Post on 26-Mar-2018
Page 2September 10
Infineons Automotive Excellence Program is your competitive advantage
Improvement Examples: Our target of ZD is your competitive advantage:
• no quality events• defect-free product launches• low non-conformance costs• highest quality image in your market • more business due to satisfied customers
Goals:•Sustainable quality improvement•Zero Defect Culture
Measurables:•Decrease of number of customerreturns and quality spills•Increase of customer satisfaction
Our quality is clearly seen as industry benchmark by almost all of our customers
Zero Defect
Infineon established the Automotive Excellence Program in 2003
Advanced Process Control
Excellent Requirement Management
0.23
0.95 Product Quality(0km/Field)
PPM
03 04 05 06 07 08 09
Page 3Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Content
Motivation for “Zero Defect”
Excellence in Backend Production (examples)
Excellence in Front End Wafer Production (examples)
Our Zero Defect Culture
First Time Right in Product Development (examples)
Our Quality is industry benchmark
Infineon “Automotive Excellence Program”
Page 4Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Content
Motivation for “Zero Defect”
Excellence in Backend Production (examples)
Excellence in Front End Wafer Production (examples)
Our Zero Defect Culture
First Time Right in Product Development (examples)
Our Quality is industry benchmark
Infineon “Automotive Excellence Program”
Page 5Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Infineon established the Automotive Excellence Program from 2003
Living Automotive Excellence
• to create a competitive advantage through excellent quality
• to exceed your quality expectations
Too valuable to compromise
Page 6Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Zero Defect products to guarantee the highest safety possible
1ppm (1 defective part per million) is close to Zero Defect. Would 1ppm not be enough?
300ppm defect ECUs*
1 ppmcomponents
15,000 cars defect out of1,000,000 (1.5%)
CarECU*
300
Component
50
To guarantee highest safety, we need Zero Defect
*ECU: Electronic Control Unit
Page 7Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Customer Returns = FARs
failure cause of Airbag ECUs (0 km-
/Field)
up to 90% caused by supplier of
electronic components
(Semiconductor)
In the automotive industry
each failing device comes back
to the supplier as a
Customer Return
or
FAR
Failure Analysis Request
Page 8Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Why invest in Zero Defect Supply Chain ?
Devices in IFX fab
Reel label
Reel label
Plant 1
Plant 2
SV Ichon Korea
InfineonTier 1
SupplierOEM
End
customer
Failure analysis
Cost of Scrap
~ 50 k€
Cost of Scrap
Cost of Overtime
~100k€
e.g. 1 day linedown
Controlled shipping
~1000k€
e.g. recall of
10,000 cars
~10000 k€
Example : Cost Explosion in case of a supplier quality event
Failure analysis
~ 10 k€
Supplier
Page 9Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Motivation: Why zero defect?
Reliability in cars: A question of life or death!
Page 10Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Content
Motivation for “Zero Defect”
Excellence in Backend Production (examples)
Excellence in Front End Wafer Production (examples)
Our Zero Defect Culture
First Time Right in Product Development (examples)
Our Quality is industry benchmark
Infineon “Automotive Excellence Program”
Page 11Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Automotive SemiconductorsCommitment leads to success
Innovative product portfolio covering the complete control cycle:From sensing over computing to actuating
System expertise with broad application competence:Powertrain, Safety Management, Body & Convenience
Market leader in automotive semiconductors:No. 1 worldwide, No. 1 in Europe, No. 2 in USA,
Reliability through experience:High quality products and services for the automotive industry for 40 years
Automotive Excellence: Most comprehensive quality program in the industry
(Source: Strategy Analytics)
Page 12Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Quality and safety of electronics demands a well-balanced co-operation of all involved parties
