Post on 26-Mar-2015
description
June 2010
april 2011Americas Edition
auDio/viDEoGennum
DEvElopmENt toolsExarlattice semiconductorstmicroelectronics
Datacommicrelsmsc
DisplaYssharp
microcoNtrollErsNuvotonstmicroelectronics
poWEr maNaGEmENtlineage powerlinear technology
simplE.usEful.
proGrammablE.
see page 15
In ThIs Issue:
focus oNmEmorYGsi tEchNoloGY36mbit syncburst and Nbt srams
issihigh speed low power 4mb sram
microNparallel Nor flash for Embedded applications
phase change memory
realssD™ c400 solid state Drives
serial Nor flash for Embedded applications
stmicroElEctoNicsDual interface EEprom
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SFEATURED APPLICATION - FOCUS ON MEMORY Memory Applications Overview 4-5
Nu Horizons Wireless Product Matrix 6
GSI Technology 36Mbit SyncBurst and NBT SRAMs 7
ISSI High Speed Low Power 4Mb SRAM 8
Micron Parallel NOR Flash for Embedded Applications 9
Micron Phase Change Memory 10
Micron RealSSD™ C400 Solid State Drives 11
Micron Serial NOR Flash for Embedded Applications 12
STMicroelectronics Dual Interface EEPROM 13
DEVELOPMENT TOOLSExar Programmable Power Controller, Configuration
Board, and PowerArchitect ™ 3.0 Software14
Lattice Semiconductor Lattice Semiconductor Breakout Boards 15
STMicroelectronics STM8L-DISCOVERY 15
FEATURED COMPONENTSAudio / Visual Gennum’s 3rd Generation Video Optical Modules 16-17
DatacomMicrel — Low-power, Highly Integrated, 4/5-port Layer-2 Switch-on-a-Chip ICs
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DatacomSMSC — Hi-Speed USB 2.0 to 10/100/1000 Gigabit Ethernet Controller
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MicrocontrollersNuvoton — High Precision 24-bit ADC for Weight Scales and Precision Measurement Markets
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MicrocontrollersSTMicroelectronics — 32-bit Flash microcontrollers, 120 MHz/150 DMIPS with ART Accelerator™ and advanced peripherals
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Power ManagementLineage Power — Barracuda™ Power Modules; DC-DC Converters
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Power ManagementLinear Technology — Octal PMBus Power Supply Monitor and Controller with EEPROM
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Power ManagementLinear Technology — Offline Isolated Flyback LED Controller with Active PFC
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APPLICATION NOTESLattice Semiconductor, Micrel, Wurth Midcom
Using a Micrel Ethernet PHY and a Lattice ECP3 FPGA to Create an Ethernet Subsystem
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Lattice Semiconductor, Linear Technology
Creating a Power Subsystem for Lattice XP2 FPGAs using Linear Technology Power Devices
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Many Microprocessor (MPU) or Microcontroller (MCU) applications require external data memory to store intermediate data used during computations or data transfer. Large audio files or video frames will typically require more memory that an MCU or MPU has internally. If large amounts of data need to be accessed then DRAM is usually the best alternative. For small amounts of data SRAM or PSRAM (DRAM with an SRAM interface and hidden refresh for those of you who skipped the memory Technology overview) are good choices. Data that needs to be modified frequently, like intermediate data during computation most will most likely need to use a Volatile technology- SRAM or DRAM. If the data is written to less frequently, perhaps to store configuration data that needs to be saved between power cycles (like brightness levels for LEDs displays in a kiosk) then EEPROM devices are a good fit. Small amounts of data can be easily written to, typically at the byte level, using EEPROM.
Many times the external memory controller within the MCU/MPU may dictate the choices available to the designer. Some processors have built-in SRAM, DRAM or EEPROM interfaces or even Flash controllers. Determine the types of interfaces your MCU/MPU supports (or even better select an MCU/MPU with your optimal memory interface in mind) and then select the best memory device from those supported by your MCU/MPU. Figure 1 shows three common architectures- one where a small amount of external data is required and an SRAM/PSRAM is sufficient, one where the data requirement is larger and a DRAM is needs and one where the data is modified infrequently and an EEPROM is the best choice.
Microprocessor /Microcontroller code storageOne of the more common applications for semiconductor memory is as external code storage for Microprocessors or Microcontrollers. Most Microprocessors units (MPU) require external code storage while most MCUs have internal code storage. In some applications however MCU internal code is not large enough for the application making it necessary to add external code storage to the design.
Deciding on the type of memory device to use for external storage will depend whether the processor will need to execute code directly out of the external device (Execute in Place) or if the code can first be read out of the code storage device and loaded into another memory from which the processor accesses code (Transfer and Execute). Many times the additional memory is a high capacity DRAM, perhaps with extra low power features. Initially it might seem like this takes an additional memory device, but if the processor needs an external data memory anyway (perhaps for storing large intermediate video or audio files), the use if it for code execution
as well may make sense. If the low power modes of the DRAM can reduce power significantly this can be an improvement over the use of a separate code only storage device. The data transfer from code storage to DRAM will require a small boot loader and will extend the initialization
time of the processor, but if these considerations are not critical then the Transfer and Execute approach can provide advantages.
For Execute in Place code storage Flash memory with random access, like that found with NOR devices can be utilized and provides high
capacity and low cost. NAND Flash is block oriented and thus can’t be used directly for Execute in Place applications, but is well suited for Transfer and Execute architectures. Code can be transferred a block at a time into DRAM (or even low power SRAM) and if a simple memory management controller is used not all the code needs to reside in the DRAM (or SRAM). This approach can further reduce power consumption since a smaller execution memory can be used.
coMMunications interface MeMoryCommunications processors, usually in the form of a specialized high-performance processor with integrated communications oriented peripherals, form the backbone of most modern communications
systems. These data hungry algorithms typically require external memory to buffer data and to help route packet data to the right receiving process. The example communications system in Figure 3 shows a communications processor between multiple asynchronous communications channels and a
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Memory ApplicationsWe will review a few common applications to illustrate how the different memory technologies advantages and disadvantages influence device selection.
Figure 1: MCU/MPU Data Storage Examples
Figure 2: MCU/MPU Code Storage Examples
Microprocessor / Microcontroller data storage
MCU/MPU
MCU/MPU
MCU/MPU
SRAM/PSRAMData Storage
DRAM Data Storage
EEPROM Data Storage
External data memoryUsing MCU/MPUs SRAM Interface
(Data used for small computation)
External data memoryUsing MCU/MPUs DRAM Interface
(Data used for large computation)
External data memoryUsing MCU/MPUs EEPROM Interface
(Data used for Configuration)
MCU/MPU
DRAM Data Storage
NOR Flash Code Storage
Code is accessed directly by the processor
(Execute in Place)
MCU/MPUDRAM or SRAM
Data/Code Storage
NAND Flash Code Storage
Code is transferred to the Data Memory and then accessed by the processor
(Transfer and Execute)
high-speed Gigabit Ethernet port. The communications channels need to be consolidated, packetized and transferred over the Gigabit Ethernet port. Communications traffic needs to meet specific Quality of Service (QoS) requirements so the Communications Processor needs to prioritize traffic in order to achieve the required service levels.
Communication systems typically require synchronization between various asynchronous communications channels and so it is in the example design. A FIFO memory is an excellent way to transition from one clock domain to another since the write port of the FIFO can run independently from the read port. The FIFO also provides the needed buffering so that data can be transferred at different burst rates, since channel inputs will not always be delivered at the same rate that the channel output needs to process data. In our example design an FPGA is used to consolidate the multiple Communications Channels, and then to transfer the data to the FIFO one buffer at a time. The Communications Processor reads the data from the FIFO, consolidates and packetizes the data for optimal transmission over the Gigabit Ethernet port. The FIFO effectively ‘bridges’ the processor time domain from the communications time domain.
During packet processing it will be important for the Communications Processor to have fast access to the routing tables and various QoS metrics needed to route packets efficiently. These tables will need to be updated frequently as traffic rates changes and sender/receiver pairs attach and detach. An RLDRAM is a good choice for the high-
speed, low latency and random access requirements of this type of algorithm. Many Communications Processors have RLDRAM interfaces built-in, making it easy to implement RLDRAM-based packet processing systems.
HandHeld instruMentation- code and data storageA variety of battery operated hand-held instrumentation applications- from simple power meter monitors to complex automatic electronic defibrillators- use MCU or MPU based processors to run the algorithms required to capture, process and record data from a variety of inputs that are usually analog. In the example design shown in Figure 4, a low-power MCU is used to sense analog inputs, process the inputs to create a digital recording and store a summary of the measurement in non-volatile memory that can be removed from the instrument for archival storage or further processing.
Applications for this type of design include environmental sensors (like temperature, chemical or radiation detectors), medical instruments (like blood glucose meters or heart rate monitors), inventory control scanner/recorders, or automotive sensors (tire pressure or air bag deployment devices)- just to name a few.
Hundreds of applications will use architectures similar to that shown in Figure 4.
The data storage memory needs to be removable and easily read/written to by the MPU. Standard interfaces like those used for Memory Cards (like CompactFlash, Secure Digital, or MicroSD) are possible options and provide a significant amount of data in a small and compact format. A
convenient option for Instrumentation designs that need to move captured data to a laptop computer for further processing is a USB Flash drive. The drive can be easily removed from the handheld device and inserted into a laptops USB port.
The intermediate data used by the data processing algorithm can be stored in low-power Mobile DDR SDRAM. In between measurements the Mobile DDR SDRAM can be put into a low-power mode that disables memory accesses to save power. Data in the memory is retained and can be accessed when a new measurement is required. Some applications might be able to save data from the SDRAM to Flash and then power down both the SDRAM and the MPU completely, reducing power consumption even more. When operation resumes the MPU will wake-up, read data from Flash and load it into SDRAM so processing can continue.
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Figure 3: Example Communication System Memory Requirements
Figure 4: Example Low-Power Data Memory for Example Handheld Instrumentation Application
Memory applications are as varied as memory technologies, but have
some common considerations (performance, cost, power and memory
use model) that can be used to help select the right technology for a
specific application.
RLDRAM
FIFO
FPGA
Communications Processor
Channel Consolidation and Packet Processing
Routines
MultipleCommunicationsChannels
High-speedGigabitEthernet
USB F lash Memory
Mobi le DDR
SDRAMLow-Power MPU
LCD Control,Data Processing,
User Interface KeypadLEDsSwitches
LCD Panel
Analog Inputs
Battery Charger/ Power Manager
Bat ter y
Mem
ory
Offe
ring
Mat
rix
Non-
Vola
tile
Vola
tile
Spec
ialty
M
emor
yEE
PROM
EPRO
MFl
ash
DRAM
SRAM
Serial EEPROM
Parallel EEPROM
Serial EPROM
Parallel EPROM
Serial NAND Flash
Serial NOR Flash
Parallel NOR Flash
Flash Cards
SSD Flash
DRAM
SDRAM
DDR SDRAM
DDR2 SDRAM
DDR3 SDRAM
RLDRAM
Mobile DDR SDRAM
PSRAM
SRAM
DDR SRAM
QDR SRAM
FIFO
NVRAM
Storage Controllers
X XX
X X
X
X XX
X
X
XX
XX
XX
X
XX
X X
XX
XX
XX
XX
XX
XX
XX
XX
X
XX
X
XX X
XX
X
XX
XX
XX
XX
XX
EEPR
OM: E
lectri
cally
Eras
able
Prog
ramma
ble R
ead O
nly M
emor
yEP
ROM:
Eras
able
Prog
ramma
ble R
ead O
nly M
emor
yFla
sh: E
EPRO
M typ
e mem
ory e
rased
in la
rge b
locks
NO
R: A
Flash
imple
menta
tion w
here
the m
emor
y cell
s are
interc
onne
cted u
sing a
NOR
topo
logy t
hat p
rovide
s a ra
ndom
acce
ss ca
pabil
ity, s
imila
r to s
tanda
rd m
emori
es.
