MAS.961 Special Topics:How To Make Something That Makes

(almost) Anything

NanoFabrication

J. Jacobson – MIT – 02/17/09jacobson@media.mit.edu

Outline

• Optical Fabrication Technologies

• Probe/MEMS Fabrication Technologies

• Imprint Fabrication Technologies

• Particle Beam Fabrication Technologies

Immersion Lithography

22-nm immersion interference lithographyT. M. Bloomstein, M. F. Marchant, S. Deneault, D. E. Hardy, and M. Rothschild10 July 2006 / Vol. 14, No. 14 / OPTICS EXPRESS 6434Received 11 May 2006; revised 23 June 2006; accepted 23 June 2006

Immersion Lithography

(Air)

(Liq)

Stereolithography

Speed Resolution – Two Photon

Laser CVD

http://www.me.gatech.edu/Lackey/nsfgranteesjan02.pdf

Mechanism: Pyrolitic (Heating in absense of O2) Chemical Vapor Deposition (500 to 2000°C local temperature).Rates: Fiber growth rates > 2 mm/s,metals and ceramics.Linear growth rate of 200 mm/s Carbonvolumetric deposition rate of 50 mm3/s carbon.Materials: Cu, Au, Si, Al, W, C, WC, B, TiC, TiN, SiC, and Si3N4.

                      

             

www.optomec.com

LENS (Laser Engineered Net Shaping)

Outline

• Optical Fabrication Technologies

• Probe/MEMS Fabrication Technologies

• Imprint Fabrication Technologies

• Particle Beam Fabrication Technologies

Dip-Pen Nanolithography

Mirkin et. al.

Contact Mode Nanoparticle AFM

Hubert et.al.

Massively Parallel Dip-Pen Nanolithography with 55 000-Pen Two-Dimensional Arrays    

Chad A. Mirkin, et. al. 1 *Angewandte Chemie Volume 45, Issue 43, Pages 7220-7223

Massively Parallel Dip-Pen Nanolithography with 55 000-Pen Two-Dimensional Arrays   

http://mass.micro.uiuc.edu/research/current/nanolithography/2006-focus-intro/slide12.html

http://www.microfab.com/research_areas/electronics/electronics.htm#anchor250555

Solder Jet

25 micron resolution

Outline

• Optical Fabrication Technologies

• Probe/MEMS Fabrication Technologies

• Imprint Fabrication Technologies

• Particle Beam Fabrication Technologies

…Can we use this map as a guide towards future

directions in fabrication?

Semi-conductor Chip

High Speed Offset Web TFT DVD-6

Liquid Embossing

Design Rule Smallest Dimension (microns) 0.1 10 2 0.25 0.2Number of Types of Elements 8 6 8 2 4Area of SOA Artifact (Sq. Microns) 7.E+10 2.E+12 1.E+12 1.E+10 8.E+09Volume of SOA Artifact (Cubic Microns) 7.E+09 2.E+12 1.E+11 7.E+12 8.E+08Number of Elements in SOA Artifact 7.E+12 2.E+10 3.E+11 2.E+11 2.E+11Volume Per Element(Cubic Microns) 1.E-03 1.E+02 4.E-01 4.E+01 4.E-03Fabrication Time(seconds) 9.E+04 1.E-01 7.E+02 3 6.E+01Time Per Element (Seconds) 1.E-08 7.E-12 2.E-09 2.E-11 3.E-10Fabrication Cost for SOA Artifact($) 1.E+02 1.E-01 2.E+03 3.E-02 2.E-01Cost Per Element 2.E-11 6.E-12 6.E-09 2.E-13 1.E-12Complexity 2.E+13 4.E+10 6.E+11 1.E+11 3.E+11Complexity Per Unit Volume of SOA(um 3̂) 2.E+03 2.E-02 5.E+00 2.E-02 3.E+02Complexity Per Unit Time 2.E+08 3.E+11 9.E+08 4.E+10 5.E+09Yielded Res. Elements Per $ 1.E+11 3.E+11 3.E+08 4.E+12 1.E+12Cost Per Area 2.E-09 6.E-14 2.E-09 3.E-12 3.E-11

Cost Per Resolution ElementThe Case for Printed Electronics

Stephen Chou (Michigan/Princeton) et. al.

Imprint Lithography

http://www.molecularimprints.com/Technology/technology2.html

Step & Flash Lithography

Emerging Lithographic Technologies X, edited by Michael J. Lercel,Proc. of SPIE Vol. 6151, 61510J, (2006) · 0277-786X/06/$15 · doi: 10.1117/12.655604Proc. of SPIE Vol. 6151 61510J-1

MultiLayer Step and Flash Lithography

HP – Self Aligned Imprint Lithography - SAIL

Offset Liquid Embossing (OLE)

Bulthaup et. Al. APL 79(10): 1525 (2001)

Nanoparticle Inks

2 m 200 nm

Nanomoulding with Amorphous MetalsGolden Kumar, Hong X. Tang & Jan Schroers

Vol 457| 12 February 2009| doi:10.1038/nature07718

Outline

• Optical Fabrication Technologies

• Probe/MEMS Fabrication Technologies

• Imprint Fabrication Technologies

• Particle Beam Fabrication Technologies

FEI Corp.

Focused Ion Beam

Focused Ion Beam - Milling

Toshiaki Fujii, and Takashi Kaitohttp://www.siint.com/en/technology/ion_beam_applications_e.html

NanoLatheFIB

FabricatedStamps

FIB Fabricated MOSFET

FIB CVD Pt(gate electrode)

0 1 2 3 4 5

0.0

1.0x10-7

2.0x10-7

3.0x10-7

4.0x10-7

5.0x10-7

6.0x10-7

Id

Vd

-2Vg 0 Vg 2 Vg

Au contact pad

nanowirePt

Pt

Pt

SiO2

Focused Ion Beam - Writing

FIB Pt CVD

ARCAM.Com

E Beam Metal Melting

http://www.che.vt.edu/Wilkes/electrospinning/electrspinning.html

Electrospinning

https://www.uni-marburg.de/fb15/ag-wendorff/research/Electrospinning/fiber-hair

http://en.wikipedia.org/wiki/Electrospinning

1D and 2D Composites

Notes

http://www.2objet.com

Objet: Ink Jet + UV Cure

16 micron layers