Awareness
Quality Management System & Tools
Management
Products Production People Processes
Automotive Excellence
Automotive ExcellenceThe most comprehensive quality program in the industry
Page 13Copyright © Infineon Technologies 2006. All rights reserved. 13.09.2010 For internal use only
Automotive Excellence Program Setup Responsibility and Accountability in the Line Organization is key for a successful program
SponsorDr. Reinhard PlossJochen Hanebeck
Claus GeislerMichael Seitz
Program ManagerAlexander Müller
Steering CommiteeAutomotive Division Board and Operation
BoardProject Office: Dr. G. Mauckner (ATV) Dr. C. Zeller (Production)
Business Lines Production Support Functions
Body PowerT. Fitzek / K. Jauck
Standard PowerF. Schwertlein / L.A. Past
Assembly & Test CMOSW.T. GanCh. Chan
Assembly & Test PowerK.T. Ng
C.H. Yang
FrontendDr. H.D. LoeweDr. M. Polzer
Power Technology PlatformT. Gutheit
Powertrain Safety & ASICsA. Doll / W. Glawischnig
MicrocontrollerP. Schäfer / R. Petter
Sense & ControlS. Hofschen / Dr. I. Trapp
Advanced Technology Management
A. Rahm
Supply Chain ManagementS. WollenbergM. Stegherr
Sales & Marketing & Distr.A. Müller
OEM Business DevelopmentC. Preuschoff
Quality ManagementA. Müller
C. Zeller/G. Mauckner/ E. Palmeda
Cluster Zero Defect InitiativesA. Heitzer
Electric Drive TrainM. Muenzer / Dr. Eschbaumer
Page 14Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Automotive Excellence has goals and measureables
Measurables
• Decrease of number of customer returns (FARs) and quality spills
• Increase of customer satisfaction (feedback & ratings)
Goals
• Sustainable quality improvements by running projects and continuous improvement actions
• Growing towards a Zero-Defect Culture
Page 15Copyright © Infineon Technologies 2006. All rights reserved.
Our Zero Defect Policy
• Zero Defect is a strategic mindset
• Zero Defect is . . .
- embedded in our business processes, - driven by our people, and - stimulated by personal senior
management leadership
• Zero Defect mindset means ...
- No compromise on quality- No deviations from our commitments- Fast reaction on deviations - Excellence in Problem Solving –
no reoccurrences
We bring Zero Defect to Reality. Be part of it.
Page 16Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Project Management @ Automotive Excellence
• Dedicated project structure with representatives…- of all business lines, logistics, technology development and
sales of the Automotive Division - of all production units
• Almost 6 years, more than 200 Sub-Projects from all areas with an active participation of more than 1000 Employees
• Methodology: - a systematic structuring of the projects according to the „4P –approach“ into the 4 pillars „Products, Production, Processes,
People“ guarantees an holistic approach- Consequent project management for our activities- Review Meetings on working and management level - Program KPI Reviews
Page 17Copyright © Infineon Technologies 2006. All rights reserved.
Automotive Excellence Program Embracing all sites and lines worldwide
Relevant Production Sites
Frontend (FE): Regensburg, Villach, Kulim, Dresden Backend (BE): Regensburg, Singapore, Batam,
Malacca, Wuxi, Warstein
Relevant Automotive Business Lines
Microcontroller Powertrain Safety & Asics Sense & Control Electric Drive Train
Enablers
To establish and staff a dedicated AEX organization Consequent Project Management Regular Zero Defect review at sites / segments Quality Spill reviews
Standard Power Body Power
Page 18Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Requirement
Management
Examples of automotive quality measuresimplemented along the semiconductor value chain
SpecificationProduct
Development
Qualification
- Technology
(FE, BE)
- Product
Frontend Backend
Logistics
Electrical Test
Design for Quality
Design for Reliability
Design for Manufacturability
Design for Test
Enhanced
Simulation &
Character-
ization
Zero Defect
Culture
Forward &
Backward
Traceability
Design for
Testability,
Test coverage
Advanced
Process Control,
no rework
Intelligent
Outlier
Screening
(SBA, PAT, ..)