NAND
: A Fl
ash i
mplem
entat
ion w
here
the m
emor
y cell
s are
interc
onne
cted u
sing a
NAN
D top
ology
that
prov
ides b
lock-
base
d acc
ess c
apab
ility,
simila
r to h
ard di
sks a
nd m
emor
y card
s. Se
rial In
terfac
e: An
inter
face m
ethod
whe
re da
ta is
read/w
ritten
seria
lly, o
ver a
small
numb
er of
pins t
o mini
mize
devic
e cos
t.Pa
ralle
l Inter
face:
An in
terfac
e meth
od w
here
data
is rea
d/writ
ten in
paral
lel, o
ver a
larg
e num
ber o
f pins
to m
axim
ize ba
ndwi
dth.
Flash
Car
ds: A
re hig
h cap
acity
data
stora
ge in
a ca
rd fo
rmat
typica
lly us
ed in
hand
-held
devic
es lik
e cam
eras,
cell p
hone
s and
porta
ble in
strum
ents.
SSD
Flash
: Soli
d Stat
e Driv
e Flas
h dev
ices o
ffer u
ltra-
high c
apac
ity in
a so
lid st
ate fo
rmat
to rep
lace t
raditio
nal m
echa
nical
(disk
) stor
age s
ystem
s.DR
AM: D
ynam
ic Ra
ndom
Acce
ss M
emor
y- H
igh ca
pacit
y mem
ory w
here
data
is sto
red on
a ca
pacit
or an
d mus
t be p
eriod
ically
refre
shed
or da
ta wi
ll be l
ost (t
heref
ore dy
nami
c).SD
RAM:
Sync
hron
ous D
RAM
uses
a clo
cked
inter
face (
sync
hron
ous)
to sim
plify
syste
m tim
ing.
DDR
SDRA
M: D
ouble
Data
Rate
SDRA
M clo
cks d
ata on
both
edge
s of t
he cl
ock t
o imp
rove b
andw
idth w
ithou
t larg
e inc
rease
s in p
in co
unt.
DDR2
SDRA
M: D
ouble
Data
Rate
Two S
DRAM
tran
sfers
data
at tw
ice th
e rate
of D
DR.
DDR3
SDRA
M: D
ouble
Data
Rate
Three
SDRA
M tra
nsfer
s data
at tw
ice th
e data
rate
of DD
R2.
RLDR
AM: R
educ
ed-L
atenc
y DRA
M off
ers fa
st SR
AM-li
ke ra
ndom
acce
ss an
d prov
ides s
ustai
ned b
andw
idth o
ver t
hat a
vaila
ble fr
om D
DR3-
type d
evice
s. Mo
bile D
DR SD
RAM:
Low
Powe
r SDR
AM de
signe
d for
batte
ry op
erated
hand
-held
mob
ile de
vices
PSRA
M: Ps
eudo
Stati
c DRA
M us
es D
RAM
techn
ology
for h
igh de
nsity
but im
pleme
nts a
stand
ard SR
AM in
terfac
e, hid
den r
efres
h and
SRAM
pin c
ompa
tibilit
y to s
impli
fy de
sign a
nd
reduc
e pow
er.SR
AM: S
tatic
Rand
om Ac
cess
Mem
ory
DDR
SRAM
: Dou
ble D
ata R
ate SR
AM tr
ansfe
rs da
ta in
burst
s at t
wice
the r
ate of
SRAM
by us
ing bo
th ed
ges o
f the
cloc
k.QD
R SR
AM: Q
uad D
ata R
ate SR
AM tr
ansfe
rs da
ta in
burst
s at t
wice
as fa
st as
SRAM
using
both
edge
s of t
he cl
ock a
nd ca
n rea
d and
writ
e sim
ultan
eous
ly.FIF
O: Fi
rst In
First
Out
memo
ry is
used
to bu
ffer d
ata be
twee
n two
diffe
rent t
ime d
omain
s like
thos
e freq
uentl
y enc
ounte
red in
comm
unica
tions
appli
catio
n.NV
RAM:
Non
-Vola
tile SR
AM pr
ovide
s batt
ery b
ack-
up w
hen p
ower
is rem
oved
to ke
ep da
ta fro
m be
ing lo
st.St
orag
e Con
trolle
rs: P
rovide
the c
ontro
l nec
essa
ry to
create
NAN
D Fla
sh-b
ased
USB
mem
ory s
ystem
s.
GSI Technology has introduced a new
screaming fast 36Mbit SyncBurst/NBT family
of SRAMs. GSI’s GS832xA family includes
pipelined, flow through, and NBT™ Fast
SRAMs with speeds up to 400 MHz in TQFP and
BGA packages. Both commercial and industrial
temperature ranges are offered as standard
products.
GSI Technology’s 36Mbit SyncBurst™
and NBT™ products are ready for customer
sampling now. Pricing ranges from $40.00 to
$60.00 in 1,000 piece quantities, depending on
speed and configuration.
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36Mbit SyncBurst and NBT SRAMsWith speeds up to 400MHz, these SRAMs are a perfect fit for upgrades to current designs that are needing a bit more speed, or for new designs that require higher speed bins.
A complete set of design options: SCD Burst, DCD Burst, NBT
x18, x32, x36 data bus widths
2.5 V/3.3 V & 1.8 V/2.5 V supply options
FLXDrive™ Programmable outputs
IEEE 1149.1 boundary scan
Industrial temperature range = standard
7
Scan barcode for more GSI SyncBurst and NBT SRAM information
For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal
Functions: Organizations:Package Options:
Supply Voltage:
Speeds (MHz): GSI Part#s:
SyncBurst™ (SCD)SyncBurst™ (DCD)NBT™
2Mb x 181Mb x 321Mb x 36
100 TQFP
2.5–3.3 V 400–150GS8320xxAGT-nnnGS8320ExxAGT-nnnGS8320ZxxAGT-nnn
1.8–2.5 V 333–150GS8320xxAGT-nnnVGS8320ExxAGT-nnnVGS8320ZxxAGT-nnnV
SyncBurst™ (SCD) with JTAGSyncBurst™ (DCD) with JTAGNBT™ with JTAG
2Mb x 181Mb x 321Mb x 36
165 BGA
2.5–3.3 V 400–150GS8321xxA(G)D-nnnGS8321ExxA(G)D-nnnGS8321ZxxA(G)D-nnn
1.8–2.5 V 333–150GS8321xxA(G)D-nnnVGS8321ExxA(G)D-nnnVGS8321ZxxA(G)D-nnnV
SyncBurst™ (SCD/DCD) with JTAG and FlexDrive™
2Mb x 181Mb x 36
119 BGA2.5–3.3 V 400–150 GS8322xxA(G)B-nnn
1.8–2.5 V 333–150 GS8322xxA(G)B-nnnV
165 BGA2.5–3.3 V 400–150 GS8322xxA(G)D-nnn
1.8–2.5 V 333–150 GS8322xxA(G)D-nnnV
512K x 72 209 BGA2.5–3.3 V 250–133 GS8322xx(G)C-nnn
1.8–2.5 V 250–133 GS8322xx(G)C-nnnV
NBT™ with JTAG and FlexDrive™
2Mb x 181Mb x 36
119 BGA2.5–3.3 V 400–150 GS8322ZA(G)B-nnn
1.8–2.5 V 333–150 GS8322ZA(G)B-nnnV
165 BGA2.5–3.3 V 400–150 GS8322ZA(G)D-nnn
1.8–2.5 V 333–150 GS8322ZA(G)D-nnnV
512K x 72 209 BGA2.5–3.3 V 250–133 GS8322Z(G)C-nnn
1.8–2.5 V 250–133 GS8322Z(G)C-nnnV
High Speed Low Power 4Mb SRAMSRAM with Error Correction
ISSI’s latest Error Correction based 4Mb High Speed Low Power SRAM
is currently sampling. This innovative design reinforces ISSI’s long-term
commitment to SRAMs with the highest quality and performance. This
industry’s first Error Correction Code (ECC) based Asynchronous SRAM meets
high quality requirements in automotive, industrial, military-aerospace, and
other applications.
Error Detection and Error Correction
Independent ECC with hamming code for each byte
Detect and correct one bit error per each byte
Better reliability than parity code schemes which can only detect an error but not correct an error
Backward Compatible: Drop in replacement to current in industry standard devices (without ECC)
APPLICATIONS:
Automotive
Military-Aerospace/Medical
Industrial
Telecom/Networking
FEATURES:
8
Scan barcode for more information on ISSI's4Mb SRAM solutions
For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal
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Memory Lower I-O
Array256Kx8
ECC Array
-
256K x4
Decoder
I/O Data Circuit
ECCColumn I/O
IO0 -7
Control Circuit
A0-A17
IO8 -15
8
ECC8
8
8
12
12
Memory Upper I-OArray256Kx8
ECC Array
-
256K x4
8 4 48
/CE/OE/WE/UB/LB
IS64WV25616EDBLL (A1) IS64WV25616EDBLL (A3) Comments
Temperature Support Industrial (-40oC to +85oC)
Automotive (-40oC to +125oC)
Contact ISSI for military temperature
Technology 65nm 65nm
Standby Current 9mA 20mA Typical value 2mA
Operating Current 45mA 65mA Typical value 25 mA
Data Retention Current 9mA 15mA Typical value 2mA
Packaging TSOP-II (44 pins) BGA (48 pins)
TSOP-II (44 pins) BGA (48 pins)
Pin compatible with industry standard 4Mb Async. SRAM
Speed 10ns 10ns
Copper Leadframe Yes YesImproved thermal
performance
Lead-free and Leaded Yes Yes RoHS Compliant
Availability Sampling Sampling
Parallel NOR Flash for Embedded ApplicationsFast, Dependable Performance
Today’s applications demand an
unprecedented combination of features—high
performance, high density, high reliability, and
low-power operation. Strike a balance among
performance needs, design requirements, and
cost by equipping your demanding platforms
with our reliable, high-performance parallel
NOR.
Our parallel NOR solutions are constructed
to meet the design requirements of consumer
and mobile products such as cell phones,
smartphones, e-readers, GPS/navigation,
and other portable, handheld, multitasking
applications. With high densities, execute-in-
place (XIP) performance, architectural flexibility,
and a track record of proven reliability, our
parallel NOR solutions are also ideal for long-
term placement in rigorous industrial settings.
