Multilayer circuit board

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Transcript of Multilayer circuit board

A method and apparatus for sput- tering with rotating magnet sput- ter sources.

PLATING SYSTEM U.S. Patent 5,830,334. Nov. 3, 1998 H. Kobayashi, Shizuoka-ken, Japan

A plat ing system comprising a nozzle moun t ing member dis- posed in a plat ing solution in a plat ing t ank and having a supply passage and a recovery passage; a recirculat ing pump disposed ou t s i de the p l a t i n g so lu t i on tank; a supply duct line connect- ing the supply passage and recir- culating pump; a recovery duct line connecting the recovery pas- sage and rec i rcu la t ing pump; and a nozzle for je t t ing the plat- ing solution toward a workpiece to be plated, said nozzle being adapted to provide the functions

both of je t t ing and suctioning the plat ing solution.

MULTILAYED CIRCUIT BOARD U.S. Patent 5,830,374. Nov. 3, 1998 C.M. Boyko et al., assignors to IBM Corp., Armonk, N.Y.

A method for producing a layer of a mul t i layer electronic circuit package comprising selecting a core mater ia l from one of three iron-nickel alloys; forming the core mater ia l into a panel suit- able for an i n t e n d e d appli- cation; c leaning the panel in preparat ion for plating; plat ing the panel with copper; subject- ing the p la ted panel to hea t t rea tment ; and circuitizing the panel for the intended applica- tion.

COATED TOOL U.S. Patent 5,830,531. Nov. 3, 1998 E. Bergmann, assignor to Balzers AG, Balzers, Liechtenstein

A method of t rea t ing a tool body having at least one area to be exposed to wear comprising coat- ing with at least one hard layer lying directly on the tool body, the coating step taking place in a vacuum process, and superim- posing on the hard layer, an ex- terior friction reducing layer us- ing physical vapor deposition in the vacuum process, the friction reducing layer being a mixture of metal carbide and carbon and be- ing formed to be free of any ha- lide, the grain size of the hard layer and the friction reducing layer being a l inea r average width of less than 1 txm, the fric- tion reducing layer also having a

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