FMEA and
Risk
Management
Automotive Excellence
FMEA, Risk &
Deviation
Management
Success is enabled by cross functional approach
Customer
and
Supplier
Page 19Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Content
Motivation for “Zero Defect”
Excellence in Backend Production (examples)
Excellence in Front End Wafer Production (examples)
Our Zero Defect Culture
First Time Right in Product Development (examples)
Our Quality is industry benchmark
Infineon “Automotive Excellence Program”
Page 20Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Our Way to a Zero Defect CultureYour satisfaction has utmost importance
Zero DefectEvent Day
5S/Fuguai Program
Zero Defect Training
Zero DefectPoster
Campaign
Internal Audit
Quality Bonus
Full Management Commitment
ErrorProofing Zero
DefectCulture
Page 21Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
knowledge
quality awareness
Zero Defect Culture - Change of mind set isthe key enabler to achieve our goals
training
quality ability
motivation
quality engagement
personal
quality
ownership
Who is able to contribute to success will be proud of it
Living Zero
Defect
Source: IFX, AEP Consultant
Page 22Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
5th Birthday Automotive Excellence Program
Page 23Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Target:
Highest awareness of
all employees on quality and
and customers expectations
Actions:
Employee's training
Target group oriented infor-mation given by managers
Poster advertising
Article in employees magazine
Zero Defect exhibitions
Zero Defect as Key for our FutureMindset
Page 24Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Regensburg and Villach
Zero Defect Exhibitions at OPP FE
Page 25Copyright © Infineon Technologies 2006. All rights reserved. September 10 Confidential
FUGUAI BREAKDOWN BY CAUSES - Q1 (05/06)
0
10
20
30
40
50
Scra
tches o
n
m/c
cover
Sticker
sta
in
Magazin
e n
ot
sta
ndard
ized
Flo
or
panel
shaky
Str
ay d
ie
5S
Wro
ng
washin
g
schedule
Dirty
magazin
e
Mis
sin
g
sticker
Glu
e s
tain
Mark
er
sta
in
FUGUAI DESCRIPTION
0%
25%
50%
75%
100%
NU
MB
ER
OF
FU
GU
AIS
PE
RC
EN
TA
GE
FUGUAI BREAKDOWN BY CAUSES - Q1 (05/06)
0
10
20
30
40
50
Scra
tches o
n
m/c
cover
Sticker
sta
in
Magazin
e n
ot
sta
ndard
ized
Flo
or
panel
shaky
Str
ay d
ie
5S
Wro
ng
washin
g
schedule
Dirty
magazin
e
Mis
sin
g
sticker
Glu
e s
tain
Mark
er
sta
in
FUGUAI DESCRIPTION
0%
25%
50%
75%
100%
NU
MB
ER
OF
FU
GU
AIS
PE
RC
EN
TA
GE
FUGUAI BREAKDOWN BY CAUSES - Q1 (05/06)
0
10
20
30
40
50
Scra
tches o
n
m/c
cover
Sticker
sta
in
Magazin
e n
ot
sta
ndard
ized
Flo
or
panel
shaky
Str
ay d
ie
5S
Wro
ng
washin
g
schedule
Dirty
magazin
e
Mis
sin
g
sticker
Glu
e s
tain
Mark
er
sta
in
FUGUAI DESCRIPTION
0%
25%
50%
75%
100%
NU
MB
ER
OF
FU
GU
AIS
PE
RC
EN
TA
GE
M/C Process ProductivityFUGUAI TAG
Name:
Cell Name :
Date:
M/C #:
Location:
Abnormalities :
Corrective Action :
Resolved by :
Designation : OPR/UO/LA/SET-UP/TECH
* Delete where appropriate
Name/Shift/Date
No.___
Impact :
Together we shape the future
Shift :
PCDF raised (if Product Quality affected): Yes / No
If Yes, PCDF No. ________________
M/C Process ProductivityFUGUAI TAG
Name:
Cell Name :
Date:
M/C #:
Location:
Abnormalities :
Corrective Action :
Resolved by :
Designation : OPR/UO/LA/SET-UP/TECH
* Delete where appropriate
Name/Shift/Date
No.___
Impact :
Together we shape the future
Shift :
PCDF raised (if Product Quality affected): Yes / No
If Yes, PCDF No. ________________
Identify & Fix
abnormalityClassification of
abnormality
Process?
Equipment?
Productivity?
Tracking of
abnormalities
Man?
Method?
Material?
Machine?