9
Scan barcode for more Paralell NOR Flash information
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FEATURES: BENEFITS:
Density 2Mb–1Gb Industry-standard densities
Performance Burst, Page, Multibank, & Multi I/O A broad range of performance options across the product line
Security
Block/Sector LockingOTP Protection RegisterSmart Secure Krypto® Encrypted AccessHW/SW ProtectionModifiable Security Device StateProtection After Power-UpKrypto® Password Access Write Protection
Voltage 1.8V VDD, 3.0V VDD, 1.8V I/O, 3.0V I/O, 5.0V I/O Full product voltage range
FamilyCore
VoltageI/O Voltage Bus Width Density Range Burst
Multibank Option
Security Features
Access Time Package Options
P30 1.7-2.0 1.7-3.6 x16 64Mb–2Gb† X X 52 MHz burst TSOP, eBGA, QUAD+
P33 2.3-3.6 2.3-3.6 x16 64Mb–2Gb† X X 52 MHz burst TSOP, eBGA
M29EW 2.7-3.6 1.65-3.6 x8, x16 32Mb–2Gb† X100-110ns25ns page
TSOP, BGA
M29W 2.7-3.6 2.7-3.6 x8, x16 4Mb–256Mb X 45-90ns TSOP, TBGA
M29DW 2.7-3.6 2.7-3.6 x8, x16 32Mb, 128Mb–256Mb X 90ns TSOP, TFBGA
M29F†† 5 5 x16 2Mb–16Mb 55ns TSOP, SO, KGD
J3 2.7-3.6 2.7-3.6 x8, x16 32Mb–256Mb X75ns95ns (256Mb)
TSOP, eBGA
M28W 2.7-3.6 1.65-3.6 x16 16Mb–64Mb X 70-100ns TSOP, TFBGA
M58BW2.7-3.62.5-3.3(55ns)
2.7-3.62.5-3.3(55ns)
x32 16Mb–32Mb X45-70ns56-75 MHz burst
PQFP, LBGA
M58LT 1.7-2.0 2.7-3.6 x16 128Mb–256Mb X X X85ns52 MHz burst
TBGA
† Stacked solution†† Automotive temp available
PARALLEL NOR PRODUCT FAMILY OVERVIEW
10 For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal
Phase Change MemoryChange your design, change the world
Are the constraints of traditional memory architectures holding back your groundbreaking
designs? New, revolutionary phase change memory (PCM) merges the best attributes of
NOR, NAND, and RAM, offering unprecedented capability in a single, nonvolatile memory
chip.
With byte alterability (or overwrite capability), Micron PCM improves system-level
performance and simplifies software design. Higher endurance further reduces software
management and improves system-level reliability.
FEATURES:
P5Q Serial PCMMicron’s 128Mb 90nm serial device is purpose-built to meet the memory requirements of embedded systems, delivering multiple I/O capability and compatibility with familiar SPI NOR interfaces. Combining NOR and EEPROM technology benefits into one, P5Q serial PCM provides solutions for today and beyond.
Byte alterable: overwrite capability
Endurance: 1 million WRITE cycles
Density: 128Mb (90nm lithography)
I/O bus width: quad (single/dual supported)
66 MHz (maximum) single/dual I/O 50 MHz (maximum) quad I/O
Programming time: 0.9 MB/s
Single supply voltage: 2.7–3.6V
Package: SOIC-16
Choice of temperature ranges: –30°C to +85°C and 0°C to +70°C
P8P Parallel PCMMicron’s128Mb 90nm parallel device is designed to meet the memory requirements of embedded systems. P8P parallel PCM enhances overall performance, simplifies software management, and improves system-level reliability.
Byte alterable: overwrite capability
Endurance: 1 million WRITE cycles
Density: 128Mb (90nm lithography)
Programming time: 0.9 MB/
Voltage range: 2.7–3.6V VCC; 1.7–3.6V VCCQ
Packages: 56-pin TSOP; 64-ball Easy BGA (8x10mm)
Choice of temperature ranges: –30°C to +85°C and 0°C to +70°C
APPLICATIONS:
Power grid/power metering
Medical monitoring
Network/security cameras
Display systems
Industrial printers
Network routers
Data logging intensive applications
Scan barcode for more Micron Phase Change Memory information
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Parallel PCM Before
Serial PCM Before
Parallel PCM After
Serial PCM After
RealSSD™ C400 Solid State DrivesDesign In Industry-Leading PC Performance
Our RealSSD™ C400 SSDs are client-
focused hard drive replacements that provide
dramatic improvements in power, performance,
and reliability.These SSDs provide breakthrough
performance for notebook and desktop applications.
By combining our MLC NAND technology and
optimized NAND management algorithms, we’re
able to improve boot and application load times
and lower power consumption to create a better
overall user experience.
Our global network of experts are dedicated
to resolving issues and ensuring optimum
solutions. We control the SSD BOM for easy
supply chain management and our
extensive product qualification
translates to predictably reliable,
high-quality drives.
C400 ADVANTAGES FOR CLIENT APPLICATIONS:
Performance Improves boot times and speeds application launches, delivering information on demand.
Reliability
Withstands extreme shock and vibration, ensuring higher reliability in the most demanding environments.
Low Power Consumes significantly less power than typical hard drives.
Lightweight Weighs less than HDDs, providing high-capacity storage with maximum portability.
Compatibility
Backward compatible to SATA 3 Gb/s, making them easy-to-adopt, drop-in HDD replacements.
NAND Expertise
Leverages Micron’s proven quality and test capabilities to provide best-in-class drive reliability.
APPLICATIONS:
Notebooks
Consumer applications
High-performance desktops
Industrial computing
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Scan barcode for more Micron RealSSD™ C400 information
For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal
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*Package height in millimeters.
Part Density Version Size* Voltage Read (MAX) Write (MAX)
MTFDDAA064MAM-1J1 64GB C400v 1.8“ (5mm) 3.3V 415 MB/s 95 MB/s
MTFDDAA128MAM-1J1 128GB C400 1.8“ (5mm) 3.3V 415 MB/s 175 MB/s
MTFDDAA256MAM-1K1 256GB C400 1.8“ (5mm) 3.3V 415 MB/s 260 MB/s
MTFDDAA512MAM-1K1 512GB C400 1.8“ (5mm) 3.3V 415 MB/s 260 MB/s
MTFDDAC064MAM-1J1 64GB C400v 2.5” (9.5mm) 5V 415 MB/s 95 MB/s
MTFDDAC128MAM-1J1 128GB C400 2.5“ (9.5mm) 5V 415 MB/s 175 MB/s
MTFDDAC256MAM-1K1 256GB C400 2.5” (9.5mm) 5V 415 MB/s 260 MB/s
MTFDDAC512MAM-1K1 512GB C400 2.5” (9.5mm) 5V 415 MB/s 260 MB/s
MTFDDAK064MAM-1J1 64GB C400v 2.5” (7mm) 5V 415 MB/s 95 MB/s
MTFDDAK128MAM-1J1 128GB C400 2.5” (7mm) 5V 415 MB/s 175 MB/s
MTFDDAK256MAM-1K1 256GB C400 2.5” (7mm) 5V 415 MB/s 260 MB/s
MTFDDAK512MAM-1K1 512GB C400 2.5” (7mm) 5V 415 MB/s 260 MB/s
12 For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal
Serial NOR Flash for Embedded ApplicationsHigh-performance serial Flash memory with maximum design flexibility for the most demanding applications
ADVANTAGES FOR NEW MULTI-I/O N25Q FAMILY:
Best Performance in the Market: Max clock 108 MHz in all conditions Quad I/O equivalent clock frequency up to 432 MHz 54MB read throughput Voltage: 3V and 1.8V supply voltageMulti I/O Support: Legacy x1, dual, and quad I/O Erase Capability: Uniform subsector (4KB) and uniform sector 64KB granularity
Enhanced Flexibility: Configurable number of dummy cycles Output buffer strength configurable Volatile and nonvolatile configurability Advanced Write Protections: UID preprogrammed in factory and 64-byte OTP area; user lockable, nonvolatile protection and permanent block lockProgram/Erase SuspendPackaging focus is on footprint compatibility, reliability, and time-to-marketAutomotive grade products qualified to +125ºC
APPLICATIONS:
Due to its diverse attributes, serial Flash memory has found its way into several embedded applications, from printers to graphic cards; gaming consoles to PC BIOS; DVD/Blu Ray writers and players to answering machines; as well as video recorders, routers, Bluetooth devices, and Wi-Fi modules. Applications that require speed can use serial Flash with quad I/O or XIP mode. Applications not requiring high performance can take advantage of the simplicity of a single I/O implementation. New applications using serial Flash memory include WiMAX devices, set-top-boxes, low-end cellular phones, and netbooks.
Scan barcode for more Micron Serial NOR Flash Memory information
Micron offers the industry’s most comprehensive portfolio of serial NOR Flash memory, delivering a flexible spectrum of performance features and a broad density range to deliver long-term architectural continuity for embedded designs.
Micron serial Flash delivers flexibility and scalability with standard interfaces, enriched features, and backward compatibility to simplify your design and help you get to market quickly. What’s more, it's a product line that offers longevity and reliability.
Five serial NOR Flash lines are offered—the N25Q, M25P, M25PX , M25PE, and M45PE—to provide a complete choice of densities, feature sets, and packaging options. With its broad portfolio and multiple subsector erase options, Micron’s serial NOR Flash meets the requirements of many segments, including consumer electronics, handheld gaming, computing, networking, and enterprise applications. In addition, the N25Q, M25P, and M25PX families are AEC-Q100 qualified to meet the most exacting
requirements for automotive-grade and industrial applications.
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*2.7 –3.6V supported by all densities; 2.3–3.6V supported only for specific densities.
Product Family
Power Erasable Sectors Temp (°C)Density Range
Max Clock / Max Transfer
Rate Package Technology
N25Q2.7–3.6V; 1.7–2.0V
4KB Uniform, 64KB Uniform –40 to +85 32–256Mb108 MHz/ 54 MB/s
MLP, SO, TBGA 24 65nm
M25P 2.3–3.6V* 32KB or 64KB Uniform –40 to +85 512KB–16Mb50, 75 MHz/
6, 9 MB/sSO, MLP, TBGA 24 110nm, 150nm
M25PX 2.3–3.6V* 4KB Uniform, 64KB Uniform –40 to +85 8–16Mb75 MHz/19 MB/s
SO, MLP, TBGA 24 110nm
M25PE 2.3–3.6V* 256B, 4 KB, 64KB Uniform –40 to +85 1–16Mb75 MHz/9 MB/s
SO, MLP 110nm
M45PE 2.3–3.6V* 256B, 64KB Uniform –40 to +85 1–16Mb75 MHz/9 MB/s
SO, MLP 110nm
Dual Interface EEPROMM24LR64, 64-Kbit EEPROM with I²C and 13.56 MHz ISO 15693 RF interfaces
The innovative family of Dual Interface EEPROM provides new features
and capabilities. The EEPROM memory bank can be accessed either by a
standard I²C interface or by an ISO 15693 RF interface operating at 13.56
MHz. In addition, the family features a 32-bit password protection mechanism.
