INTEGRATED CIRCUITSDr. Esam Yosry

Lec. #9

NPN

Tran

sisto

r Fa

brica

tion

Introduction

NPN Fabrication-Simple Flow

AMI Bipolar Transistor Process

Bipolar Fabrication –Masking Layers

Typical Bipolar Resistor Technology

Intro

duct

ion

(Chi

p Fa

brica

tion

Cycle

)

NPN Transistor (BJT) Fabrication Example

Emitter Base Collector

Bipolar Transistor

Bipo

lar T

rans

istor

Fa

brica

tion

– Sim

ple

AMI Bipolar Transistor Process

Oxide

P+substrate

P-Epi Layer

The beginning wafer is a P-epitaxial layerOn a P+ substrate that is oxidized.

AMI Bipolar Transistor Process

N-Tub Collector

Oxide

P-Epi Layer

N-Tub

Field Oxide

Collector

Field Oxide

Field Oxide

P-Epi Layer

N-Tub

Field Oxidation

AMI Bipolar Transistor Process

N-Tub

Field Oxide

P-base

Collector

Field Oxide

P-Epi Layer

P-Base Formation

P+

N-Tub

Field Oxide

P-base

Collector

Field Oxide

P-Epi Layer

P+ Contact Formation

AMI Bipolar Transistor Process

N+P+

N-Tub

Field Oxide

P-base

Collector

N+N+Field Oxide

P-Epi Layer

N+ Emitter and Collector Contact Formation

N+P+

N-Tub

Field Oxide

P-base

Collector

N+N+Field Oxide

P-Epi Layer

Oxide

Contact Apertures

Oxide

Bipolar Fabrication –Masking Layers

Mask No. Physical Layer AMI Name GDS Level No.1 N-type Well N_WELL 1

2 Field Oxide ACTIVE 33 P-type Base PBASE 24 P+ S-D Ion Implant P_PLUS_SELECT 115 N+ S-D Ion Implant N_PLUS_SELECT 126 Contact Openings CONTACT 147 First Metal METAL 1 158 Vias between Metal VIA 169 Second Metal METAL 2 1710 Bond Pad Openings GLASS 18

Typical Bipolar Resistor Technology

N-Tub

Field OxideP-base

Field Oxide

P-Epi Layer

P-Base Resistor Formation

N+P+ P+

Top view of The resistor

P+ N+

Thanks

Many thanks to Prof. Hany Fikry and Prof Wael Fikry for their useful materials that help me to prepare this presentation.