Identify focus
areas
Analyze and
Identify root
cause
Eliminate root
causeHuman factor?
Poor design?
Incoming Material?
Handling Procedures?
Prevent future
occurrence of
abnormality
Abnormality Management SystemWe work to remove abnormality before it turns into defect
Not at standard condition
Different from the normal state
Any Difference in Sound, Color, feeling of
Touch, Smell, Speed
Abnormality = Fuguai
What is abnormality?
Page 26Copyright © Infineon Technologies 2006. All rights reserved. September 10 Confidential
Examples of Fuguai ……..
Wafer Colour Variation Water on the floor
Grounding Wire Not Secured Tower Light Faulty
Page 27Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Sustainable problem solving: No Reoccurrence
8D
flow
1D: Team
3D: Containment action
4D: Root cause analysis
6D: Implementation of corrective action
5D: Corrective action and verification
8D: Congratulate Team
2D: Problem verification
7D: Prevention
We follow the 8D (8 disciplines) systematics
We focus on 7.D: Permanent corrective actions and standardization
Systematic rollout of solutions to all relevant fabs and sites
Longterm follow-up of preventive actions within Automotive Excellence Program
Page 28Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Content
Motivation for “Zero Defect”
Excellence in Backend Production (examples)
Excellence in Front End Wafer Production (examples)
Our Zero Defect Culture
First Time Right in Product Development (examples)
Our Quality is industry benchmark
Infineon “Automotive Excellence Program”
Page 29Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Excellent requirement management to ensure perfect fit for customer‟s application
Data Sheet ProductChip Design Application
TLE 7259
Wake and BusComparator
Driver
Temp.-ProtectionCurrentLimit
OutputStage
Supply
TxD Input
ModeControl
Receiver
TOAEB03513_1.VSD
RxD1
Filter
6Bus
TxD4
EN2
INH87
VS
30 kW
Filter
30 kW
30 kWTimeout
3WK
GND5
5 V
An excellent data sheet is required to develop an excellent product that fits your application
Customer requirements
Page 30Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Motivation for Data Sheet ExcellenceExample of critical wording: Short Circuit Protection
„Fully protected“ : What does it mean ?
Customer Impression: „Indestructible“
But:
• Protection functions are not meant for repetitive operation
• Depending on conditions any device can be damaged
Page 31Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Data Sheet ExcellenceExample: New Short Circuit Specification
Improved Version
• Detailed description of Short Circuit protection feature
• Description of the Influence of inductance and resistance
• Showing the limits of the feature
Page 32Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Data Sheet Excellence TeamTasks
•Review existing Data Sheets•Create a guideline for writing Data Sheets•Update the AP Data Sheet Template•Define a release process for Data Sheets•Roll-Out of guideline and release process
The Data Sheet Excellence Team is:
• Tobias Otter (AIM AP M AE)
• Günter Schwarzberger (AIM AP M AE)
• Andreas Kiep (AIM AP M AE)
• Jürgen Kositza (AIM AP M AE)
• Gunther Krall (IFNA AI)
Page 33Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Data Sheet ExcellenceData Sheet Guideline Topics
• Absolute Maximum Ratings
• ESD Definition • Thermal Resistance • Operation Range• Short Circuit• Functional Description• Electrical Characteristics• Application Diagram• Legal terms
Page 34Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Only products with proof of design quality
Experiments
Customer Requirements
Generic verification, validation plan
almostautomatically
Data Sheet
Your advantage: Each of your requirements is reliably fulfilled
Stringent flow from requirements to simulation and lab measurement
Spec compliance due to full traceability and completeness of requirements
Reuse for simulation and lab verification
Automation in simulation/lab characterization and documentation