APPLICATIONS:
Two worlds connected
The ability to program or read a memory using either an RF or
a wired interface enables designers to imagine and develop
new functions and capabilities for their products. It is a good fit
for a wide range of applications including:
medical equipment
industrial equipment
factory and building automation
computers and peripherals
consumer electronics
DUAL INTERFACE EEPROM TOOLS Starter kit: RF-I²C enabled programmer with reference
antenna (order code: STARTKIT-M24LR-A)
Development kit: extensive tool for supporting product
integration (order code: DEVKIT-M24LR-A)
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Scan barcode for more ST Dual Interface EEPROM information
For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal
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Part NumberRF
InterfaceSerial
InterfaceMemory Size
(Kbit)
Clock Frequency
(kHz)Password
Supply Voltage (V)
Package
M24LR64-RMN6T/2 ISO 15693 I2C 64 400 Yes 1.8 to 5.5 SO8
M24LR64-RDW6T/2 ISO 15693 I2C 64 400 Yes 1.8 to 5.5 TSSOP8
M24LR64-RMB6T/2 ISO 15693 I2C 64 400 Yes 1.8 to 5.5 MLP2X3
FEATURES:
Industry standard interfaces:
I2C: 400 kHz, from 1.8 to 5.5 V
ISO 15693: 53 Kbit/s data rate, up to 1 m remote access range
64-Kbit EEPROM user memory
64-bit unique identifier
32-bit password protection
13.56 MHz carrier frequency
BENEFITS:
Most flexible solution for parameter updates
Passive RFID technology: no onboard power required to access the device in RF mode
High reliability EEPROM
Flexible password protection scheme
Simple and cost-effective implementation
Enabling new functions and capabilities for:
parameter update
firmware update
device calibration
product activation
traceability information management
asset tracking
identification
DEVICE SUMMARY:
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Nu Horizons offers a wide range of development / evaluation boards, tools and kits. For more information, please visit www.nuhorizons.com/development14
Programmable Power Controller, Configuration Board, and PowerArchitect ™ 3.0 Software
Everything You Need to Become an Expert Digital Power Designer!
Order Number Price
XRP7713EVB-DEMO-1-KIT $90
XRP7714EVB-DEMO-2P-KIT $90
Scan barcode for more Exar Programmable Power Development Kit information
Exar’s Programmable Power Development Kit affords the user a quick on-
ramp to finalizing digital power designs for a host of applications spanning
mobile to industrial to high-performance computing. The XRP7713 device
in the development kit is part of the PowerXR programmable power product
portfolio of highly configurable digital power step-down controllers that more
intelligently manage today’s power systems with up to four independent
digital-control loops while integrating an on-board standby power LDO. With
four 12-bit resolution digital pulse width modulators (DPWM) with integrated
gate drivers, the XRP7713 uses a digital PID control algorithm to perform
full digital loop control at switching frequencies up to 1.5MHz. These power
system controllers are fully addressable and configurable via an I²C interface
for monitoring, control and management of DC to DC pointof- load power
conversions.
These power ICs integrate the best of both worlds – the low cost and flexibility
of digital power management and control, and the robust power capabilities of
analog switching power supplies. PowerXR products will reduce development
time from weeks to hours enabling a significant time-to-market advantage.
Both PowerXR devices permit real-time power system adjustments during
design, in response to changing requirements or even after field-deployment.
Power Controller Features:
Three or Four switching buck (step-down) controllers with internal FETs
Output voltages programmable from 0.9V to 5.1V
Up to Six reconfigurable GPIO pins
Fully programmable via the I²C interface
Complete power monitoring and reporting
Benefits:
PowerXR integrate the best of both worlds – the low cost and flexibility of digital power management and control, and the robust power capabilities of analog switching power supplies.
Use of PowerXR devices reduce development time from weeks to hours enabling a significant time-to-market advantage.
PowerXR devices permit real-time power system adjustments during design, in response to changing requirements or even after field- deployment.
Applications:
Consumer: Set-top box, IP Cameras, Servers
Industrial – Medical Equipment
Medical Equipment
Networking and Telecommunications Equipment
Point-of-Sale
STM8L-DISCOVERYThe STM8L-DISCOVERY helps you to discover the STM8L ultralow power features
and to develop and share your applications. It is based on an STM8L152C6T6
and includes an ST-Link embedded debug tool interface, LCD (24 segments, 4
commons), LEDs and push buttons.
Features:
STM8L152C6T6 microcontroller, 32 KB Flash, 2 KB RAM, 1 KB EEPROM in 48-pin LQFP
On-board ST-Link with selection mode switch to use the kit as a stand- alone ST-Link (with SWIM connector for programming and debugging)
Two red LEDs; LD1 for USB communication, LD2 for 3.3 V power on
Designed to be powered by USB or an external supply of 5 V or 3.3 V
Can supply target application with 5 V and 3 V
Two user LEDs, LD3 and LD4 (green and blue)
Two push buttons (User and Reset)
IDD current measurement
LCD 28-pin DIP (24 segments, 4 commons)
Extension header for all QFP48 I/Os for quick connection to prototyping board for easy probing
Nu Horizons offers a wide range of development / evaluation boards, tools and kits. For more information, please visit www.nuhorizons.com/development
Order Number Description Price
STM8L-DISCOVERY Discovery board for STM8L15x (32KB flash) MCUs $9.99
Scan barcode for more information regarding the STM8L-Discovery Kit
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Lattice Semiconductor Breakout Boards
Simple. Useful. Programmable.
The Lattice Breakout Boards are simple evaluation kits that allow the user to quickly
evaluate the capabilities of the POWR104A, LC4256ZE or LCMXO2280C devices.
Each board includes 8 LEDs which can be used for implementing simple counters
or similar functionality. With a majority of the I/O accessible to the user through
headers on the board, it is possible for a user to interface the Breakout Board with
a current design or even other evaluation boards. Programming is achieved through
the USB interface, and a USB cable is provided so users can begin working with the
boards right away. A quick start guide is also included with each Breakout Board to
shorten the learning curve.
Order Number Description Price
POWR1014A-B-EVN POWR 1014A Breakout Board $29.99
LC4256ZE-B-EVN ispMACH4000ZE Breakout Board $29.99
LCMXO2280C-B-EVN MachXO Breakout Board $29.99
Scan barcode for more Breakout Boardsinformation
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Gennum’s 3rd Generation Video Optical Modules (VOMs)
For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal16
The continued transition to HDTV within the professional broadcast industry, the advent of
1080p50/60 production, D-Cinema production and higher resolution / bit depth formats, are all
factors driving the widespread adoption and build out of 3G SDI capable broadcast infrastructure.
As this build out continues, broadcasters are increasingly looking to optical fiber interfaces for the
carriage and distribution of 3G SDI signaling within the plant. At these higher data rates, fiber optic
systems provide a number of advantages (to coax cabling), especially for long links. Optical fiber
installations also promise smaller and lighter trunking and in large installations on green-field sites,
the cost of installing a fiber infrastructure can be less than an equivalent coax cable installation.
Gennum’s video optical modules are engineered to provide industry leading optical performance
and robustness for mission-critical broadcast applications. The recently released second generation
offering extends Gennum’s leadership by providing new receiver technology with unmatched
overload, sensitivity and signal integrity.
Ro bust Performance
Not all optical modules are created equal. Gennum’s optical modules are built upon Gennum’s
excellence in both SDI and optical technology. Incorporating custom receiver silicon, Gennum
modules feature an exceptional dynamic range ensuring maximum interoperability with SMPTE297
compliant transmitters. Additionally, Gennum’s modules provide robust performance across all
operating conditions thereby ensuring a highly reliable optical link.
THIRD GENERATION PRODUCTS FEATURES:
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BENEFITS:
Robust performance across all operating conditions thereby ensuring a highly reliable optical link
Optimized for short reach optical applications and offer design improvement and enhanced functionality
Exceptional optical performance with pathological data:
Receiver overload: 0dBm
Best in class Receiver sensitivity: -23dBm
Digital diagnostic interface for monitoring and control of module
User writable EEPROM where equipment manufacturers can program their own information within the SFP to enable their equipment to identify qualified modules
SMPTE 297 compatible
Small Form Pluggable (SFP) package saves board space requirements
SFPs offer an improved mechanical design with a superior latching and delatching mechanism
Pin-out designed so that one slot can be populated with a dual transmitter, dual receiver, single transmitter, single receiver, or a transceiver
Both video and datacom pinout variants are available for all VOM products. This allows network equipment manufacturers to add optical SDI interfaces to any existing products that were designed per the SFP MSA pinout rather than the defacto standard Video SFP pinout.
Telecordia GR-468-CORE compliant
APPLICATIONS:
3G-SDI End Applications
Any professional video broadcast SMPTE compatible optical-to-electrical interfaces
High density video routers
Professional video cameras and monitors
17For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal
Scan barcode for more information regarding Gennum's Video Optical Modules
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For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal18
Micrel’s Low-power, Highly Integrated, 4/5-port Layer-2 Switch-on-a-Chip ICsThe KSZ8895/8864 product family achieves a 50 percent reduction in power consumption compared to the previous generation.
Micrel’s KSZ8895/8864 family are low-power, highly integrated, 4/5-port Layer-2 switch-on-a-chip ICs. Leveraging Micrel’s latest green physical transceiver and switch technology, the product family achieves a 50 percent reduction in power consumption compared to the previous generation. Meeting the increasing demands for Ethernet connectivity in consumer and industrial applications, the family features advanced power management and sophisticated Quality of Service (QoS) capabilities.
QoS features such as tag and port-based VLAN support and IPv6 priority classification make these devices ideal for today's most demanding IP content based applications in the digital home; IPTV, IP-STB (set top box), VoIP (voice over IP), residential gateways and GPON. The low emissions and Micrel's signature high reliability and quality also make these devices suitable for connectivity applications in the fast growing industrial automation and automotive markets.
APPLICATIONS:
Digital TV / IP-STB
VoIP Gateway
Industrial Ethernet
Industrial Control
Broadband Gateway/router
GPON ONU
AutomotiveScan barcode for more KSZ8895/8864 family information
FEATURES: BENEFITS:
Fully-compliant to IEEE 802.3/802.3u Standard Standard compliance ensures to work with other standard compliant, already deployed devices.
Single 3.3v supply with internal 1.2V LDO controller, and optional 3.3V, 2.5V or 1.8V VDDIO
Enables low-power design and offers flexibility in design.
Integration of termination resistors on the chip On-chip termination (eliminating 4 external resistors/transceiver) not only simplifies PCB design and reduces system BOM, but also improves overall signal integrity and EMI emission.
Energy Detect Power Down when the cable is not plugged; and power down/ slow oscillator mode when the device is not in use
Power consumption is optimized based on the status of the link or the device.
Rapid spanning tree (RSTP) support Provides faster spanning tree convergence after network topology change (<6 sec vs. 30-50 sec for STP).
