Post on 12-Jul-2015
SSI Zurich-EPoSS
Jean-Luc MATE
> 21-03-2012
Place – 29-09-11
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< 2
©EURIPIDES 2012
Summary• The Western Europe paradigm: Can More than Moore lead
to Production in Europe. The “high Tech - low cost” recipe.
• Industrial research on a cooperative basis lead to create a competitive value chain in Europe
• EURIPIDES can contribute to market smart systems innovation with its available funding budget in Europe
• EURIPIDES Success stories
• 2012 Graz Forum Rendez Vous
<« HighTech-LowCost », the cornerstone of European competitive manufacturing
Place – 29-09-11
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© EURIPIDES 2012
< 4
• Huge opportunity for high electronic content companies • Innovation in new products with enhanced features thanks
to more than Moore and advanced packaging and assembly • Target Costing driven innovation for affordable solutions• Successful innovation leads to profitable growth• Price to pay for a competitive more than Moore smart
system manufacturing in Europe is really affordable • Innovation is fun…and better together !
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“High Tech – Low Cost” benefits
Place – 29-09-11
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© EURIPIDES 2012
< 5
• Innovation in Manufacturing Process for Smart System
• “Low labor” content process for new integration technologies generate immediately very high level of quality mandatory by high performance domain
• Design the “High Tech- Low Cost” factory for large volume of different batches:
1 million pieces /year = 1 000 batches of 1 000 identical pieces
or 5 000 batches of 200 identical pieces
Manufacturing platform with integrated more than Moore technologies can process very large variety of Smart Systems
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“HighTech-LowCost” : the Western Europe Recipe
Place – 29-09-11
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© EURIPIDES 2012
< 6
Place – 29-09-11
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© EURIPIDES 2012
< 7
Place – 29-09-11
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© EURIPIDES 2012
< 8
• Our EUREKA cluster key words: innovation, collaboration, new products, new markets
• A large amount of research, knowledge, partners and success stories gained in FP6 and FP7.
There must be a huge amount of Smart System products and processes to really bring to the market!
Potentially EPosSS has a huge number of collaborative projects within EURIPIDES scope
Fertilizer is there in most countries with a lot of expectations
EPoSS members and their network should build on their successful FPx results, new EURIPIDES ones.
So, Let us DO it! Our cooperation has no limit
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Food for thoughts in cooperation
Place – 29-09-11
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© EURIPIDES 2012
< 9
• Power electronics – Packaging and Mechatronics integration : wide range of applications, huge market potential and green tech expectations for Europe in the lead technology position
• Printed electronics: Europe can apply flexible assembly and plastronics in their leading market
• Packaging still a key topic to differentiate in “HighTech-LowCost” for robustness, hot temperature and miniaturization.
Let us DO it!
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Food for thoughts – strategic technologies
< Call calendar
Place – 29-09-11
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© EURIPIDES 2012
< 11
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Food for thoughts
Spring 2012 call
•Full Project Proposal 2 May 2012
Autumn 2012 call
•Project Outline 10 September 2012•Full Project Proposal 15 November 2012
More flexibility in 2012
< Success stories
Place – 29-09-11
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< 13
©EURIPIDES 2012
CERAMJET: Inket printing technology in ceramic electronics
3,6 M€ R&DOne Sme (leader) , 4 Large Co, 1 University
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Ceramjet-Sme lead and success
• 3 M€ effective turnover
• 100% employment increase for Ceradrop
• New clients (top European aerospace institute)
• Knowledge for all partners
• A full European industrial branch in ink jet printing
Place – 29-09-11
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IQ FUEL: Integrated sensor to determine the quality of fuel
• 8,7 M€ R&D• 10 partners: 4 Large Co, 2 Sme’s, 4 research org.
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IQ Fuel – Clean power and greener cars
• A fully integrated program : • Technology screening • From the packaged MOEMS sensor to its integration and actual fuel identification. • Full value chain secured
• In 2012, functional samples of the sensor will be provided to customers
• A breakthrough in automotive sensing
< Graz Forum COWIN market place
Place – 29-09-11
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< 16EURIPIDES 2012 GRAZ FORUM | 13-15 JUNE 2012
Your Smart Systems “Rendez-vous” will focus on:
•Smart power technologies: high temperature interconnect, energy harvesting using semiconductors, high temperature substrates, … •Smart power applications: high current components, inverter modules, E-car and smart grids •Medical technology: bio compatible material and packaging, smart sensors, … •RFID applications: flexible substrates, ultra thin semiconductors, printed electronics