Page 35Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Our products are robust in automotive environment
A
C
B
D
Infineon OptiMOS™ 4 different competitors
No delamination even after 260°C preconditioning and 1000TC with robust package
(TC = Temperature cycles)
Total delamination already after 260°C preconditioning (red areas)
100% adhesion delaminationPackage
chip
Your advantage: High reliability in the field
Page 36Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Content
Motivation for “Zero Defect”
Excellence in Backend Production (examples)
Excellence in Front End Wafer Production (examples)
Our Zero Defect Culture
First Time Right in Product Development (examples)
Our Quality is industry benchmark
Infineon “Automotive Excellence Program”
Page 37Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Excellence in Production
• Examples of Automotive Excellence Projects
No rework
Advanced Process Control wafer fab
Advanced Process Control assembly
Via testchip and redundant vias
R2D2: Reliability Related Defect Density
Intelligent outlier screening
Page 38Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Due to our „No rework‟ principle we deliver first-time-right products
No Rework in Front End and Back End Production
A Zero Defect principle
Your advantage: You receive first-time right products
Wafer flow in production interrupted due to process instabilities and rework
Smooth and stable production flow without interruption
Our engineers focus on process stabilization
Page 39Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Excellence in Production
• Examples of Automotive Excellence Projects
No rework
Advanced Process Control wafer fab
Advanced Process Control assembly
Via testchip and redundant vias
R2D2: Reliability Related Defect Density
Intelligent outlier screening
Page 40Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Resist coating + exposure + develop
Etching metal
Resist strip
Deposition metal
SPC Statistical Process Control: Control Limits and Process Capability cpk
APC Advanced Process Control: Real-time monitoring of key process parameter
Equipment control: temperature, etching rate, deposition rate, contamination.....
Process control:
metal thickness
resist line width
metal line width
optical inspection
New
Standard
With Advanced Process Control we realize deviations before they affect the product
Page 41Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
APC = Equipment Integration + Fault Detection & Classification
FDC Stage
Status Description
0 NO USAGE PDA is not ready.
1 PDA AVAILABLE
PDA is ready and accepted based on specification.
2 KN SETUP Simple Keynumbers are set in Config
3 MONITORING Keynumbers are build in Config; Systematic usage of APC trend. (includes LFA)
4 OOCAP Systematic usage of APC Trend. Limits are set, reaction on violations during office hours. (EQ FMEA required)
5 MESSENGER Same as "4" additional MESSENGER is switched on.
6 AUTO STOP Same as "5" additional LH, INL and/or Tool Stop is switched on.
7 CONTINUOUS IMPROVE
MENT
Constant usage of FDC for continuous improvement, e.g. Cpk, yield, scrap. Automatic stop reactions are set on 100% of FMEA requested Keynumbers.
In principle available from T5Operatively available from T8
T1Specification agreed & Characterization done
T2 Tested in Simulation
T3 Tested with Equipment
T4 User Acceptance
T5 FDC tested and accepted
T6 Rollout to all tool instances
T7 Stability run
T8 Final acceptance
Tool Integration Milestones
Living FDC
no use
offline FDC use
online FDC fast reaction
DefinitionsDefinitions
Equipment Integration Fault Detection and Classification
PDA = Process Data Acquisition
Page 42Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Overall Appl Level by Month in RBG
6,56,56,46,36,36,16,05,95,85,74,13,1 3,3 3,6 3,6 3,6 3,7 4,5 4,8 5,3 5,5
6,5 6,6
0
1
2
3
4
5
6
7
8
JAN
/07
FEB/0
7
MAR/0
7
APR/0
7
MAY/0
7
JUN
/07
JUL/0
7
AU
G/0
7