2K Byte maximum packet size Improves the efficiency of bulk data transfer, and system performance
Internally generated 50Hz RMII reference clock The use of 25MHz crystal as input reference clock no longer eliminates the need for external oscillator. It reduces the system BOM in the RMII mode.
HP Auto MDI/MDIX crossover support Auto-MDI/MDIX eliminates the need for cross-over cable, thus reduces installation costs. Easy to use.
FEATURES & BENEFITS:
NetDetach technology allows the CPU to enter a low-power state when Ethernet is inactive
UniClock technology utilizes a single 25MHz crystal, reducing BOM component count and cost
Multiple Operating Systems are supported, including: Windows 7, Windows XP, Windows Vista®, Windows CE, PXE, DOS ODI, Mac and Linux – enabling support for a wide variety of applications
PME pin wake-up support reduces system power requirements
Supports TCP segmentation offload and full hardware TxRx check–sum offloads (IPV4, IPV6, TCP, UDP), reducing CPU loading
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Scan barcode for more LAN7500 information
Hi-Speed USB 2.0 to 10/100/1000 Gigabit Ethernet ControllerSMSC Introduces the LAN7500
SMSC’s LAN7500 is a Hi-Speed USB 2.0 to 10/100/1000 Gigabit Ethernet controller providing a high-performance and cost-effective USB to Ethernet connectivity solution. The LAN7500 contains an integrated 10/100/1000 Gigabit Ethernet PHY, USB PHY, Hi-Speed USB 2.0 device controller, 10/100/1000 Gigabit Ethernet MAC, TAP controller, EEPROM controller and a FIFO controller with a total of 32KB internal packet buffering. The device supports 10BASE-T, 100BASE-TX and 1000BASE-T Ethernet and implements Control, Interrupt, Bulk-in and Bulk-out USB endpoints. The Ethernet controller supports auto-negotiation, auto-polarity correction, HP Auto-MDIX* support and is compliant with IEEE 802.3/802.3u/802.3ab standards.
USB-based networking provides flexibility for the routing and placement of network connections anywhere in the system. USB-based solutions leverage the existing USB stack for the Ethernet driver. The LAN7500 is also available with a wide range of drivers including Windows®, Mac® and Linux®.
The LAN7500 also offers SMSC’s NetDetach™ and UniClock™ technologies. NetDetach allows for up to a 25% reduction in power by enabling the host CPU to enter a low-power state when Ethernet is inactive. UniClock simplifies the clocking scheme and reduces system BOM cost by using a single 25MHz crystal for both USB and Ethernet connectivity. Multiple power management features are provided, including various low-power modes and Magic Packet™, Wake-on LAN (WOL) and Link Status Change wake events. These wake events can be programmed to initiate a USB remote wakeup. The device is available in commercial (0º to 70ºC) and industrial temperature range (-40º to 85ºC) options.
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APPLICATIONS:
Embedded Systems
Consumer Electronics Devices
Netbooks/Smartbooks/MIDs
Docking Stations
Digital TVs (DTVs)
Set-top Boxes
Personal Video Recorders (PVRs)
Network Printers
USB Port Replicators
Stand-alone USB to Ethernet Dongles
Industrial Designs
HIGHLIGHTS:
Single-chip, Hi-Speed USB 2.0 to 10/100/1000 Gigabit Ethernet controller
Implements NetDetach technology for reduced system power consumption
Supports EEPROM-less operation for reduced BOM costs
Requires only a single 25MHz crystal
Easy upgrade for USB-based 10/100 Ethernet (LAN9500/9500A) to 10/100/1000 Gigabit Ethernet
Supports IEEE 802.3/802.3u/802.3ab standards
Industrial temperature range option available (LAN7500i)
8x8mm, 56-pin QFN, lead-free RoHS-compliant package
*HP Auto-MDIX eliminates the need for special “crossover” cables when connecting LAN devices together.
**LANCheck and USBCheck online design review services require an SMSC e-Services account and are subject to the terms and conditions listed on SMSC’s website.
LAN7500 BLOCK DIAGRAM:
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For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal20
High Precision 24-bit ADC for Weight Scales and Precision Measurement Markets– NAU7801 / NAU7802The NAU780X is a high-performance, cost-effective, low-power 24-bit sigma-delta ADC designed specifically for Weight Scales, Industrial Process Control, Strain Gauges, Data Acquisition, Portable Instrumentation and Fluid/Gas Analyzers.
The NAU780X is a high-performance, cost-effective, low-power 24-bit sigma-delta ADC designed specifically for Weight Scales, Industrial Process Control, Strain Gauges, Data Acquisition, Portable Instrumentation and Fluid/Gas Analyzers. It delivers exceptional flexibility in performance and optimization of power consumption, while providing designers with development and test tools that can dramatically accelerate time to market. With the on-chip LDO and less external components, NAU780X can greatly reduce the BOM cost and PCB complexity.
The Nuvoton NAU780X is a precision low-power 24-bit ADC, with an onboard low-noise programmable gain amplifier (PGA), onboard RC or Crystal oscillator, and a precision 24-bit sigma-delta analog to digital converter (ADC)
capable of up to 23-bit ENOB (Effective Number Of Bits) performance. This device provides a complete front-end solution for bridge/sensor measurement such as in weigh scales, strain gauges, and many other high resolution, low sample rate applications.
The many built-in features enable high performance applications with very low external parts count. NAU780X includes low drop-out regulator and high precision oscillator. Moreover, this device provides a standard 2-wire interface compatible with I2C protocol for simple and straightforward connection to and interoperation with a wide range of possible host processors. Also, NAU780X reserves hardware space for the on-chip calibration registers and algorithm so as to ease the software calculation burden and time.
The Programmable Gain Amplifier (PGA) provides selectable gains from 1 to 128, depending on the usage of different applications. The A/D conversion is performed with a Sigma-Delta modulator and programmable FIR filter that provides a simultaneous 50Hz and 60Hz notch filter to effectively improve interference immunity.
The NAU780X’s powerful development platform and simple graphical user interface development tools enable designers to efficiently generate new designs, giving them interactive programmability and predefined configuration paths for test and development and shorten the time to market.
FEATURES:
2.7 ~ 5.5Vdc operation, and 16-pin (NAU7802) or 8-pin (NAU7801) SOP package versions Dual differential input pair inputs and built-in temperature measurement Built-in reference voltage supply and internal oscillator Less than 1uA standby current
BENEFITS:
Low external parts count for low BOM cost Available in small package, minimal impact to PCB size Add-On Features: Internal LDO regulator Integrated Oscillator Integrated Temperature Sensor
APPLICATIONS:
Consumer Weigh scales Temperature measurement
Medical Glucose & blood pressure meters
Industrial Sensor measurement
Scan barcode for more NAU780X information
Part No. Write Capability Package Option Pricing
NAU7801 I2C, 2-Wire 8-SOP, 8-DIP <US$1.25 in quantities of 1000
NAU7802 I2C, 2-Wire 16-SOP, 16-DIP <US$1.50 in quantities of 1000
Control Signal
ADC result
1
0Internal RC Oscillator
24-bit ADC
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PGA
Temperature Sensor
Digital
Interface
OSCS
CRS[2:0]
PGA[1:0]
CHS
VBG XOUTAVDD XIN
SCLK
SDIO
DRDYVIN2P
VIN1P
VIN1N
VIN2N
AVSS REFP REFN DVSS
LDO
LDO
To serial InterfaceIO Power
2.7V~5.5V Input
digital logic
Bandgap Reference
VLDO [1:0]
DVDD
To Analog Circuit
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For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal
Industrial PLC Inverters Power meters Printers, scanners Industrial networking
Appliances Motor drive Application control Consumer PC peripherals, gaming Digital cameras, GPS platforms
Building and security Alarm systems Access control HVAC
Home audio
Medical High-end glucose meters Power meters Battery-operated applications
APPLICATIONS:
DEVICE SUMMARY: STM32F & STM32L
Scan barcode for more STM32F-2 information
STM32 F-232-bit Flash microcontrollers, 120 MHz/150 DMIPS with ART Accelerator™ and advanced peripherals.
The STM32F is the foundation of the STM32 family. The STM32F family of 32-bit Flash microcontrollers is based on the breakthrough ARM Cortex™-M3 core, specifically developed for embedded applications. They combine high performance with first-class peripherals and low-power, low-voltage operation. They offer the maximum integration at accessible prices with a simple architecture and easy-to-use tools.
With five lines, the STM32F1xx series provides perfectly balanced products for a wide range of applications in the industrial, medical and consumer markets. The following five lines are pin-to-pin, peripherals and software compatible:
Value line STM32F100xx - 24 MHz CPU with motor control and CEC functions
Access line STM32F101xx - 36 MHz CPU, up to 1 Mbyte Flash
USB access line STM32F102xx - 48 MHz CPU with USB FS
Performance line STM32F103xx - 72 MHz, up to 1 Mbyte Flash with motor control, USB and CAN
Connectivity line STM32F105/107xx - 72 MHz CPU with Ethernet MAC, CAN and USB 2.0 OTG
The new leading-edge STM32F2xx series combines advanced 90nm process technology with the innovative adaptive real-time memory accelerator (ART accelerator™) and the multi-layer bus matrix. This series achieves 150 Dhrystone MIPS when executing code from Flash at 120MHz with 188 µA/MHz dynamic power consumption.
STM32 F-2 series: 120 MHz CPU with ART accelerator, 1 Mbyte Flash, Ethernet MAC, USB 2.0 HS OTG, camera interface, encryption
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For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal22
Lineage Power ® Barracuda™ Power Modules; DC-DC ConvertersLineage Power's new family of DOSA-based high efficiency bus converters offer lower cost digital power alternatives to semi-regulated and unregulated products in the market today.
Lineage Power, a GE Energy Company, has been providing high efficiency, reliable power to the communications industry for nearly 100 years based on our Bell Labs heritage. Today, we are introducing our Lineage Power® Barracuda™ family of digitally controlled, fully-regulated bus converters for DC-DC Intermediate Bus Architectures.
The cost-effective, high-efficiency Barracuda series delivers digital power communication and control in standards-based eighth-brick and quarter-brick DOSA footprints. Power design engineers can deploy the new Barracuda modules in existing power designs as DOSA-compliant, drop-in upgrades for unregulated and semi-regulated bus converters challenged by recent industry-wide intellectual property issues. As part of the Lineage Power Total Efficiency™ architecture, the new Barracuda modules deliver efficiency of 96 percent and are priced comparable to current semi-regulated bus converters to encourage rapid adoption in new and existing product designs.
The Barracuda QBVW series is a digitally controlled drop-in alternative for unregulated and semi-regulated bus converter products. The PMBus™ Rev.1.1-
compliant Barracuda QBDW series features built-in I2C digital communications to enable design engineers to leverage the benefits of both digital communication and control. Both members of the Barracuda family are designed to provide a 9.6-12 Vdc intermediate bus voltage after which multiple, low voltage rails are generated using additional Point of Load (POL) converters such as DLynx™. This architecture is designed to power silicon devices such as processors and memory devices on circuit boards using POL converters. Barracuda converters can also be utilized for other applications requiring a fully-regulated output voltage in distributed power architectures deployed in networking, Power over Ethernet (PoE), computing and data storage devices.
