copper or copper alloys compris- ing an oxidizing agent, which can oxidize the copper or copper alloy and is selected from cupric ion source compounds; an organic acid or an inorganic acid; a halide ion source compound; a polymer compound, which contains poly- amine or polyimine chains or a cationic group or both in the amount of 0.000001 to 1.0% by weight; and water.

PROCESS FOR TREATING TINNED

SURFACES

U.S. Patent 5,965,205. Oct. 12, 1999 M. Yoshida, assignor to Henkel Corp., Gulph Mills, Pa.

A process for treating a tinned metal surface in order to form a corrosion-protective, paint-adher- ent coating comprising bringing

the metal surface being treated into contact with an aqueous liq- uid coat-forming composition hav- ing a pH of not more than 6.0 and comprising water and 0.5 to 30 parts by weight of phosphate ions; 0.1 to 10 parts by eight of con- densed phosphate ions; and 0.1 to 20 parts by weight of water- soluble polymer molecules.

HOT-DIP COATING APPARATUS

U.S. Patent 5,965,210. Oct. 12, 1999 M. Tada et al., assignors to Kawasaki Steel Corp., Hyogo, and Mitsubishi Heavy Industries, Ltd., Tokyo

A hot-dip coating method in which a steel strip is coated as it is fed upwardly through a slit in a bottom of a coating tank, the im- provement comprising making a

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flow velocity of the molten metal uniform across a breadth of the strip by directing the molten metal through a flow restricting buffer as the molten metal enters the coating tank at the inlets.

ELECTROLESS COPPER PLATING

SOLUTION

U.S. Patent 5,965,211. Oct. 12, 1999 K. Kondo et al., assignors to Nippondenso Co., Ltd., Kariya, Japan

A process for formation of a cop- per plating film, which comprises immersing a material to be plated in an electroless copper plating solution of copper ions; a reducing agent; a pH-adjusting agent; a tri- alkanolmonoamine or a salt thereof in an amount sufficient to act as a complexing agent and ac-

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116 Metal Finishing