SEP/0
7
OCT/0
7
NO
V/0
7
DEC/0
7
JAN
/08
FEB/0
8
MAR/0
8
APR/0
8
MAY/0
8
JUN
/08
JUL/0
8
AU
G/0
8
SEP/0
8
FDC Stage
Overall ShortTerm Target LongTerm Target Dynamic Target
Overall Appl Level by Month in VI
6,26,16,05,85,75,04,94,64,64,64,54,5 4,7 4,8 5,1 5,1 5,5 5,6 5,6 5,8 6,0
6,1 6,2
0
1
2
3
4
5
6
7
8
JAN
/07
FEB/0
7
MAR/0
7
APR/0
7
MAY/0
7
JUN
/07
JUL/0
7
AU
G/0
7
SEP/0
7
OCT/0
7
NO
V/0
7
DEC/0
7
JAN
/08
FEB/0
8
MAR/0
8
APR/0
8
MAY/0
8
JUN
/08
JUL/0
8
AU
G/0
8
SEP/0
8
FDC Stage
Overall ShortTerm Target LongTerm Target Dynamic Target
APC Road Map and Status Sept. 2008RBG + VIH
VIH
RBG
- Overall FDC stage slightly above target
-FDC stage on target-CR due to EI reasons (e.g. EI of ASM) and parameter availability from tool (eg. RCD Litho)
Quelle: K. Forster
Page 43Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Achievement: Weekly APC Violation Review MeetingPareto Analysis: Keynumbers with most violations
Detailed analysis and reporting:Top 3 work centers per Area =>
key numbers with according equipment/recipe, defined action, status and due date
weekly limit violation review meeting with key user / UPSrunning since March 2008
detailed analysis of single violations
WORKCENT EQUIPMENT BATCHID LIMITID FEATURENAME MSG_ACTIVEINHIBIT_ACTIVEHOLDLOT_ACTIVETOOLSTOP_ACTIVEDATUM
POLY_LAM_ALLIANCE ALLIAN4 247315 2866566 INT_EP_CHANC_ME_A_M 1 1 0 0 19.01.2008
POLY_LAM_ALLIANCE ALLIAN4 247315 2866813 INT_EP_CHANC_ME_A_M 1 1 0 0 19.01.2008
POLY_LAM_ALLIANCE ALLIAN4 247315 2867195 INT_EP_CHANC_ME_A_M 1 1 0 0 19.01.2008
POLY_LAM_ALLIANCE ALLIAN2 239801 2875261 INT_EP_CHANC_ME_A_M 1 1 1 1 23.01.2008
POLY_LAM_ALLIANCE ALLIAN2 239800 2876920 INT_EP_CHANC_ME_A_M 1 1 1 1 23.01.2008
POLY_LAM_ALLIANCE ALLIAN1 247312 2870171 INT_EP_CHANC_ME_A_M 1 1 0 0 21.01.2008
Page 44Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Result of APC:Continuous increase of process stability
* Target for green process steps < 100% as continuously new processes are implemented
84
,47
%
83
,42
%
82
,83
%
81
,31
%
80
,38
%
82
,01
%
84
,09
%
84
,95
%
83
,93
%
85
,88
%
86
,98
%
88
,14
%
89
,13
%
88
,92
%
89
,22
%
90
,24
%
90
,35
%
91
,64
%
92
,05
%
92
,40
%
92
,23
%
92
,58
%
92
,65
%
93
,01
%
93
,21
%
13
,14
%
13
,86
%
14
,39
%
15
,83
%
16
,38
%
15
,45
%
13
,60
%
13
,02
%
13
,89
%
12
,64
%
11
,60
%
10
,61
%
9,9
5%
10
,07
%
10
,00
%
9,0
6%
8,9
1%
7,6
3%
7,3
9%
6,8
8%
7,3
0%
6,7
2%
6,7
3%
6,2
5%
6,2
1%
2,39%2,72%2,78%2,86%3,25%2,54%2,31%2,04%2,18%1,48%1,42%1,25%0,92%1,01%0,79%0,70%0,74%0,73%0,56%0,72%0,47%0,71%0,62%0,74%0,58%
50%
55%
60%
65%
70%
75%
80%
85%
90%
95%
100%
Se
p 0
6
Ok
t 0
6
No
v 0
6
De
z 0
6
Ja
n 0
7
Fe
b 0
7
Mrz
07
Ap
r 0
7
Ma
i 0
7
Ju
n 0
7
Ju
l 0
7
Au
g 0
7
Se
p 0
7
Ok
t 0
7
No
v 0
7
De
z 0
7
Ja
n 0
8
Fe
b 0
8
Mrz
08
Ap
r 0
8
Ma
i 0
8
Ju
n 0
8
Ju
l 0
8
Au
g 0
8
Se
p 0
8
Cp
k f
ulf
illm
en
t [%
]
<1
1<=cpk<1,5
>=1,5
Kulim
Regensburg
Villach
Kulim
Regensburg
Villach
Perlach
Page 45Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Excellence in Production
• Examples of Automotive Excellence Projects
No rework
Advanced Process Control wafer fab
Advanced Process Control assembly
Via testchip and redundant vias
R2D2: Reliability Related Defect Density
Intelligent outlier screening
Page 46Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Process Steps Test Customer
AP
C
Weeks
Electrical
Results
Customer
Returns
Inline Control
SPC
Hours
Online
Time
Months
Process
APC (advanced Process Control) means we act on process deviations online, preventing deviations of the product
Page 47Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
We invent innovative methods to detect deviations in the assembly fabs
Wafer Sawing:Spindle speedCutting speedCutting force
Wire Bond:Bond ForceBond PowerTemperature
Moulding:SpeedPositionTemperatureTransfer Pressure
Trim&Form:Acoustic signals
Together with the tool vendors we develop sensors to measure tool parameters that are critical for the result of the process step.