New synchronization features, active load sharing and differential remote sense are combined with a digital PMBus interface that supports a wide range of commands to both control and monitor the Barracuda modules with a full range of protections and warnings, digital on/off, trim, margin, power good, rise time adjustment, and input under voltage lockout.
For more information, please visit www.ge.com/lineagepower.
FEATURES & BENEFITS:
Delivers up to 33Vdc output current
Standards-based DOSA™ footprint
PMBus™ compliant digital configuration, communication & control
Wide input range of 36-75Vdc
High efficiency of 96%
Positive remote On/Off logic
Remote sense and output voltage trim
Fully regulated output voltage
Output over current/voltage protection
Constant switching frequency
ISO9001 and ISO14001 certified manufacturing facilities
APPLICATIONS:
Intermediate Bus Architecture
Wireless networks
Access and optical network equipment
ATCA applications
Telecom networks
Scan barcode for more information on Lineage's Barracuda Series
LTC2978 - Octal PMBus Power Supply Monitor and Controller with EEPROMThe LTC2978 provides numerous functions with on-the-fly adjustments that make it an ideal device for digital power control in a wide variety of automotive, medical and telecommunication applications.
The LTC®2978 is an octal, PMBus compliant power supply monitor, supervisor, sequencer and margin controller. PMBus functions include warning and fault OV/UV threshold pairs for eight output channels and one input channel. Programmable fault response allows the power supplies to be disabled with optional retry after a fault has been detected. PMBus reads allow eight output voltages and one input voltage to be monitored. In addition, odd numbered channels can substitute sense resistor voltage measurements for output voltage measurements. PMBus commands support
power supply sequencing and precision point-of-load voltage servo to one of three programmed values: margin high, margin low and nominal. A programmable watchdog timer monitors microprocessor activity for a stalled condition and resets the micro if necessary. The 1-wire synchronization bus supports power supply sequencing across multiple LTC2978 devices. User programmable parameters can be stored in EEPROM. Voltage supervisor, voltage monitor and temperature faults can also be logged to EEPROM.
FEATURES:
PMBus Compliant Interface and Command Set
Configuration EEPROM
Fault Logging to Internal EEPROM
Differential Input, 15-Bit ∆∑ ADC with Less Than ±0.25% of Total Unadjusted Error
Monitors Eight Output Channels and One Input Voltage
8-Channel Sequencer
Programmable Watchdog Timer
Eight UV/OV Voltage Supervisors
Eight 10-Bit Voltage-Buffered IDACs with Soft Connect
Linear, Voltage Servo Adjusts Supply Voltages by Ramping Voltage-Buffered IDAC Outputs Up/Down
Supports Multichannel Fault Management
On-Chip Digital Temperature Sensor
Available in 64-Pin 9mm × 9mm QFN Package
APPLICATIONS:
Computers
Network Servers
Scan barcode for moreinformation on LTC2978
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For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal
Octal Power Supply Controller with PMBus Interface
VPWR
VIN_EN
SDA
SCL
ALERTB
CONTROL0
WP
FAULTB00
SHARE_CLK
VIN_SNS
VDACP0
VSENSEP0
VDACM0
VSENSEM0
VOUT_EN0
PWRGD
WDI/RESETB
ASEL0
ASEL1
LTC2978*
PMBusINTERFACE
WRITE-PROTECT
TO/FROM OTHERLTC2978s
TO INTERMEDIATE BUS CONVERTER
ENABLE
4.5V < VIBUS < 15V
GND
TO µP RESETB INPUT
WATCHDOGTIMER INTERRUPT
*SOME DETAILS OMITTED FOR CLARITYONLY ONE OF EIGHT CHANNELS SHOWN
VIN
VOUT
R207.5k
R3041.2k
R1020k
2978 TA01
RUN/SSSGND
VFB
GND
LOAD
DIGITALLY MANAGED
POWERSUPPLY
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For more information, including pricing, availability, datasheets and samples (if available), please visit www.nuhorizons.com/portal24
LT3799 - Offline Isolated Flyback LED Controller with Active PFCThe LT3799 is optimized for LED applications requiring 4W to over 100W of LED power and also compatible with standard TRIAC in-wall dimmers.
The LT®3799 is an isolated flyback
controller with power factor correction
specifically designed for driving LEDs. The
controller operates using critical conduction
mode allowing the use of a small transformer.
Using a novel current sensing scheme, the
controller is able to deliver a well regulated
current to the secondary side without using an
opto-coupler. A strong gate driver is included
to drive an external high voltage MOSFET.
Utilizing an onboard multiplier, the LT3799
typically achieves power factors of 0.97. The
FAULT pin provides notification of open and
short LED conditions.
The LT3799 uses a micropower
hysteretic start-up to efficiently operate at
offline input voltages, with a third winding
to provide power to the part. An internal LDO
provides a well regulated supply for the part’s
internal circuitry and gate driver.
FEATURES:
Isolated PFC LED Driver with Minimum Number of External Components
TRIAC Dimmable
VIN and VOUT Limited Only by External Components
Active Power Factor Correction (Typical PFC > 0.97)
Low Harmonic Content
No Opto-Coupler Required
Accurate Regulated LED Current (±5% Typical)
Open LED and Shorted LED Protection
Thermally Enhanced 16-lead MSOP Package
APPLICATIONS:
Offline 4W to 100W+ LED Applications
High DC VIN LED Applications
Scan barcode for more LT3799 information
LED Current vs Input VoltageTRIAC Dimmable 20W LED Driver
3799 TA01a
20WLEDPOWER
VIN_SENSE
VIN DCM
FB
VREF
CTRL2
CTRL1
GATE
SENSE
VINTVCC
GND
LT3799
FAULTFAULT COMP+CT COMP–
560µF× 2
4.7pF10µF
2.2nF
4:1:1
0.1µF 0.1µF
20Ω
20Ω
0.05Ω
499k
499k 100k
100k
200Ω
6.34k 4.99k
100k
CTRL3
0.22µF90VTO 150V
AC 0.1µF
40.2k32.4k
16.2k100kNTC
100k
4.7µF
2k
1A
VIN (VAC)90
0.80
I LED
(A)
0.90
1.00
1.10
100 110 130120 140
1.20
0.85
0.95
1.05
1.15
150
3799 TA01b
Creating a Power Subsystem for Lattice XP2 FPGAs using Linear Technology Power Devices
Using a Micrel Ethernet PHY and a Lattice ECP3 FPGA to Create an Ethernet Subsystem
FPGAs now require extensive power subsystems to provide the variety of voltages and high-power required for parallel I/O banks, FPGA Core, and various clocking, delay and analog-like functions. Precise control of voltages, even in noisy environments and over wide current ranges can minimize a host of potential system problems. Using LTC power devices- regulators and/or power modules- is an excellent way to keep potential power problems away from your design. This application note provides a step-by-step guide for a design engineer who needs to quickly and efficiently create a Power subsystem using a LTC power products and a Lattice XP2 FPGA. It will review the LTC power devices and the Lattice XP2.
This combination of devices is excellent for a wide range of applications in the consumer, industrial, communications and networking industries.
For this example design we will target an LED display lighting application. The FPGA will be monitoring and controlling the flow of data to the LEDs used on a large display surface, similar to those used as highway, sports venues or other high-traffic high-visibility locations. The FPGA will be responsible for controlling the light output of the LEDs based on environmental conditions (temperature and ambient light), the age of the LEDs, and a variety of other factors to improve image quality and to save power. The FPGA will
require lots of IO capability, and a large number of general purpose logic elements. Some DSP and other simple arithmetic functions will be required for advanced light sensing features. Power is available from a low voltage, 12V DC supply source.
Linear Technology has a wide range of power products including discrete regulators and the new µModule DC/DC regulator LTM46XX Family of integrated regulators. These regulators are a good choice for I/O voltage requirements, which typically require lower current than device core voltages. High current applications can use the compact, high-current µModule DC/DC regulators.
Many modern applications use FPGAs to implement complex system level building blocks.
These building blocks can contain processors, DSPs, bus interface and even video and audio
functions. Getting high-speed data on and off the FPGA can be accomplished by using a standard
Ethernet interface and this leverages a wide range of established protocols, software platforms and
IP. FPGA’s usually requires an Ethernet Interface IP Core inside the FPGA and some external devices,
typically an Ethernet Physical (PHY) layer device and a connector.
As a target application example we will use a video inspection system used in an assembly
line application. This type of embedded video processor needs to fit into a very small form factor and
will monitor and control inspection of product produced by an assembly. Ethernet is being used to
communicate to the controller so that commands and data received by the controller can be relayed
to the central processing location. A large number of controllers will be distributed throughout the
factory at various stages of the manufacturing process. Because of the data transmission speed
required high-speed Ethernet is needed, but backwards compatibility to standard Ethernet is an
advantage. Significant DSP functionality is desired so that video images may be processed quickly
and any product quality issues spotted quickly.
Creating an Ethernet subsystem involves a variety of design considerations. This application
note provides a step-by-step guide for a designer who needs to quickly and efficiently create an
Ethernet subsystem using a Lattice ECP3 FPGA, and a Micrel Ethernet PHY.
Nu Horizons offers a wide range of development / evaluation boards, tools and kits. For more information, please visit www.nuhorizons.com/development 25
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Scan barcode to accessapplication note
Scan barcode to accessapplication note
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The PN-E Series High Performance Professional LCD MonitorsReliability, Versatility, Undeniable QualitySharp PN-E Series LCD monitors offer full 1080p resolution from analog and digital RGB as well as HD video. 24/7 rated and backed by a 3-year warranty. These displays are excellent for videoconferencing, meeting rooms, digital signage, and are available in four sizes (42”, 47”, 52”, 60”).
To learn more about these and other Sharp monitors, please visit http://www.sharppromonitors.com/
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T E C H N O L O G Y I N C .
