Post on 10-May-2020
MEMS Manufacturing Consortia
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Barriers
• Most Micro-Electro-Mechanical Systems(MEMS) applications are low to mid-volume• Few applications have sufficient volume tojustify process development costs & the largecapital investment and burn run rate fordedicated fabrication infrastructure• Lack of standards requires development ofnew design rules for each new application
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• Develop a broadly enablingoptical MEMS manufacturingprocess
• Multiple applications fabricatedtogether on the same wafer
• Common design rules
• Common modeling tools
• Foundry model
Objectives
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MEMS Processing
Bishnu Gogci, Sensors Product Division, Motorola
Tronics
NMRC
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• Manufacturability (bulk vs. surface micromachining)
Materials properties (E, ν) (bulk +, surface -)
Optical (λ/20, r, t) (bulk +, surface -)
Design Freedom (bulk -, surface +)
• Integration of light sources
Si good for micro-electro-mechanical
GaAs good for light emission
Process Challenges
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• Implement a polysilicon surfacemicromachining process on top of a bulkmicromachined SOI wafer
• Use the single crystal silicon device layer ofthe SOI wafer for critical optical, electrical,and mechanical applications
• Use polysilicon layers for non-criticalapplications such as hinges and guides
• Use hybrid integration for active devices
Hybrid MEMS Process
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Hybrid MEMS Process
Bulk Micromachining Surface Micromachining
Hybrid Micromachining
SCS
Substrate
BOX
Poly1PSG 1
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Overcoming the Barriers• Developed a broadlyenabling, flexible hybridMEMS fabrication process
• Shared development &fabrication costs over multipleapplications
• Common design rules &modeling tools
• Foundry model at a not-for-profit
Infotonics Technology Centerwww.infotonics.org
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MEMS Adaptive Optics
Goal• MEMS AO offers potential for mirror arrays with
thousands of independently controlled actuators at a cost ofless than $1k per device rather than $1k per channel
Barriers• MEMS are expensive in the development stage
– 11 different development efforts• Current MEMS AO solutions are unique
– Only mass production will be able to bring down cost– Reaching mass production volumes will require aggregating
individual demand volumes– Aggregating individual demand volumes will require a common,
broadly enabling fabrication process
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TronicsSOI MicromachiningCEA LETI
MCNC/MUMPs, SandiaSurface Micromachining MUMPs,SUMMiT IV
AFRL/USAF/AFIT
JPLMembrane Transfer TechnologyJPL
Delft UniversityBulk Silicon MicromachiningOKO Technologies
NASA/JPLSurface ElectroformingMEMS Optical
Sandia?Bulk Silicon MicromachiningIntellite
Stanford/CISSOI wafer bondingStanford Microphotonics Laboratory(SML)
FairchildSUMMiT V Surface MicromachiningProcess
MEMX
NJNCSurface MicromachiningLucent
UC Berkeley/BSACSurface Micromachining/SOI bondedmirrors
Iris AO
MEMSCAPSurface Micromachining/SOI bondedmirrors
Boston Micromachines
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Fields of Use• Astronomy• Terrestrial Imaging• Vision Science• Biomedical Imaging• Laser-Based Communications• Industrial Lasers• Target Recognition & Tracking• Spatial Light Modulators (Displays, Projectors, Telecom)• Microelectronics (Photolithography, XUV)
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Overcoming the Barriers
• MEMS are expensive in the development stage– Work together in a "pre-competitive" development
stage (process, yield, packaging, reliability)
• Current MEMS AO solutions are unique– Aggregate individual demand volumes using a broadly
enabling fabrication process
– Cooperate in generating value
– Compete in dividing it up in the different fields of use
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Flip-Chip Bonding for AO
• Eliminate need for sacrificial oxide to define gap• Flexible gap size enables long stroke (>15 µm)
• Eliminate sacrificial etch (interactions/selectivity) and etchrelease holes (diffraction)
• Single crystal mirrors, arbitrary mirror thickness
• Straightforward path to high-yield integratedmicroelectronics (mature CMOS process, known good die)
• Enables re-work of defective units, tiling for large arrays
• Can fabricate all applications in the same process at thesame foundry to increase volume and decrease cost
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Iris AO
• (A) Mirrors are attached to asacrificial handle
• (B) Mirrors are aligned andbonded to the controlcircuitry using flip chipbonding
• (C) The sacrificial handlematerial is removed and themirrors are released
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CMOS Integration
Janusz Bryzek, Anthony Flannery,and David Skurnik, TransparentOptical
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Self-Aligning
Self-Aligned Assembly of Microlens Arrays with Micromirrors,Adisorn Tuantranont, Victor M. Bright, Wenge Zhang,Jianglong Zhang, and Y.C. Lee, SOIE 1999
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Complementors & Competitors:The Supply Side
A player is your complementor if it’s moreattractive for a supplier to provide resources toyou when it’s also supplying the other player thanwhen it’ supplying you alone
A player is your competitor if it’s less attractivefor a supplier to provide resources to you whenit’s also supplying the other player than when it’ssupplying you alone