effort and time as related to traditional methods.

• Additive process or…• If additive then - builds in layers• Variety of materials• *new technology every month!

Current A.M. Offerings

• (Swanson) Stereolithography - VIPER• (Swanson) Fused Deposition Modeling -

Stratasys Dimension1200ex, BFB3000• (Swanson) 3D Printing or Multi Jet Modeling

Zcorp Z310 and Z510 color• (Service Bureau “FineLine Prototyping) Direct

Laser Melting Metal

Stereolithography (VIPER) by 3D Systems, Inc.

• System that creates physical prototypes by curing thin layers of a liquid epoxy photopolymer with an ultraviolet laser beam

Specs of the VIPER• High accuracy• Excellent surface finish• Multiple Materials (SOMOS 11122 XC)• Build volume – 10” x 10” x 10”• Prototypes good for form, fit, and

functionality testing as well as masters for secondary tooling

FDM – FUSED DEPOSITION MODELLING

BFB 3000

DIMEMSION 1200EX

3DP 3 DIMENSIONAL PRINTING

Zcorp 310

Service Bureau Example

316 SS

1-3 days!!

$200.00!!!

Cost to CNC Machine 1 ?

$$$$$$$And LOTS of time

DLM – Direct Laser Melt

Top 10 Common Mistakes in Designing Parts for Rapid Prototyping

 1. Part design having thin-features less than .030” for Std. SLA and .015”-.020” for High Res SLA.

Solution: Make sure that there are features no less than .030” for Standard SLA and .015”-.020” for High-Res SLA to ensure features build correctly.

2. Saving the CAD model to STL file in low-resolution setting resulting in too much faceting in the model.

Solution: Typically, there should be an Edge-to-Edge distance between faces less than .020” for a smoother finish. For more information on STL and how to save to a higher resolution file in the most commonly used CAD packages, please visit this link.

3. STL file conversion error resulting from the CAD data having numerous unstitched surfaces rather than solids.

Solution: Make sure that the surfaces in the original CAD model are “water-tight” in that only solids are modeled.

4. Part design having knife edge design where the edge thins down to zero thickness.

Solution: Thicken any thinning/ knife edge features, which a lot of time are found in thread designs, in the model that are less than .030” in thickness for Std. SLA and .015”-.020” for High-Res SLA.

5. Part design with enclosed hollow space where support materials can’t be removed.

Solution: Add a hole for the internal voids in the model to allow the removal of the support materials.

6. Curvier sections of the part, such as in bottles or lids, with thickness less than the minimal feature size.

Solution: Thicken any features in the model with curvy sections that are less than .035” in thickness for Std. SLA and .025” for High-Res SLA. For curvier sections that are at or near the minimum, even thicker dimensions from the standard tolerance will increase the probability of the part building properly.

7. Parts, assemblies, and threads with improper clearances and mating features.

Solution: Typically, there should be a .015”-.020” clearance b/w prototype parts, which will differ when it comes to the full production stage.

8. Having small text and logos features in the part model.

Solution: Make sure that the logo and text features are no less than .030” for Standard SLA and .015”-.020” for High-Res SLA in length, width, or thickness.

9. Designing living hinge to function for Rapid Prototypes.

Solution: Living hinge design doesn’t typically function as intended in the rapid prototyping process (with an exception of the NEW SLA High-Strength). A simple fix would be using a normal Scotch tape to act as the hinge.

10. Saving in the wrong units for the STL file.

OUR AWESOME WORKSPACE!

Traditional Machining….sort of.

CNC MACHINE TOOLS

4 AXIS CNCMACHINING CENTER

2 AXIS CNC LATHE

MANUAL MACHINE TOOLS

MANUAL MILL

PERCISION TOOL ROOM LATHE

Kern HSE 25 Metal Cutting Laser

Specs:• Non Metallics: up to ¾” • Steel .125”• Stainless .093”• Ti .040” • *No Al.• *No Brass

Reverse Engineering

What is Reverse Engineering?

• The process of taking an existing part and accurately reproducing the surface geometry in a three-dimensional data file

• Contact and non-contact methods

Contact Scanning (Cyclone) by Renishaw, Inc.

• An semi-automated contact system that utilizes a touch probe to continuously acquires data along a scanning path

Scan Density: .002”Accuracy: .0005

Coordinate Measurement (Gage 2000) by Brown & Sharpe

• A manually operated machine that utilizes a touch probe to capture single analytic feature measurements (sphere, cylinder,

bore, etc.)

Scan Density: N/AAccuracy: .00005

Minolta VIVID 910 laser camera

• Speed - scans in less than one second (Fast Mode)

• Precision - over 300,000 points with range resolution to 0.002" (Fine Mode)

• Simplicity - point and shoot simplicity • Interchangeable lenses for variable scanning

volumes • Color Scanning - great for scanning people

Scan Density: .020”Accuracy: .002

Laser Scanning (FARO ARM)

• A manual contact/non-contact system that utilizes an adaptive laser scanning and probing process

Scan Density: .004”Accuracy: .003”

REVERSE ENGINEERING

NON-CONTACT LASER SCANNING

CONTACT PROBE SCANNINGMEASURING MACHINE COORDINATE

SURFACE CREATION

POINT CLOUD FROM SCANNER

FACETED OR “TRIANGULATED” SURFACE

FEATURE RECOGNITION

SURFACE PATCH CREATION

MANUFACTURABLE CAD DATAFINAL NURB SURFACE

SURFACE GRIDS

You Don’t know what you don’t know!

• Collet your thoughts and come up with a plan.• Identify challenges that don’t appear to have a simple solution.• Solve a “subsystem challenge” first. • Prototype prototype prototype.• Integrate solved “subsystem challenge” into the main design. • Don’t forget the HARDWARE!!

How to interface with the Swanson Center for Product

Innovation

http://scpi.engr.pitt.edu

G13 or G20 on the GR LevelSOON TO BE SB10 in the Sub

Basement

Create a new account

http://scpi.engr.pitt.edu

If you use a gmail account for email, you may use that as your email address

Create account using CSSD user name?

What’s that??

Your Initials and two numbers

Why?To filter anyone without a

UNIVERSITY username from the system

Add Association- dept. or person

Questions and Answers

Don’t Miss the Next Lunch & Learn!

July 11, 2013The Notebook – (NOTE that this is the SECOND Thursday of the month due to the July 4th holiday conflict with the first Thursday) Presenters: Julie Myers-Irvin Topics to be covered: The importance of keeping a laboratory notebook (including legal ramifications, protection of IP, etc.), and what should be recorded.