Cable Solutions Quadrangle
Display Enhancement Solutions Landmark Nu Horizons Custom Solutions
Displays Emerging Display Technologies (EDT) HT Displays Optrex OSD Displays Sharp Tianma United Radiant Technology Corp. (URT)
Embedded Solutions / Single Board Computers Aaeon Axiom Tek Connect Tech Digi International IEI Technology Reach Technology
Inverters Applied Concepts ERG Microsemi Zippy
LCD Controller Solutions Amulet Technologies Digital View Digitron Estecom-USA Kordis Spectrah URT
LCD Monitors Axiom Tek Digitron Estecom-USA IEI Slimage
Open Frame/Panel PC Solutions Aaeon Axiom Tek Digitron Estecom-USA IEI Technology Nu Horizons Custom Solutions Slimage Spectrah
Touchscreens Hantouch Touch International
Active Enhancements: ■ Hi Bright Backlights: CCFL LED
Passive Enhancements: ■ Anti-ReflectiveAntiGlareGlass/Acrylic ■ EMI/RFIShielding ■ IR Blocking Film ■ Optical Bonding ■ PrivacyFilters ■ ProtectiveDisplayShields
Total Solutions: ■ DisplayKitVerification ■ Fully Enclosed LCD Monitors ■ Fully Enclosed LCD Systems (Panel PC’s) ■ LCD Testing and Screening ■ Medical ■ NEMA Rated Products ■ OpenFrameConfigurations ■ Rack and Panel Mount Assemblies
Touch Controllers: ■ Serial ■ USB
Touch Screen Integration: ■ Capacitive ■ SurfaceAcousticWave(SAW) ■ IR - Infrared Touch ■ ProjectedCapacitive-Extreme-Touch ■ Resistive-4/5/8Wire
Value-Add Capabilities: ■ Class 1,000 Clean Room for all LCD Enhancements ■ Display Inspection ■ NVIS Night Vision ■ Optical Glass Bonding ■ Touch Screen Integration
Display Technologies available from Nu Horizons
Semiconductor Technologies available from Nu Horizons
• Audio (DAC’s, ADC’s, Codec’s, SPDIF, Sample Rate Conv., DSP, USB) • Memory (EEPROM, DAC + EEPROM) • Networking (T1/E1/T3/E3 xcvr, PCM) • Sensors (Hall Effect Sensor, 3d Compass) • Video (NTSC/PAL Encoder/Decoder, A/V Switches, Video Gain Amp)
• Discrete (Transistors, FET arrays, Thyristors, Triacs) • Display (Vacuum – Fluorescent Display Drivers) • LED Drivers (Constant Current Drivers) • Motor Control (Brushless DC, Bi-Polar Stepper) • Power (Linear Regulators, Buck/Boost/Fly back DC- DC, Charge Pumps) • Sensors (Hall Effect)
• Analog (Data Conversion, Power Management) • Communications (Bluetooth, LIN, CAN, POTS, GPS, RF, Zigbee) • Memory (Flash, EEPROM, Modules) • Microcontrollers (8051, AVR, ARM7TDMI, ARM926EJ, Cortex M3) • Multimedia & Imaging (IR, Video) • Network Storage (Data Storage) • Programmable Logic (FPGA, SPLD/CPLD) • Sensors (Biometrics, RF, Smart Cards)
• Fiber Optic Devices (10G FP TOSA & MM PIN ROSA, OTDR FP Lasers, 2.5G DWDM DML, DFB TOSA & APD ROSA) • Optocouplers (Transistor Output, High Speed, Solid State Relays) • RF Modules (Zigbee) • RF Semiconductors (RFIC Switch, GaAs FET, GaAs PA, Si LD-MOSFET, CATV Hybrid, Si RFIC)
• Power and Battery Management (IGBT and MOSFET gate drivers) • Sensor and Imaging Arrays (Hall Effect Sensors) • Signal Conditioning (Solid State Relays, Optocouplers) • Telecom (Embedded Modem, MF Trunk signaling, DTMF)
• Imaging Solutions (Fax Modems, Fax and MFP System Solutions, Digital Photo Frames) • Audio (Speakers-on-a-Chip, PC HD-Audio, PC HD- Audio Modem Combo) • Video (MPEG Encoders/Codecs, Video Decoders, Demodulators, Surveillance / Security) • Dial-Up Access Modems (PC Dial-Up Modems, Embedded Dial-Up Modems)
• Wireless (Bluetooth modules, ZigBee modules, 802.11 modules)
• Device Server Modules • Embedded MCU / MPU (ARM7TDMI, ARM9926EJ) • Networking Modules (Wired/Wireless 802.3 / 802.11bg / 802.15.4)
• Data Converters (ADC, DAC) • Interface (PLB / PCI / I2C / SPI / USB UARTs, RS232/485/422 Transceivers) • Power (Buck/Boost Regulator’s, Charge Pumps, LDO’s, Supervisors, PWM, Programmable Power) • Storage (Data Reduction, Data Security) • Telecom (T1/E1/DS1/DS3/E3 LIU’s, Carrier ETH SONET/SDH Framers, Mappers & Aggregators)
(Fiber Optics Division) • Optical Components (WDM Management, 850nm VCSELs & Detectors, 1310nm Lasers & Detectors, CML Transmitters,WSS) • Optical Transceivers (GBIC, XFP, MSA300, SFP, SFP+) • Passive Optics (WDM networks)
• Audio (SerDes with Emebed/De-Embed) • Datacom (Cable & Backplane SerDes, Redrivers, Retimers, PCIe Bridges, Crosspoint Switches, TIAs, LAs, Transceivers) • Video (Equalizers, Cable Drivers, Reclockers, SerDes, Video Optical Modules, TIAs, LAs, Laser Drivers, Timing, Crosspoint Switches, Cable Extenders)
• Memory (QDR/DDR SRAM, Zero-Wait SRAM (NBT), Sync Burst SRAM, Specialty Sync-SRAM)
• Memory (DDR DRAM,SDRAM, EDO & FPO DRAM, E2PROM, PSRAM, SRAM, DDR II Synchronous SRAM, Asynchronous SRAM) • Smart Card (Two-Wire Serial EEPROM, Secure, MCU Based, ICs)
• Power (MOSFET, IGBT, Diodes, Thyristors, DC/DC, PWM Control, LED/Lamp/Display Drivers) • RF Power (FETs, Drivers, Amplifiers, Microwave modules, RF Modules) • Solar Devices (Solar Cells, Solar Bits, Solar Die, Solar Battery Chargers)
• Programmable Clock Devices (Clock Generation, Differential Clock Distribution, Universal Fanout & Zero Delay Buffer, Clock Synthesis, Low Jitter SERDES Clock) • Programmable Power Manager Devices (for Processors, DSPs & Board Level; Watchdog timer, Voltage Supervision, Reset Generation, Sequencing, Voltage Measurement, Trimming & Marginning) • Programmable Logic (Non-Volatile Flash FPGA, SRAM FPGA, SERDES, 8/32 Bit Soft Processor, Ultra-Low Power CPLD, SPLD)
• Power Supplies - High Voltage (1 to 5 W, 10 to 200 W, Custom) - Low Voltage (Modular, Desktop, Wallmount, Medical, Open-Frame, U-Frame, Enclosed, LED Lighting, Custom)
• AC-DC Power Supplies (800W - 4,000W) • DC-DC Converters - Industry Standard (1/16-Brick, 1/8-Brick, 1/4- Brick, 1/2-Brick, 1x1”, 2x1”) - Intermediate Bus Converters (1/8-Brick, 1/4- Brick) - PowerAmplifiers(1/2-Brick, Full Brick) • Power & Battery Management (Power Modules) • Power Systems Engineering Services
• Data Converters (Delta Sigma, SAR, Voltage DAC, Current DAC) • Frequency Control (Silicon Timing) • Interface (RS-232, 422/485, CAN PHY) • Power Management (Switching Regulators, Linear Regulators, DC/DC µModules, LED Drivers, Hot Swap, PoE) • Signal Conditioning (Amplifiers, Comparators, Filters, Voltage References, Thermal Couple Compensators) • Wireless / RF (I/Q Modulators – Demodulators, Up & Down Converting Mixers, IF Amplifiers, PA, RF Log Detectors, RF Power Detector)
• Data Communications (10/100/1G/10G Ethernet Switches, 10/100/1000/10G PHYs) • Embedded MCU / MPU (ARM V5TE, PXA StrongARM, PPC & MIPS Systems Controller) • Power Management (POLA) • Storage (FAS/SATA/PATA, SAS/Fiberchannel, Storage Processors) • Video (Format Converter) • Wireless / RF (802.11 Modules)
• Analog (Drivers / Voltage & uC Supervisors / Filters / Switches / Regulators) • Bus Device ICs (USB / PC / PCMCIA / SMBus) • Ethernet (10/100/1000 PHYs, Controllers, Switches) • Linear ICs (Active Filters / Comparators / Op Amps / References / Timers) • Power Management ICs (Battery, Display, Hot- Swap, PCI/PCIX/PCIE, High Side, LDOs, DDR) • Precision Edge ICs (Clock distribution, generation, synthesizers / Multiplexers, PLLs, buffers, CDRs) • RF (290 – 980 ISM band / ASK/FSK / 200kbps max data rate, RF Modules) • System Management ICs (Fan Control / Thermal Supervisor I2C)28
• DRAM (DDR3 SDRAM, DDR2 SDRAM, DDR SDRAM, SDRAM, RLDRAM, PSRAM) • DRAM Modules (FBDIMM, RDIMM, SODIMM, UDIMM) • Mobil DRAM (Mobil SDRAM, Mobil DDR SDRAM) • Multichip Packages (MobilDRAM & NAND Flash Combinations) • NAND Flash Memory (Managed NAND, High Speed NAND, Solid State Storage, Embedded USB)
(Formerly C&D Technologies) • AC/DC Power Supplies (200 – 2000 Watts, 2.5VDC to 48 VDC Out – PCI Modules) • Data Acquisition (Electronic Imaging, A/D Converters, D/A Converters, Sample/Hold Amplifier, Multiplexers) • DC/DC Converters (0.25 to 340 Watts, 0.02 to 80 Amps, 1.2 to 48 VDC Out; 3 to 75 VDC In) • Digital Panel Meters (Voltmeters, Wire Meters, Process Monitors, AC/DC Ammeters) • Magnetics (Inductors & Transformers, Differential common-mode filters, Databus Isolators)
• AC-DC Power Supplies (125W-375W, 3.3vdo to 56vdo, 90-264vao in, 3”, 3.3” x 5” format) • DC-DC Open Frame Power Supplies (125W, 160W, 3.3-48vdo 3” X 5” format) • Power Systems Engineering Services
• Wireless/RF (2.4G / 900M / 433M Transceiver, MCU based RF, Audio streaming)
• Communications (Voice & Audio CODECs, Pro-X SLICs, USB Audio Codec) • Logic ICs (I/O Controllers, ISA Bridge, Power Management, Hardware Monitors, Clock Generators, Power I/C, Card Reader IC’s, IEEE1394) • MPU (8-bit 80C51 based, 32-bit ARM7TDMI) • Power (ACPI Controller, PWM, DDR Bus Term, Power Switch) • Voice Solutions (Record & Playback ICs)