Page 48Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Excellence in Production
• Examples of Automotive Excellence Projects
No rework
Advanced Process Control wafer fab
Advanced Process Control assembly
Via testchip and redundant vias
R2D2: Reliability Related Defect Density
Intelligent outlier screening
Page 49Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
With via testchip and via doubling for µCs we came close to Zero Defects for via-related fails
Metal x+1
Via x
Metal x
Via size: 200nm
Metal x+1
Via x
Metal x
Metal x+1
Via x
Metal x
Via size: 200nm
Silicon Substrate
Metal 1
Metal 2
Via
Co
nta
ct
Co
nt.
Polysilicon
On a typical C11 chip there may be more than 10 million vias
With our innovative via testchip and via doubling we reach a defect level for via related fails that is close to zero!
Page 50Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
What is via – doubling?
Metal 1
M 2
Via
1
M 2
Via
1
Metal 1
M 2
Via
1
M 2Via
1
Via
1
Automatic routine doubles vias, wherever possible
Page 51Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
R2D2 Test Chip – Overview C11FLA
Metal x+1
Via x
Metal x
Via size: 200nm
Metal x+1
Via x
Metal x
Metal x+1
Via x
Metal x
Via size: 200nm• 4blocks with
34 arrays(40% of area)
• other structures
• product
• 8 inch wafer• 68 chips• 12 wspw
• 512x512 vias per array
• Each via is addressable
• contact holes (CA)• all Via levels (till
VQ) connecting thin wires
• all Via levels connecting fat wires
• stacked Vias• misaligned Vias• design rule
variations• short Via chains
Concept– Measuring – Analysis Yield Improvement– Stressing – Measuring – Analysis Reliability Improvement
Overall:About 3.2 billion contacts/vias
Page 52Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Excellence in Production
• Examples of Automotive Excellence Projects
No rework
Advanced Process Control wafer fab
Advanced Process Control assembly
Via testchip and redundant vias
R2D2: Reliability Related Defect Density
Intelligent outlier screening
Page 53Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
R2D2: Reliability Related Defect Density
Focus not only on yield -, but on reliability related defects
0
0,5
1
1,5
2
2,5
3
02/0
3
03/0
4
04/0
5
05/0
6
06/0
7
07/0
8
08/0
9
09/1
0
10/1
1
11/1
2
An essential contributor to ppm reduction is the continuous reduction of defects with impact on reliability
The continuous down-ward trend of ppm rates is the result of numerous activities:
Detection of single defects
Pareto analysis
Root cause finding
Root cause elimination
One after the other…
Page 54Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Result of R2D2:
Continuous reduction of ppm rate
Jun 06 Jan 07 Jan 08N
anospra
y M
1,
M2
CM
P w
ate
r ri
nse
Veri
fication C
onta
ct
testc
hip
Passiv
ation R
PS c
lean,
CT s
cre
enin
g
Gasonic
s a
t CT
Rota
tion s
peed Z
OX C
MP,
gow
nin
g p
roc.
Meta
l depositio
n,
via
resis
t str
ip
Wate
r to
uch u
p o
xid
e C
MP
Avoid
ance o
f m
anual w
afe
r handling
Resis
t str
ip im
pro
v.