(RohmSemiconductoristheofficialsaleschannelforOkiSemiconductor products) • Audio (CODECs, DACs, Amplifiers ) • Display Drivers (LCD / VFD Driver / Controllers) • Embedded MCU / MPU (4-Bit NX 63K / ARM7TDMI / ARM946E / Biometrics) • Memory (P2ROM, DRAM ) • Speech (BGM Mixer - ADPCM & ADPCM2, Voice Synthesizers & Recorders, Audio Codec) • Telecom (ADPCM – Linear – PCMA-Law - VoIP Codec’s, Echo Cancellers, Transceivers) • Video (NTSC / PAL / SECAM Encoders – Decoders, NR-FIFO)
• Analog Image Sensor (NTSC/PAL) • Digital Image Sensor (CIF, VGA, 1.3M / 2.0M / 3.2M / 5.17M Pixel) • Image Processors
(Including SaRonix)
• Analog Switches (3-17V SPDT-SPST-DPST-MUX, Custom HDMI/DVI-PCI-USB-LAN) • Bridges (PCI, PCIX, PCI Express – 32/64Bit – 66/133MHz) • Clock ICs ( VCXOs, Buffers, Drivers, Generators, Skew Controllers) • Crystals & Oscillators (Quartz Crystal Resonators) • Digital Switches (2-Port, Bus, Crossbar, DDR, Mux/DeMux, Low Voltage Translator) • Interface (Re-Drivers, Buffers, Flip-Flops, Gates, Latches, Registers, Transceivers, Voltage Translators) • Logic (ALVC, FCT, LCX, LPT) • PCI Express Solutions (Packet/Signal Switches, Bridge, PHY, Signal Conditioning, Clock-Buffers/ Generators/Crystals) • Translators (Voltage, I/O Signal)
• Frequency Control (Oscillators, Crystals, VCXO, TCXO, OCXO, Sine Wave Oscillator)
• Communications (CAN, LIN, ZigBee) • Discrete (Diodes, Power MOSFETS, Thyristors, Triacs, Transistors) • Embedded MCU / MPU (8/16/32 Bit MCUs) • Logic (Standard – High/Low Voltage, Interface, Multi-Purpose) • Memory (Fast Flash, Low Power SRAM, EEPROM)
®
• Frequency Control (Oscillators, Optical Timing Clocks, Sine Wave Oscillator) • RF Components (SAW Resonators, SAW RF & IF Filters, RFIC Transceivers) • RF Modules (ZigBee, 802.15.4, UHF Mesh, FHSS ISM, Bluetooth, 802.11b) • Standalone RF modules (FHSS, 802.15.4, 802.11b, and Bluetooth)
• Power (High Reliability Transistors)
• Flat Panel Displays (LCD – 2” to 65”) • Memory (Flash – NOR) • Optoelectronics (LEDs, LED Modules, Laser Diode, Photocoupler, IrDA, photo interrupters, Emitters/ Detectors, Sensors) • Power (LDO / Switching Regulators, LED Drivers, Solid State Relays)
• Digital Video Processors • Storage Products (Serial ATA - Parallel ATA, Parallel ATA Controller, RAID Storage Processors, SATA Controllers, SATA Port Multipliers) • Video Transport (HDMI, DVI and iTMDS Products - Receivers, Transmitters, Switches, PHYs)
• Controllers (Flash Memory Card Controller, USB Flash Controller) • Embedded Graphics (128-bit 2D/3D mobile graphics engine, Mobile Graphics Coprocessor) • Mobile Communication (Mobile Satellite TV Tuner IC) • Multimedia SoC (MP3/WMA Digital Audio Player,
USB 2.0 Megapixal Image Controller)
• Advanced I/O Controllers (USB-ATA, Southbridge) • Data Communications (10/100 MAC/PHY Controller, 10/100PHY, Multimedia Processors, ArcNET, CircNET, USB Ethernet) • Environmental (Temperature Sensors, Fan Control) • USB Solutions (Card Reader, Flash Drive, Disk Drive, Hub, PHY)
• Power Management (AC/DC, Battery Management, DC/DC, LDO, MPU - Supervisor, PoE, VDC References, AC Switches) • Discretes (Thyristors, Diodes, FETs, Transistors) • Signal Conditioning (Comparators, Op-Amps, Clamp Diode Arrays, Crowbar Diodes, EMI Filtering) • Logic (3.3V, 5V, Translators, Gates, Switches, Port - Expansion) • Sensors (Accelerometers, Proximity, Thermal, Touch) • Interface (Smartcard) • Wireless (Bluetooth, ZigBee, GPS, RFID) • Audio (Decoders, Power Amps, Analog CPU, Digital CPU, Radio) • Image Sensor (Camera Modules, Imaging Signal Processor, CMOS Arrays) • Video (Demodulator, Decoders) • Motor Control (Controllers, Drivers, MCU’s) • Microcontrollers (8-bit, 16-bit, ARM7TDMI, ARM926E, Cortex M3)
• Optoelectronics (LED Drivers, EL Lamp Drivers) • Power (Switching, Automotive, PFC, Backlight, LDO, High Voltage Interface / Driver’s, PoE) • Transducers (Ultrasound)
• AC/DC Power Supplies (Industrial and Medical - 300W - 1500W) • DC/DC Converters - Industry Standard (1/8-Brick, 1/4-Brick, 1/2- Brick, Full Brick) - Non-Isolated Point of Load - Intermediate Bus Converters (1/8-Brick, 1/4- Brick, 1/2-Brick)
• Connectivity (FEC, Framers, Mappers, Switches, TSI) • Ethernet Switching (10/100/1G/10G PHYs and MACs, Switches and Transceivers) • Transport Processing (PMDs [Laser Drivers, TIAs, Post-Amplifiers], 10/100/1G/10G PHYs PHYs, Crosspoint Switches, and Signal Integrity Devices)
• Memory (SDRAM / DDR1, Pseudo SRAM, Serial Flash, Parallel Flash)
• Filters • Inductors • Isolators • Transformers (Modem, Analog/Voice Switching, DSL, Cable Modem, RJ45, PoE)
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ExarLinear TechnologyMicrelNuvoton
SMSCSTVitesse
SYSTEM MONITORING
Clock DistributionExarLatticeMicrelPericomST
Clock GenerationAKM SemiconductorExarLatticeLinear TechnologyMicrelPericom / SaRonixPletronicsRFM
Crystals, Oscillators, Drivers, Buffers, PLLs
TIMING
A/D AKM SemiconductorExarLinear TechnologyMurata Power SolutionsNuvotonST
D/AAKM SemiconductorLinear TechnologyMurata Power SolutionsST
CONVERTERS8-BitAtmelISSILattice (soft processor)NordicNuvotonOki/RohmRenesas ST
16-BitRenesasST
CENTRAL PROCESSOR
POWER & BATTERY MANAGEMENTBattery ManagementAllegro MicrosystemsLinear TechnologyMicrelST
DiscretesAllegro MicrosystemsIXYSMurata Power SolutionsRenesasSemicoaSTSupertexWurth Midcom
Hot SwapLatticeLinear TechnologyMicrelSupertex
Linear Regulators &ReferencesAllegro MicrosystemsAtmelExarLinear TechnologyMarvell (modules)MicrelOki/RohmSharp MicroelectronicsSTSupertex
Motor ControlAllegro MicrosystemsST
POELinear TechnologySTSupertex
Power ManagementExarIXYSLatticeLinear TechnologyMarvellMicrelMurata Power SolutionsST
Power Modules Lineage Power Linear TechnologyMarvellMurata Power SolutionsSynQor
SwitchingAllegro MicrosystemsExarLinear TechnologyMarvellMicrelOki/RohmSTSupertex
Allegro MicrosystemsAKM Semiconductor AtmelClareNuvoton Oki/Rohm
OmnivisionSharp MicroelectronicsSMSCST
SENSORS AND IMAGING ARRAYS
DiscretesST
DriversMicrelSTSupertex
AmplifiersLinear TechnologyMicrelST
IsolationCELClarePericomSharp MicroelectronicsST
ComparatorsLinear TechnologyMicrelST
FiltersLinear TechnologyMicrelST
SIGNAL CONDITIONING
POWER SUPPLIESAC-DC Low Power LHV PowerMurata Power SolutionsN2Power
Medium Power LHV Power Murata Power SolutionsN2PowerSynQor
High Power LHV Power Lineage Power
Front End LHV Power Lineage Power Murata Power Solutions
Medical LHV Power SynQor
Power Systems Engineering ServicesLineage Power Murata Power SolutionsN2PowerNu Horizons Value-Add
DC-DC Industrial Isolated / Industry Standard Bricks /Non-Isolated Point of LoadLHV Power Lineage PowerMurata Power SolutionsSynQor
Open FrameLHV Power N2Power
Board Level ModulesIntermediate Bus ConvertersLineage Power Murata Power SolutionsSynQor
Memory & Processor PowerMurata Power Solutions
InfraredSharp Microelectronics
LasersFinisar
LED DisplaysOptrexMurata Power Solutions
LED Arrays / ModulesSharp Microelectronics
LEDs / Laser DiodesSharp Microelectronics
Optical SystemsCELFinisar
OptoCouplersCELSharp Microelectronics
OPTOELECTRONICS
30
8-BitAtmelISSILattice (soft processor)NordicNuvotonOki/RohmRenesas ST
16-BitRenesasST
32-BitAtmelDigiLattice (soft processor)MarvellNuvotonOki/RohmRenesasST
CENTRAL PROCESSOR
ModemConexantST
VoIPMarvellNuvoton Oki/RohmRenesas
TransceiversClareExarFinisarGennumMarvellSTVitesse
TELECOMCentralOffice(CODECs, SLICs, DAA, xDSL)AtmelClareConexantExarNuvoton Oki/RohmRenesasSTVitesse
SwitchingExarVitesse
ISMAtmelLattice MicrelNordicRFMST
RFIDAtmelLattice ST
802.11 a/b/g/nConnectBlueDigiMarvellRFMSharpST
MicrowaveCELIXYSLattice
BluetoothConnectBlueRFM
ZigBeeAtmelCELConnectBlueOki/Rohm RenesasRFMST
Discretes (RF)AKM SemiconductorAtmelCELIXYSLTCMicrelRFMST
GPSAtmelST
WiMaxSharp Microelectronics
WIRELESS
ParallelLattice NuvotonPericom
Low Speed Serial (under 1 MB/sec) Exar Lattice Linear TechnologyMicrelOki/RohmRenesas SMSC ST
High Speed Serial(above 1 MB/sec) GennumLattice MarvellMicrelPericom Renesas SMSCST
Level TranslatorsAtmelLattice Linear TechnologyMicrelPericomST
BUS INTERFACE
DATACOMEthernet MACMarvellMicrelSMSC ST
WAN / TransportExarGennumMarvellVitesse
Ethernet SwitchingMarvellVitesse
USBRenesasSilicon MotionSMSC
OpticalConexantFinisarGennum
Non-VolatileEPROMAtmelOki/RohmST
E2PROMAKM SemiconductorAtmelISSIRenesasST
FlashAtmelISSIMicronRenesasSharp MicroelectronicsWinbond
Storage ControllersSilicon MotionSMSC
VolatileDRAMISSIMicronOki/RohmWinbond
SRAMAtmelGSI TechnologyISSIRenesasSharp MicroeletronicsSTWinbond
FIFOOki/Rohm
MEMORY
ASICAtmel
CPLDAtmelLattice
FPGAAtmelLattice
LOGICSPLDAtmelLattice
StandardMurata Power SolutionsPericomRenesasST
EthernetLatticeMarvellMicrelSMSCSTVitesse
Transformers / IsolatorsWurth Midcom
PHYSICAL LAYER
AKM SemiconductorConexantGennumLattice MarvellNuvoton
OkiOmnivisionSilicon ImageSilicon Motion ST
AUDIO / VIDEO
DISK / INTERFACESAS/SCSIMarvellVitesse
SATA/ATAAtmel Exar MarvellSilicon ImageSMSCVitesse
FibreChannelLattice MarvellVitesse
Solid StateMicronSilicon MotionSMSC
31
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