Shib
.
Scre
enin
g M
1,
M2 (
tem
p.)
HD
P im
pr.
dom
e c
ond.
& c
lean.
end p
oin
t
Via
scre
enin
g larg
e d
efe
cts
RCA Is
opro
panol supply
CM
P b
evel cle
an s
tart
FAR data : M. Schmalzbauer, based on SAP
Veri
fic.v
ia t
estc
hip
Carr
ier
cle
an C
O2
Roll o
ut
CM
P b
evel cle
an
RPS C
lean S
IOX 6
05
New
carr
ier
change c
oncept
Mara
ngoni dry
er
322,3
24
Page 55Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Excellence in Production
• Examples of Automotive Excellence Projects
No rework
Advanced Process Control wafer fab
Advanced Process Control assembly
Via testchip and redundant vias
R2D2: Reliability Related Defect Density
Intelligent outlier screening
Page 56Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Highest outgoing product quality by intelligent outlier screening
with Pattern Recognition
Single & stacked
X
"Normal"YieldLoss%
Yield Loss Pareto (per BIN, Test, etc.)
"Risk"
"Risk"
under SBA** controlX
*PAT: Part Average Testing; **SBA: Statistical Bin Analysis
Intelligent PAT* ScreeningX
Page 57Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
PATImplementation of PAT in automotive wafer fabs
Implementation level all: 88 %Implementation level suitable: 100 %
High Volume, Automotive (12,42,58)
0%
20%
40%
60%
80%
100%
0707 0108 0708 1008
0
50
100
150
200
250
300
350
PAT notimplemented
PAT implemented
# Basic Types
Page 58Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Content
Motivation for “Zero Defect”
Excellence in Backend Production (examples)
Excellence in Front End Wafer Production (examples)
Our Zero Defect Culture
First Time Right in Product Development (examples)
Our Quality is industry benchmark
Infineon “Automotive Excellence Program”
Page 59Copyright © Infineon Technologies 2006. All rights reserved. For internal use only10-09-13
Automotive Product Quality (0km + Field)
0
0,1
0,2
0,3
0,4
0,5
0,6
0,7
0,8
0,9
1
2003 2004 2005 2006 2007 2008 2009
Production Year
pp
m
0km Field
0.23 ppm
0.95 ppm
-76 %
Page 60Only for internal use Copyright © Infineon Technologies 2006. All rights reserved. ConfidentialSeptember 10
Confidential
Our customers appreciate our results
“Automotive Supplier of the Year 2009” and “Supplier Performance Award” for the Year 2008
“Hitachi Quality Award” for the year 2006 for achieving customer satisfaction
“Bosch Supplier Award” for the years 2005 and 2006
German “TOPIT Award” for the year 2008 for the Automotive Excellence Program
6 quality awards in 2004, 2006, 2007, 2008, 2009 and 2010 from Toyota’s Hirose plant.
„Honor Quality Award Toyota Hirose“ received in 2010 for zero defect quality for last four years.Infineon is the First non- Japanese company that received this honour in this highest level category.
Page 61Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Automotive Excellence is the differentiator for your business success
No Rework
Intelligent Outlier
Screening
Excellent Requirement Management
Product Robustness
Zero Defect culture
Page 62Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Infineon’s Automotive Excellence Program is your competitive advantage
Our Quality is clearly seen as industry benchmark by almost all of our automotive customers.
Our target of Zero Defect means for you: no quality events defect-free product launches automotive product quality of 0 defect parts per million low non-conformance costs highest quality image in your market more business due to satisfied customers.
Page 63Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
Never stop
thinking.
and finally …
Page 6413-Sep-10 Copyright © Infineon Technologies 2006. All rights reserved.
Please visit our Automotive Excellence Webside
Homepage Hyperlink:
Living Automotive Excellence – no compromise when it comes to quality - Infineon Technologies
E-Learning Hyperlink (Flash Player):
Infineon Technologies –Living Automotive Excellence
Page 65Only for internal use Copyright © Infineon Technologies 2006. All rights reserved.
"If there's a way to do something better,
I'll find it.“
Thomas Edison (1847-1931)